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DPR for KS-3 -- Development

DPR for KS-3 -- Development. Wistron Corporation Jeffrey FL Wang 0 8 / 07 200 6. DPR for KS-3 – Development Eng. Status. Development Schedule Spec. Overview WW Agency Approval Plan RoHS Compliant Plan New FRU/ CRU plan Supplier selection plan EC Release Plan

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DPR for KS-3 -- Development

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  1. DPR for KS-3-- Development Wistron Corporation Jeffrey FL Wang 08/07 2006

  2. DPR for KS-3 – Development Eng. Status • Development Schedule • Spec. Overview • WW Agency Approval Plan • RoHS Compliant Plan • New FRU/ CRU plan • Supplier selection plan • EC Release Plan • Quality Development Process

  3. 1. Development Schedule

  4. Development Schedule Notes: DV1/DV2/SIT/SVT planar assembly and box build at WKS. SOVP date depends on Merom for Santa Rosa processor launch date.

  5. 2. Specification Overview

  6. Kabuki / Sumo 3.0 Offering Definition June 26, 2006 Time: SOVP: 4/09/07 Announce & GA: 4/24/07 Ship Support: 4/23/07

  7. System Building Blocks (Tested thru SIT) CPU: Intel Merom T7300, T7000, and T5500P NV CPU’s Panel: 12.1” XGA TFT Standard(275g) HDD:40, 60, 80,100, 120, 160GB/ 5400 rpm 60,100 GB /7200 rpm Memory:256MB, 512MB, 1GB, 2GB MiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg, MiniPCIe: Verizon(EV-DOrevA), Vodafone(HSDPA 3.6), Cingular, T-Mobile, Telus CDC: Modem, Bluetooth Battery: 4 cell(c), 8 cell (c) Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate 64) Open Bay Odyssey Building Blocks (Tested thru SIT) HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB/7200 rpm Memory: 512MB, 1GB, 2GB MiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n, Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only) Battery: 4 cell (cyl), 8 cell(cyl) Operating Systems: XP Pro, Vista Sumo 3.0 – X61 Offering Definition (Concept Exit) System is not... System is... • Form Factor • 12.1" XGA TFT (150 nit) – Standard (275g) only • 3.15lbs; 10.5” x 8.3” x .96-1.36” • 2.5” System SATA HDDs; Customerupgradeable • 1 Spindle HDD • ThinkLight (white ) • 4 cell cylindrical or 8 cell cylindrical LiIon Battery • NV, 2.5” HF, Standard Display Battery Life: • 4.4 Hr (4cell cyl); 8.8 hr (8 cell cyl) • 2nd LiIon Battery support (external battery pack on system or one bay battery option for UltraBase Dock) • ISO Standard full size keyboard (18.5mm pitch) • Trackpoint IV push-to-select ; In-line scroll/mag • 1 ThinkPad key + 3 audio keys; • Mono Speaker in system (0.5 watt) • Integrated Microphone • Integrated dual band+ wireless antenna • Kensington lock • Fingerprint Reader (select models) • Integrated WWAN and WWAN-ready (select models) • 802.11 n(abg) MIMO wireless with 2x2(entry), 2x3 capability • Optional K/S Ultrabase (Slice) (for optional 2nd spindle) • 65w AC Adapter • Planar • Intel Crestline GM / ICH8M & ICH8M Enhanced core chipset with Integrated Graphics • GEN4fx(DX10) graphics with up to 256MB memory • Intel Merom with EMT64T processors (dual core 800 MHz FSB) • DDR2-667 PC2 5300 memory • 2 x SO-DIMM /4 GB max • 2 x Mini-PCIe Slot (WLAN,WAN ) • 1 x Cardbus/ExpressCard Universal slot (with support for ExpressCard 34mm via USB interface adapter card) • Gigabit Ethernet LOM (all models) • 3 x USB 2.0 • IEEE 1394 • 1 x SD slot • Serial ATA • Soft audio / Microphone • TCG Compliant Secure Chip Crypto-3 (all models) • Wireless Upgradeable (all models) • V92 designed Modem • Bluetooth in display bezel (select models) • Accelerometer / Shock Mounted Hard Drive • Ports on System/ Slice • 7 x USB 2.0 ports (3 system, 4 slice) • 1 x T2 PCMCIA CardBus/ USB Based ExpressCard (System) • IEEE 1394 (system) • RJ11, RJ45 • Parallel, Serial (Slice) • VGA (Both) • Headphone-out, Mic-in (Both) • Slice connector (System) • Warm/Hot swap bay (Slice) • Keylock/cable lock slot (Slice) • PATA bay support (Slice) • Compliance • TCG Compliant Secure Chip Crypto-3 (Intel compliance) • EnergyStar • RoHS • Form Factor • Two spindle • 1.8” HDD’s • Integrated touchpad • Slice dock to Port Replicator or Docking • Planar • 10/100 Ethernet • Mini PCI slot • DVI on System/Slice • Discrete Graphics • 128MB memory • TV Out (S-Video) • LV/ULV processors • Infrared • No TAA Offering • OS Support • See SW Support OD • Ports • PS/2 Port (System) • FDD port connector • SPDIF (AC3 audio) • Ultrabay2000 • NEST Communications Calexico b Calexico 2 b/g, a/b/g Clymer b/g Bartlett a/b/g MDC I, II BMDC II, III UWB Red – Work Items Blue – New IBM Confidential

