Package types

Aug 06, 2014

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Package types. Livello 1 : Connecting die to package. Wire Bonding Backside of the die is attached to the substrate. Pads are individually connected to pins with Al or Au wires. Solder bump bonding

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Package types

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Package types
Livello 1: Connecting die to package • Wire Bonding • Backside of the die is attached to the substrate. • Pads are individually connected to pins with Al or Au wires

Solder bump bonding • Solder bumps are small spheres of solder (solder balls) that are bonded to contact areas or pads of semiconductor devices and subsequently used for face-down bonding.