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The Usage of Focused Ion Beam(FIB) and Other Diagnostic Equipment to Reduce Cycle Time and Cost on System-on-Chip(SoC) D

The Usage of Focused Ion Beam(FIB) and Other Diagnostic Equipment to Reduce Cycle Time and Cost on System-on-Chip(SoC) Designs. Raymond Lee, Tongxin Lu and Patrick Wolpert FIB International, Inc. Santa Clara California USA. FIB Introduction. DUT. lens 2 (objective). octopole 2. octopole 1.

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The Usage of Focused Ion Beam(FIB) and Other Diagnostic Equipment to Reduce Cycle Time and Cost on System-on-Chip(SoC) D

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  1. The Usage of Focused Ion Beam(FIB) and Other Diagnostic Equipment to Reduce Cycle Time and Cost on System-on-Chip(SoC) Designs. Raymond Lee, Tongxin Lu and Patrick Wolpert FIB International, Inc. Santa Clara California USA

  2. FIB Introduction

  3. DUT lens 2 (objective) octopole 2 octopole 1 Faraday cup quadrupole 2 blanker aperture quadupole 1 lens 1 (condensor) extractor suppressor emitter Column Design

  4. Theory of Operation Die Process Chemistry Injector + + Ion Beam

  5. What is a Mill? • Ion Sputtering • Gas Enhanced Milling • Aspect Ratio • Beam Tail • Re-deposition • Acceleration Energy

  6. What is a Deposition? • Ion Induced Deposition • Possible Metals • Pt, W, Au, Mo, Al, Etc. • Possible Insulators- Sio2 • Over Spray • Resistance and Resistivity • Gas Nozzle

  7. Complex Repairs can be done

  8. CAD Navigation FIB Image with CAD Layout Overlay CAD Layout Graphic Superposition and local registration of top CAD layers to the FIB image corrects for stage errors and allows accurate location of invisible buried conductors.

  9. IC Repair Instruction set for repair site 1 Edit at repair site 1 Gray frame shows area in Figure 2. Note only M4 is visible.

  10. Probe Point with I-Dep Protection 6M device, probe-point to M2 I-Dep

  11. Probes in Chamber Applications Analog & Mixed Signal Probing Applications: DC levels and small AC can be captured Effect on Word line boost voltage proven with Analog m-Probes Delay achieved with FIB Modification

  12. Probes in Chamber Applications Probe radius < 0.2 micron Characterization Application: Multiple probes can be manipulated in a narrow field

  13. How to pick FIB location in order of importance • 1.        Use upper level metal instead of lower level metal. • 2.        Find the most open area for connection and cuts. • 3.        Layout the FIB using the shortest connection possible without overlapping any connections. • 4.        Keep connection routing as far apart as practical. • 5.        Provide detailed plot of the area of FIB work in software format if possible or at least in color printouts with alignment coordinates. • 6.        Keep modifications as simple as possible. (Remember the odds are working against you.)

  14. Sample Edit M O L N C A B D G H E J I K F P Q Vss Vdd

  15. Coordinates X Y X Y A 2134 4313 B 2139 4317 C 2143 4319 D 2015 2034 E 2016 2037 F 2018 2035 G 4042 2343 H 4043 2347 I 4044 2345 J 2016 2034 K 4043 2343 L 2145 4322 M 2145 4324 N 2129 4319 O 2129 4321 P 2084 1892 Q 3954 1883

  16. M L O C N B A E H F D J I G K P Q Not To Scale Sample Edit

  17. Layout Info

  18. Spare Gate Layout VSS VSS VSS Input

  19. VSS VSS VSS Input Spare Gate Layout

  20. Trade Offs • Accessibility versus Performance • Difficulty versus Time • Complexity versus Functionality • Yield versus Cost

  21. 0.25 um 0.5 um 5 um Figure A: Aspect Ratio 20:1 Aspect Ratio Calculation

  22. 5 um 5 um Figure B: Aspect Ratio 1:1 Aspect Ratio Calculation

  23. 5 um 5 um Figure C: Aspect Ratio 3:1 Aspect Ratio Calculation

  24. New Technical Challenges Copper, Low K, and Flipchip

  25. Copper Lines and Vias FIB image of copper vias SEM image of copper vias

  26. Metal Re-growth Effect Metal Exposure Metal Cut Metal Re-growth

  27. IR Optical Image Through Silicon

  28. Corner Alignment Point

  29. Exposure and Connection

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