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The electronic method is already being used in packaging products but their usage is less and cost-effective. Now with key enabling technology, printed electronics are boosting the potential opportunities for smart packaging by lowering the costs. According to Infoholic Research, it is estimated that the “Worldwide Electronic Smart Packaging” market will witness a CAGR of 45.5% during the forecast period 2016–2022. In the future, the electronic smart packaging market will witness a rapid growth and is expected to grow tremendously, due to the use of printed electronics in packaging.
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Electronic Smart Packaging Market 2016-2022 “The Worldwide Electronic Smart Packaging market is expected to grow at a CAGR of 45.5%during the period 2016–2022 to touch an aggregate of $1,700.8 million by 2022.” www.infoholicresearch.com sales@infoholicresearch.com
THE REPORT CONTAINS THE FOLLOWING Brief Report Segmentation Infographics (Trends and Forecast) Key players Regions Benefits Click here to receive a Sample of this report
BRIEF INTRODUCTION • Increasing adoption of IoE, wireless communications, and cloud computing is driving the fastest growing electronic smart packaging market; • As per the end-user analysis, food and beverages industries are expected to outperform and reach $615.0 million and $312.3 million respectively by 2022. • NFC is expected to grow at a CAGR of 46.0% to reach $344.4 million by 2022. • As per applications, printed sensor and printed RFID are expected to grow tremendously and reach $685.9 million and $344.2 million respectively by 2022. • Click here to receive a Sample of this report
Worldwide Electronic Smart Packaging Market Revenue *Note: Few reading are hidden. For complete report please visit Infoholic Research.
Electronic Smart Packaging Market Share by Technology *Note: Readings are hidden. For complete report please visit Infoholic Research.
KEY PLAYERS • The reports consists of insight analysis of the following companies • Thin Film Electronics, • Smartrac NV, • Bemis Company, • Sealed Air and • PakSense Click here to browse the complete report
REGIONS The report covers the adoption and usage of bare metal cloud in different regions. The region includes: • North America • Europe • Asia Pacific • LAAM Click here to browse the complete report
BENEFITS • The report gives insights about the • Information related to latest industry and market trends, key stakeholders, industry pest analysis and competitive landscape • Details of the ongoing and upcoming electronic smart packaging projects • The analyst has rated top five vendors Vis-a-Vis end-user inputs on key factors and also, the investment done by various packaging industries is included in the report • The report will be useful for the key stakeholders of the electronic smart packaging market such as packaging industries, technology providers, end-users and electronic providers in the following ways: • Competitive analysis (i.e. current and future key business strategies of the competitors and their regional growth) • Drivers and growth opportunities in different regions
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ABOUT US Infoholic Research is a global ICT market research and consulting organization providing strategic and high-level market intelligence in emerging and niche technologies. Founded in 2014, we are headquartered in India with an office in U.S and with consultants working across the globe. Our market analysis powered by rigorous methodology and quality metrics provides information and forecast across all the emerging markets, technologies and business models. We aim at delivering high quality results to our clients providing them with in-depth industry insights to identify new business opportunities and nurture their business strategies. Copyright © 2016 Infoholic Research All Rights Reserved. This document contains highly confidential information and is the sole property of Infoholic research. No part of it may be circulated, copied, quoted, or otherwise reproduced without the approval of Infoholic research.
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