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Pressure Tests R esults

Pressure Tests R esults. Summary of Wafers…. Micro-fabrication process at CSEM. 5 wafers produced from a 380 µm Si wafer etched with 190 µm deep channels and closed by Si-Si bonding with a cover wafer. Wafer # 3 -> ( through holes ) Wafer # 5 Wafer # 7 Wafer # 8

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Pressure Tests R esults

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  1. Pressure Tests Results Collaboration meeting CERN - CSEM

  2. Summary of Wafers…. • Micro-fabricationprocessatCSEM. • 5 wafers producedfrom a 380 µm Si wafer etchedwith 190 µm deepchannels and closed by Si-Sibondingwith a cover wafer. • Wafer # 3 -> (throughholes) • Wafer # 5 • Wafer # 7 • Wafer # 8 • Wafer # 9 th 194 µm 186 µm • dicing and grinding of the cover wafer to the wantedthickness (th) • testingat CERN Bondingdetails see CSEM Collaboration meeting CERN - CSEM

  3. Structures on EachWafer: • In each wafer there are: • 2 samples ATLAS • 2 samples FRAME 4 – NA62 • 8 structures «pressure test» (4 differentchannel dimensions) Done for CO2circulation, with restrictions and pillars ATLAS PRESSURE TEST STRUCTURES CSEM 13 mm 21 mm 45 mm 5.4 mm 2.85 mm 50 µm CSEM B FRAME 4 - NA62 D = 210 µm 10 mm 83.8 mm 19 mm Collaboration meeting CERN - CSEM

  4. TestingProcedure: • Manual water pumpused to apply the pressure • Clamp connector to hold the samples • DAQ system in Labview to save data • Eyealignment of the hole and the connector ATLAS CSEM • Gluing a piece of silicon for the ATLAS and FRAME4 samples on the inlethole to test the outlet manifold (weakest point) FRAME 4 - NA62 CSEM Collaboration meeting CERN - CSEM

  5. TestedSamples: • ‘## bar’ = good explosion of the channel • ‘## bar (broken)’ = samplebroken in manypieces once reached the ## pressure • ‘(broken)’ = samplebrokenbeforetesting • ‘ > ## bar ‘ = reached a pressure of ## bar withoutfailure samplesstillavailable • ‘fluidic test’ = samplesavalaible for testing  on going... Collaboration meeting CERN - CSEM

  6. Pictures: Wafer # 3: explosion of outlet manifold (FRAME4, 100 µm, 123 bar) Wafer # 9: debonding area (channel of 50, 65 bar) Wafer # 8: explosion of outlet manifold (ATLAS, 100 µm, 66 bar) Wafer # 7: explosion of channel (channel of 200, 175 bar) Collaboration meeting CERN - CSEM

  7. Test with 2mm Pyrex Samplesproduced by CERN atCMi Pressure test structures with 70 µm channelsetched in a Silicon wafer anodicallybonded to a 2 mm Pyrex. The silicon has been thengrinded to differentthickness (th). th 70 µm 2 mm 5 mm 5mm A B D = 200 µm 10 mm Collaboration meeting CERN - CSEM 20 mm

  8. Test with Pyrex 2 mm, Results Collaboration meeting CERN - CSEM

  9. Test withSi-SiSampleswithChannels Samples production outsourced Long restrictions at the inlet 70 µm 200 µm widechannels 165 µm P3 P1 P2 P4 No manifold, justchannels Narrow manifold 165 µm Verybigoutlet manifold (large unbonded area) Collaboration meeting CERN - CSEM

  10. Test withSi-SiSamples, Results Hydrophilicbonding unbonded areas! P3_214 P1_116 P2_515 P1_516 P3_144 P3_144 Hydrophobicbonding!! Collaboration meeting CERN - CSEM

  11. Future tests • More pressure test with 2 mm Pyrex • Fluidic test on-going • SEM images and measures of the real thickness of samples • Numerical simulations with COMSOL on-going • … Collaboration meeting CERN - CSEM

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