Redistribution Layer Material Market 2019 Competitive Analysis, Huge Growth and Forecasts to 2027

1. Redistribution Layer Material Market Publication Month: Feb 2019 | Report Code: TIPRE00002904 | No. of Pages: 154 | Category: Chemicals and Materials | Status: Published Redistribution Layer Material Market to 2027 - Global Analysis and Forecasts by Material (Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others); Application (FOWLP and 2.5D/3D IC Packaging) Layer Material E-Mail : sales@theinsightpartners.com

2. Redistribution Layer Material Market Publication Month: Feb 2019 | Report Code: TIPRE00002904 | No. of Pages: 154 | Category: Chemicals and Materials | Status: Published Introduction: The global Redistribution Layer Material Market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027. APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period.  The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region. Manufacturing of consumer electronics, healthcare related products, automobiles, and defense industries are some of the prominent industry verticals that have been prolific in the automation integrations into the manufacturing assembly lines. Automation integration requires additional functionalities to be added on the chips for translating the manual operations to automated ones. Increasing the functionalities on chips while maintaining the size of the chip is made possible with the help of redistribution layer material and therefore, these manufacturing sectors are anticipated to drive the demands for redistribution layer material drastically during the forecast period. E-Mail : sales@theinsightpartners.com

3. Redistribution Layer Material Market Publication Month: Feb 2019 | Report Code: TIPRE00002904 | No. of Pages: 154 | Category: Chemicals and Materials | Status: Published The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years. Also, between 2018 and 2023, the data traffic is anticipated to grow at a compound annual growth rate of close to 40 percent. This exponential growth in data traffic over the internet is out rightly attributed to the growing penetration of smartphones and other consumer electronic devices that can be connected over the internet as a result of the growing popularity of IoT. The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. E-Mail : sales@theinsightpartners.com

4. Redistribution Layer Material Market Publication Month: Feb 2019 | Report Code: TIPRE00002904 | No. of Pages: 154 | Category: Chemicals and Materials | Status: Published The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor. The majorly used advanced packaging techniques have been broadly categorized under two segments namely Fan-out Wafer Level Packaging (FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their applications in these advanced level packaging where they are placed for resolving issues related to heat dissipation, elongation of battery life, and enhancement of the performance. Get Sample Brochure E-Mail : sales@theinsightpartners.com

5. Redistribution Layer Material Market Publication Month: Feb 2019 | Report Code: TIPRE00002904 | No. of Pages: 154 | Category: Chemicals and Materials | Status: Published • The List of Companies • Advanced Semiconductor Engineering, Inc. (ASE group) • Amkor Technology, Inc. • Fujifilm Holdings Corporation • Hitachi Chemical DuPont MicroSystems L.L.C. • Infineon Technologies AG • Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET) • NXP Semiconductors N.V. • Samsung Electronics Co. Ltd • Shin-Etsu Chemical Co., Ltd. • SK HYNIX INC. • Sumitomo Bakelite Co., Ltd • The Dow Chemical Company • Toray Industries, Inc. • Taiwan Semiconductor Manufacturing Company Ltd. E-Mail : sales@theinsightpartners.com