  8. System Building Blocks (Tested thru SIT) CPU: Intel Merom L7500 and L7300, Yonah U1400 ULV Panel: 12.1” XGA TFT – Standard & TMD HDD:40, 60, 80,100, 120, 160GB/ 5400 rpm (2.5” SATA) 60, 100 GB 7200 (2.5” SATA) WW Memory:256MB, 512MB, 1GB, 2GB MiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only) , Golan abg MiniPCIe: Verizon(EV-DO revA), Vodafone(HSDPA 3.6), Cingular, T-Mobile, Telus CDC: Modem, Bluetooth Battery: 4 cell(prismatic), 4 cell (cyl),8 cell (cyl) Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate 64) Open Bay Odyssey Building Blocks (Tested thru SIT) HDD:40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2.5” SATA) Memory: 512MB, 1GB, 2GB MiniPCIe:ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg Battery: 4 cell(pris), 4 cell (cyl),8 cell (cyl) Operating Systems: XP Pro, Vista Dock/Slice: X6 UltraBase (slice) Kabuki 3.0 – X61s Offering Definition (Concept Exit) System is not... System is... • Form Factor • 12.1" XGA TFT (150 nit) – Standard (275g) & TMD (205g) select models, or LED backlit display (185 g) • 2.6lbs; 10.5” x 8.3” x .083 - 1.1” • 2.5” SATA HDDs; (SATA are Customer upgradeable) • 1 Spindle (HDD) • ThinkLight (white ) • 4 cell prismatic, 4 cell cylindrical, 8 cell cylindrical LiIon Battery. • Battery life with ULV CPU, TMD or LED Display: • 3.3 Hr (4cell pris); 4.4 hr (4cell cyl); 8.8hr (8 cell cylindrical) • 2nd LiIon Battery support (external battery pack on system or one bay battery option for UltraBase Dock) • ISO Standard full size keyboard (18.5mm pitch) • Trackpoint IV push-to-select ; In-line scroll/mag • 1 ThinkPad key + 3 audio keys; • Mono Speaker in system (0.5watt) • Integrated Microphone • Integrated dual band+ wireless antenna • Kensington lock • Fingerprint Reader (select models) • 802.11 n(abg) MIMO wireless with 2x2, 2x3 capability • Integrated wireless WAN and WAN-ready (select models) • Optional K/S Ultrabase (Slice) (for optional 2nd spindle) • 65w AC Adapter • Planar • Intel Crestline GM / ICH8M & ICH8M Enhanced core chipset with Integrated Graphics for LV • Intel Calistoga GM/ ICH7 core chipset with Integrated Graphics f/ULV • GEN4fx(DX10) graphics • Intel Merom with EMT64T processors (dual core LV(800\ MHz FSB, 15W) and single core ULV (533 MHz FSB ) • DDR2-667 PC2 53002 x SO-DIMM /4 GB max • 2 x Mini-PCIe Slot (WLAN,WAN) • 1 x Cardbus/ ExpressCard Universal slot (with support for ExpressCard 34mm via USB interface adapter card) • Gigabit Ethernet LOM (all models) • 3 x USB 2.0 • IEEE 1394 • 1 x SD slot • Soft audio / Microphone • TCG Compliant Secure Chip Crypto-3 (all models) • Wireless Upgradeable (all models) • V92 designed Modem • Bluetooth in display bezel (select models) • Accelerometer / Shock Mounted Hard Drive • Form Factor • Two spindle • 1.8” HDD’s • Integrated touchpad • Slice dock to Port Replicator or Docking • Planar • 10/100 Ethernet • Mini PCI slot • DVI on System/Slice • Discrete Graphics • 128MB memory • TV Out (S-Video) • NV processors • Infrared • No TAA offering • OS Support • See SW Support OD • Ports • PS/2 Port (System) • FDD port connector • SPDIF (AC3 audio) • Ultrabay2000 • NEST Communications Calexico b Calexico-2 b/g, a/b/g Clymer b/g Bartlett a/b/g MDC I, II BMDC II, III UWB • Ports on System/ Slice • 7 x USB 2.0 ports (3 system, 4 slice) • 1 x T2 PCMCIA CardBus/USB based ExpressCard (System) • IEEE 1394 (system/) • RJ11, RJ45 • Parallel, Serial (Slice) • VGA (Both) • Headphone, Mic (Both) • Slice connector (System) • Warm/Hot swap bay (Slice) • Keylock/cable lock slot (Slice) • PATA bay support (Slice) • Compliance • TCG Compliant Secure Chip Crypto-3 (all models) • EnergyStar • RoHS Red – Work Items

