HYC will be present at ANGA COM 2019

1. HYC Will Participate in ANGA COM 2019 HYC Co., Ltd sincerely invite you to attend The ANGA COM 2019 - Exhibition and Conference for Broadband, Television & Online from 4 to 6 June 2019 in Koelnmesse/Germany. HYC is extending an invitation to you to come and see our products and solutions during the show. HYC will be located at booth R51 Hall 8. A number of representatives will be present to welcome you to our booth. They will be available to answer any questions that you have. The latest products that HYC will be displaying at the show include AAWG module, MEMS optical switch, and various fiber optic connectivity for high density applications. Highlights of HYC AAWG Module(Athermal AWG Module) For 5G HYC's athermal AWG module is based on arrayed waveguide grating technology, which does not require power and temperature generation equipment. HYC provides 32-channel, 40-channel, 48-channel athermal AWG module encapsulated with small metal box or 19-inch rack. At the same time, these modules can also have power monitoring terminal port and other band expansion port.

2. AWG CWDM4, designed for 40G/100G active optical module The AWG CWDM4 module of HYC is fabricated based on silicon chip technology. It has compact structure and high reliability. It is widely used for combining and dividing optical signals in 40G or 100G active optical modules. CCWDM Module, Compact free-space structure CCWDM is based on thin film filter technology and free space package technology；It features small form factor, ultra low insertion loss, high channel isolation and no epoxy in the optical path. HYC provides high-quality 4CH,8CH CCWDM modules with mini-sized package(50×27×7.7mm).

3. MEMS Optical Switch, for optical network monitoring and switching MEMS Optical Switch is based on micro-electro-mechanical system (MEMS) technology to control and switch the optical path. MEMS optical switch can be integrated with WDM, PLC or PD to form a multi-functional switch module. HYC offers optical switch modules that are compact, high stability and reliability, and available in any 1xN configuration. It is widely used in MCS, OXC, iODF, OLM, OTDR, optical fiber sensing and so on. Fiber Cabling Solution, for high density solutions HYC high-density unique design patch panel, with maximum LC connecting & cabling, adopt the high-strength environmental lightweight material and superior surface treatment technique, which make the panel achieved complete function and various flexible cabling solution. This rackmount patch panel is designed to manage and house easy-plug MTP / MPO to LC fiber cassette modules, for connecting plug-and-play pre-terminated high-density MTP / MPO Fiber cabling system. This solution contributes to greater network availability that especially suitable for SAN, LAN and Data Center applications. Each

4. easy-plug MTP / MPO to LC cassette is accommodated with a 12/24-fiber MTP / MPO based fiber assemblies and pre-loaded with LC adapters in different fiber modes for your choices. Meet with HYC Experts ANGA COM is a great time to meet with HYC experts. Our team will be available to meet with you to discuss your current challenges and opportunities. Thank you for your continuous support to HYC. We look forward to seeing you in Cologne. About HYC Co., Ltd Founded in 2000, HYC Co., Ltd is one of the world’s industry-leading manufacturer of the optical component. Today, HYC’s business is focused on the production of solutions in the following areas: fiber connectivity, WDM, PLC splitter, and high-density datacom cabling. HYC products and solutions widely applied in 4G/5G, Data Center and Cloud Computing industry, etc. www.hyc-system.com sales@hyc-system.com