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Thin Film Technology Lecture 2 Vacuum Surface Engineering Jari Koskinen 2013. Vacuum surface engineering. Vacuum technology Surface phenomena Surface energetic ion interaction. Vacuum surface engineering. Vacuum technology Surface phenomena Surface energetic ion interaction.
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Thin Film Technology Lecture 2 Vacuum Surface Engineering Jari Koskinen 2013
Vacuum surface engineering • Vacuum technology • Surface phenomena • Surface energetic ion interaction
Vacuum surface engineering • Vacuum technology • Surface phenomena • Surface energetic ion interaction
Vacuum system VACUUM GAUGE PUMP RESUDUAL GAS FLANCE VACUUM CHAMBER
Large surfaces, upscaling www.scheuten.com
Residual gas • Pumping of: • Residual gas: • Adsorption – Desorption • Diffusion of dissolver or trapped gas • Permeation trough materials • Leaks diffusion of dissolved molecules desorption pump • permeation • leak
Units of pressure Ultra Good High High Inter-mediate Rough Total pressure of residual gasses
Sources of residual gas • High vacuum • pumping speed • leak • Good High vacuum • desorption from walls • baking • Ultra high vacuum • impurities • internal leaks • material selection • diffusion • permeation
Average mean free path (distance between collission) in nitrogen residual gas <λ> Ultra Good High High Inter-mediate Rough Total pressure of residual gasses
Average mean free path (distance between collission) in nitrogen residual gas <λ> Ultra Good High High Inter-mediate Rough Total pressure of residual gasses
Phases of residualgas • d = diameter of chamber • Viscotic <λ> < d/100 • Intermediate • Molecular <λ> >> d Ultra Good High High Inter-mediate Rough Total pressure of residual gasses
Phases of residualgas • d = diameter of chamber • Viscotic <λ> < d/100 • Intermediate • Molecular <λ> >> d Filament does not oxidise Ultra Good High High Inter-mediate Rough Laminar flow Molecular flow clean surface Total pressure of residual gasses
Time to form one molecular layer on surface Ultra Good High High Inter-mediate Rough Total pressure of residual gasses
Vapour and liquid in vacuum pump balance: condensation = evaporation balance: pumping = evaporation pressure constant until all liquidis pumped
Critical temperatures and pressures for some residual gasses Gas or vapor pump Helium Hydrogen Nitrogen Carbon monoxide Argon Oxygen Methane Carbon dioxideChlorine Ether Ethanol Carbon tetraclor. Water above Tc no liquid
Vacuum pumps • Positive displacement (mechanical pumps) • Momentum transfer (molecular pumps) • Entrapment
Mechanical pumps Rotary vane Roots Diafragma
Mechanical pumps Scroll pump
Momentum transfer Turbo molecular Oil diffusion pump
Entrapment cryo pump ion pump
Vacuum gauges • Mechanical – diaphragm • Electronic • Piezoresitive (strain gauge) • Capacitive • Magnetic • Piezoelectric • Optical • Potentiometric • Resonant • Thermal conductivity – Pirani • Ionzation gauge • Hot cathode • Cold cathode (Penning)
Gauges Pirani ionization gauge hot filament
Residual gas analyser SRS RGA100 Residual Gas Analyzer
Gas flow in vacuum systems Q gas troughput [pressure*volume/s] Q = C(P1 – P2) in series: P1 P2 C conductance l/s in parallel:
Conductance of various geometries M. Ohring
Vacuum surface engineering • Vacuum technology • Surface phenomena • Surface energetic ion interaction
Surface energy γ surface tension = dW work needed to form surface dA In thermodynamic equilibrium:
Contact angle Young equation S solid L liquid G gas Spreading parameter S Complete wetting when S ≈ 0 non-wetting when S ≈ -2 ΥLG
Adsorption • Physisorption • Chemisorption
Adsorption • Physisorption • Chemical bonding: • polaroization (van der Waals) • Bonding energy ≈ 0.001 – 0.5 eV • Bond length ≈ 3 – 10 Å • For example: nobel gas or molecules on materials • Possibly precursion state before chemisorption
Adsorption • Chemisorption • Chemical bonding: • charge exchange • Bonding energy ≈ 0.5 – 5 eV • Bond length ≈ 1 – 3 Å • For example: H, O, N, CO on metals • Dissociation of molecule • Final absorption
Desorption • Adsorbed molecule receives energy ED in order to leave surface • thermal • radiation • photons • electrons • ions • electric field
Balance of absorption - desorption • collisions of molecules (gas) • S sticking coefficient • ED energy for desorption • P pressure • Coverage • ≈ • High P, low T more adsorption • ED large, full coverage • very little adsorption in UHV
Surface diffusion http://iramis.cea.fr/spcsi/Phocea/Vie_des_labos/Ast/astimg.php?voir=60&type=groupe
Surface diffusion • Diffusion is thermally activated random movement of adsorbed atoms • D = D0 e-Eact/kT • Eact large -> slow diffusion • T high – fast diffusion Eact Surface diffusion of Cu on Cu(111) http://iramis.cea.fr/spcsi/Phocea/Vie_des_labos/Ast/astimg.php?voir=60&type=groupe
Work function • Work function ϕ • EF Fermi energy • D dipole potential
Work function of some metals Adsorbed atoms alloying effect work function
Vacuum surface engineering • Vacuum technology • Surface phenomena • Surface energetic ion interaction