  9. Sumo-3 X61 – MTs 7673/7674 -Easy Access Elements (At Announce) Customer Feature Choice (CFC’s) Optional Select Lenovo Confidential Mandatory Select • Ethernet (GB) Wireless • Wireless LAN Ready (Yes) • Wireless WAN (Yes/No) • Bluetooth (Yes/No) • Security • ESS Secure Chip (Yes) • Fingerprint Reader (Yes/No) CFC Memory Choices • Expansion Memory • (256, 512, 1024 or 2048MBBase Memory) • Plus(1 x SODIMM socket) • 0 • 256 MB • 512 MB • 1024 MB • 2048 MB • 4 GB Max Memory Additional Features System HDD (2.5”) • 40 GB/5400 • 60 GB/5400 • 80 GB/5400 • 100 GB/5400 • 120 GB/5400 • 160 GB/5400 • 100 GB/7200 • 60 GB/7200 • Standard Feature Elements • 12.1” XGA TFT • GB Ethernet • UtraConnect Wireless Antenna • Secure Digital Slot • 3 x USB 2.0 • AC Adapter (65W) • APS • 1394 + • Mini PCIe • Wireless Upgradeable • 802.11 abg (Golan) • 802.11 a/b/g (Kedron) • 802.11 a/b/g (ThinkPad) • Intel Kedron n (abg) • ThinkPad n (abg) + • Battery • Li-ion 4 cell Cylindrical • Li-Ion 8 cell Cylindrical • SW Applications • See Software Plan Mandatory Select Filter Item Planar, Processor, 1394, SD • Merom T5500P NV DC ($195) • Merom T7000 NV ($225) • Merom T7300 NV ($275) • OS + Drivers + Utilities • Win XP Pro (SP2) • Vista Accelerometer on every system Modem on every system Secure Chip on every system • Docking • X6 UltraBase • UB6 with DVD • UB6 with Combo • UB6 with Multi-Burner = Options (Easy Access Elements) + Derived Shells See options plan • Warranty / Service Offerings • 3 year depot (GAV/EZA) • 3 year on-site (GAV/EZA) • 4 year depot (MTM only) • 4 year on-site (MTM only) • 1yr Express (GAV only) • 3yr Express (GAV only) All with 12.1” TFT • TBD see initial Shell Plan Miscellaneous Options Red – Work Items

