1 / 10

3D MEMS Accelerometers for Building Applications

3D MEMS Accelerometers for Building Applications. Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010. Acceleration RF ID tag. 3D MEMS accelerometer. MEMS = Micro ElectroMechanical System. Accelerometers transduction mechanisms. Spring Mass System

gwhitlow
Download Presentation

3D MEMS Accelerometers for Building Applications

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 Company

  2. Acceleration RF ID tag 3D MEMS accelerometer MEMS = Micro ElectroMechanical System MEMScAP, France

  3. Accelerometers transduction mechanisms • Spring Mass System • Acceleration force causes a proof mass displacement • Displacement measurement system • Direct or indirect measurement • Indirect measurement methods: • Piezoelectric effect • Piezoresistive effect • Capacitive sensing • Vibration Beam Accelerometer (VBA) • Resonance frequency is dependent on the applied force • Driven oscillator at resonance frequency (closed loop) • High end applications Company

  4. Transduction principles • Piezoresistive effect • Capacitive sensing MEMScAP, France Piezoelectric effect

  5. MEMS Technologies • Surface micromachining • Hybrid integration MEMScAP, France Bulk micromachining

  6. Concept of 3D accelerometer • 3-axis sensitive mechanical structure • 3 independent structures on the same die Mounting of 3 1D accelerometers MEMScAP, France

  7. Selected concept ~ 4mm ~ 11mm Out of the wafer plane sensitivity In plane sensitivity MEMScAP, France 3 independent capacitive micromachined sensors on a single die

  8. Fabrication Wafer level packaging concept MEMScAP, France

  9. ASIC Read-out MEMS ASIC+MEMS Assembly Hybrid integration in a ceramic carrier MEMScAP, France

  10. Thank you for your attention MEMScAP, France

More Related