  10. Kabuki-3 X61s -MTs 7666/7667 - Easy Access Elements (At Announce) Customer Feature Choice (CFC’s) Optional Select Lenovo Confidential Mandatory Select • Ethernet (GB) Wireless • Wireless LAN Ready (Yes) • Wireless WAN (Yes/No)) • Bluetooth (Yes/No) • Security • ESS Secure Chip (Yes) • Fingerprint Reader(Yes/No)) CFC Memory Choices System HDD (1.8” PATA) (Japan only Now removed) • 30 GB/4200 • 40 GB/4200 • 60 GB/4200 • Expansion Memory • (256, 512, 1024 or 2048MBBase Memory) • Plus(1 x SODIMM socket) • 0 • 256 MB • 512 MB • 1024 MB • 2048 MB • 4 GB Max Memory Additional Features • Standard Feature Elements • 12.1” XGA TFT • GB Ethernet • UtraConnect Wireless Antenna (x3) • Secure Digital Slot • 3 x USB 2.0 • AC Adapter (65W) • APS • 1394 System HDD (2.5” SATA) • 40 GB/5400 • 60 GB/5400 • 80 GB/5400 • 100 GB/5400 • 120 GB/5400 • 160 GB/5400 • 100 GB/7200 • 60 GB/7200 + • Mini PCIe • Wireless Upgradeable • 802.11 a/b/g (Kedron) • 802.11 a/b/g (ThinkPad) • Intel Kedron n • ThinkPad n + • SW Applications • See Software Plan • Battery • Li-Ion 4 cell Prismatic • Li-ion 4 cell Cylindrical • Li-Ion 8 cell Cylindrical Mandatory Select Filter Item Planar, Processor, 1394, SD • Yonah U1400 ULV SC ($225) • Merom L7300 ,DC, GB ($265) • Merom L7500 DC, GB ($295) • OS + Drivers + Utilities • Win XP Pro (SP2) • Vista Accelerometer on every system Modem on every system Secure Chip on every system • Docking • X6 UltraBase • UB6 with DVD • UB6 with Combo • UB6 with Multi-Burner = Options (Easy Access Elements) + Derived Shells See options plan • Warranty / Service Offerings • 1702 - 3 yr depot (GAV/EZA) • 1703 - 3 yr on-site (GAV/EZA • 4 year depot (MTM only) • 4 year on-site (MTM only) • 1yr Express (GAV only) • 3yr Express (GAV only) All with 12.1” TFT • TBD see initial Shell Plan Miscellaneous Options Red – Work Items

  11. SPEC Overview ( CPU/ Intel chipset comparison) • Remark which “ ” is defined in KS2/ KS3 notes. • KS2 support Yonah & Merom Processor.

  12. SPEC Overview 1 (Basic function)

  13. SPEC Overview 2 (Subsystems)

  14. SPEC Overview 2 (Subsystems)

  15. SPEC Overview (X6 Slice)

  16. 3. WW Agency Approval plan

  17. WW Agencies Plan (KS-3) SIT Exit: 3/19/2007 SVT Exit: 4/27/2007 SOVP: 5/09/2007 Ann/ GA: 5/22/2007 Notes: 1. CB report and Simplified Chinese Manual are requested for CCC submission 2. Traditional Chinese Manual is requested for BSMI submission

  18. 4. RoHS Compliant Plan

  19. RoHS Compliant plan

  20. 5. New FRU/ CRU Plan

  21. FRU/ CRU Plan Common parts similar with KS2, FRU is able to follow. Such as: LCD, HDD, KB, Adapter, P/C, MDC,B/T, WLAN,WWAN, Memory module, ODD, Battery. Below Mechanical parts needs assign new FRU, • Planar • Rear Cover • LCD Bezel • Keyboard Cover • Base Cover) • LCD FPC • FPR Board • WWAN Antenna

  22. 6. Supplier Selection Process

  23. Supplier Selection Process Lenovo: • Buy/ Sell parts following Lenovo rule. Wistron determinable: • Sourcer refer to Wistron QVL list • Judge suppliers developing capability and production capacity to select candidates • Release spec. requirement & RFQ to candidate suppliers • Compare cost, experience and service • Decide award suppliers • Depends on demand to judge if need 2nd or 3rd source

  24. Supplier Selection Process Current mechanical parts vendor candidates :

  25. 7. EC Release Plan

  26. EC Release Plan Based on KS-3 Schedule as of Jul. 14, 2006 Plan Exit 08/18/2006 Pre-DV 08/28/2006 - 09/11/2006 DV1 09/12/2006 - 10/30/2006 DV2 10/31/2006 - 12/18/2006 SIT 12/26/2006 - 02/26/2007 SVT 03/05/2007 - 03/30/2007 SOVP 04/09/2007 SS 04/23/2007 ANN/GA 04/24/2007

  27. 8. Quality Development Process

  28. Quality Dev. Processes Quality improvement activities are planned as follows: Maximize the common design for support new function - Follow the KS-1/2 design as much as possible, such as HDD/ Battery/ Slice support/ Keyboard e.t.c. • Minimize the modification for supporting new function • Improvement WWAN performance. • > LCD rear cover is common except MIMO support. • Support MIMO 3rd antenna with WWAN. • > One new opening on LCD rear cover on top side. Other portion is same as KS-1. • Improvement palmrest thermal performance. • > New 2nd FAN solution without any height change of Keyboard/ Bezzel/ Bottom case.

  29. How to set design or quality criteria/targets Followed by KS-3 design target Thermal design of Palmrest during communication <1> KS-1: No criteria during development phase during file transfer. Define the test procedure and criteria after SIT. -> Deviation. <2> KS-2: Improve the thermal performance of Palmrest. <3> KS-3: Support 2.5W MIMO without deviation. - 2nd FAN solution for palmrest. WWAN performance • KS-1/2 WWAN performance is not so good. And carrier will not allow this performance on KS-3. • KS-3 will use new WWAN antenna concept, Rod Antenna. It will be met the carrier’s required performance. MIMO + WWAN support • KS-1 does not support MIMO. • KS-2 supports MIMO without WWAN. • KS-3 will support MIMO with WWAN. • 3rd antenna for support MIMO.

  30. KS Note-3 DPRPlanar Design/Layout w/Lesson Learned Jacky Chang 2006/08/02

  31. Agenda • System Block Diagram • Component Layout • Lesson Learned

  32. Kabuki/Sumo3 System Block Diagram ver 0.2 Thermal Sensor LM26 Intel Merom NV/LV/ULV Processor Clock Generator CK-EX505 (MLF64) External Connector Keyboard Light Internal Connector SMBus New Device uFCBGA 12.1" XGA LCD Optional SO DIMM (x1) 802.11a/b/g Antenna Wireless WAN Antenna PSB 800/667MHz Intel Crestline (Int. GFX) Robson Mini Card Dual channel 667/533MHz DDR-II SO-DIMM 802.11a/b/g 802.11n Mini Card Wireless WAN Mini Card RJ11 CRT I/F for Slice INVERTER Optional SO DIMM (x1) Thermal Sensor LM75 MDC CRT DMI X2/X4 CH-0 USB Conn-1 Analog RGB Switch CH-1 USB Conn-2 SMBus CH-2 MiniCard Intel ICH8-M USB 2.0 x 10 Ports PCI Bus 33MHz CH-3 (x1) Ricoh R5C843 (x1) USB CH2 Bluetooth Antenna PCI Express 6Ports CH-4 Reserved SATA SATA HDD Azalia CH-5 Reserved ATA/100 GLCI/LCI CH-6 Bluetooth HDD Subcard Card Bus Ricoh R5C847 Azalia Codec AD1984 GbE Intel RU82566MM CH-7 Finger Print Li Battery USB CH3 CH-8 USB Conn-3 CH-9 ATMEL AT8356908 SPI Media Slice USB-HUB SMBus CB/USB Slot Audio AMP MAX9789A CS-2 X Media Slice RJ45 Switch G/A R5534V SPI RJ45 Port 1394 Ultra Slim Bay ATA100 SD Slot Power Button Second Battery Internal Mic DC-IN Mono Speaker (0.5W) RJ45 for SLICE USB Hub SMSC USB2504 LPC Bus 33MHz USB CPU VR Intel IMVP-VI Thermal Sensor MAX6602 USB CH6 Head phone Micro phone TCPA Chip Embedded Controller USB LPC Bridge Winbond WPCN385 USB Super I/O NS PC87392 APS sensor USB FAN DC-DC Converter (G/A) MAX3243 Media Slice MAIN BATTERY Serial IR Parallel Second Battery CRT DC-IN Media Slice Connector Mouse I/F KBD I/F Stereo Speaker RJ11 RJ45 Head phone Micro phone USB (x1), IDE, LPC, CRT, RJ11, RJ45, CD Audio In, Speaker Out, Mouse, Keyboard, 2nd Batt.

  33. Component Layout • Component Layout on TOP side • Component Layout on BOTTOM side

  34. Component Layout on TOP side CPU VR Intel IMVP-VI LCD CONN Track Point KB CONN RTC BAT SIO DCDC area KBC PCMCIA / CardBus USB Express Card WLAN Finger print WWAN Robson Robson On board 2nd FAN MDC INT MIC Speaker IrDA

  35. Component Layout on BOTTOM side BAT Conn CPU VR Intel IMVP-VI USB Slice Conn HDD Card Conn CRT CPU Merom DDR2 SO-DIMM Socket RJ45 North Bridge Crestline Audio Jacks DCDC area GFX VR ICH-8M USB MAX9789A SD Socket USB SIM conn R5534V AD1984 PMH7 SPI Flash R5C847 CLKGEN RINKAN 1394 GbE Wireless Disable SW

  36. Lesson Learned from KS Note-1 • Name: 77328f_1 • Abstract: W2K:USB Rambo can't be recognized when hot-undock on slice [Problem Description] Self-powered Sony Rambo Drive can not be recognized if this ODD has been attached before Hot-Dock action. [Root Cause] • Some leakage current may come from external USB device via USB data signals (USB_D+/D-) if the external USB device is self-powered. In this case, the measured voltage on USB_D+ is 1.2V. • If Media Slice in power-off state and some leakage current on USB data signals, the leakage current will go through SMSC USB2504 to the VDD power rail. In this case, the measured voltage on VDD power rail is 0.95V. • In KS-1 Media Slice, RC circuit is used to generate a RESET# signal for USB2504. And RC circuit is tied to VDD at 0.95V level. But RESET# must be less than 0.8V for 1us. • Therefore, “USB2504 is not reset well!!”

  37. Root Cause VCC3_USB_HUB 0.95V 1.2V SMSC USB2504 USB Device USB_D+/D- RESET# 0.95V USB2504 is not reset well!!

  38. Long-term solution VCC3_USB_HUB VCC3_USB_HUBPWR 0.95V 1.2V SMSC USB2504 USB Device USB_D+/D- RESET# 0V

  39. Preventive Action • Leakage current on USB port has not been checked before. Afterwards, external self-powered USB device will be checked while the system is at Power-off state by the following table. (Sony USB Rambo: DRX-810UL) • Follow the essence of DQC E12-3: Planar Overall – Legacy 2.04A Power-on printer CRT and/or EXT power supply Attached to IO Ports at Power-off

  40. Cut-in Schedule

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