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I+D en el CNM/IMB para futuros aceleradores

I+D en el CNM/IMB para futuros aceleradores. Update from Santiago meeting, October 2008. Manuel Lozano. IFCA. CNM Clean Room expansion. From 1000 to 1500 m2 Still waiting for some equipments relevant for advanced packaging Wafer grinder CMP

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I+D en el CNM/IMB para futuros aceleradores

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  1. I+D en el CNM/IMB parafuturos aceleradores Update from Santiago meeting, October 2008 Manuel Lozano

  2. IFCA CNM Clean Room expansion • From 1000 to 1500 m2 • Still waiting for some equipments relevant for advanced packaging • Wafer grinder • CMP • Wafer alignment and bonding system (3D packaging) • Clean room operational, but not 100% Not ready yet

  3. New equipment: Plastic Laser-sintering system • EOS FORMIGA P 100 (Germany) • Very fast prototyping • From CAD to piece in a couple of hours • Effective building volume:20 cm x 25 cm x 33 cm • Resolution ~0.1 mm • 20 mm height/hr • Very interesting to test new ideas either at reduced scale or actual size or to make functional pieces

  4. Very complex pieces Only limitation, no closed cavities Different materials available Examples: Springs Nut and bolts Hinges Micropipes New equipment: Plastic Laser-sintering system

  5. In collaboration with IFCA Mask finalized 12 different detectors Common parameters: active area= 1.2x1.5 cm2 circular window in the back metal (r=0.5 cm) 256 readout strips with 1.5 cm length 9 guard rings and scribe line with n-well 6 detectors have been completed with floating intermediate strips in order to improve spatial resolution using the capacitive charge division principle. IFCA IR transparent detectors

  6. Processing run started IFCA IR transparent detectors 15 μm strip width 5 μm metal width Intermediate strip

  7. Will be tested at IFCA using ALIBAVA System with laser IFCA IR transparent detectors Partially funded by Spanish Acces to Large Facilities: GICSERV

  8. 3D detector technology spreading Diodes 2D 3x3 matrix Medipix2 Test structures Atlas pixel 3d pads strips Test for SEM Long strip MOS 10x10 matrix Pilatus

  9. 3D detector technology • Success with Medipix type pixel sensors • Now we are designing of a new mask set for ATLAS pixel sensors • Work done in the framework of RD50 collaboration. • Possibility of developing a prototype of B-layer for ATLAS upgrade with 3D pixels • 0.5 m2, 2500 chips, 250 wafers • CNM will try to get the contract Partially funded by Spanish Acces to Large Facilities: GICSERV

  10. System finished 20 units already distributed New fabrication batch will start soon Upgrade for test beam telescope Upgrade for ethernet connectivity ALIBAVA: A readout system for microstrip silicon sensors

  11. In collaboration with IFAE Bump bonding already working Medipix and ATLAS pixels successfully bonded Now working to increase yield and qualify the technology SET/Süss FC150 machine 1 micron placing accuracy In-situ reflow Bump Bonding

  12. Trenched detectors • Work started in collaboration with IFAE (Cristobal Padilla) • Trenches used to reduce the dead area at the edge of the sensor • (also named edgeless, slim-edge, ...) • First application for ATLAS pixels • Can be extended to strips

  13. Initial configuration UBM Δ 80um 30 um 6um 10um 50 um 30um Si3N4 SiO2 p+ p+ p+ n+ n+ n+ poly 150um p-stop p guard Side cut (DRIE or Diamond saw) Pixels 300um p+ Al Trenched detectors • High resistivity polysilicon used to fill the trenches to assure mechanical strength • Thermal oxide inside trenches to assure insulation.

  14. The trench isolates the depletion area from the damaged cut. The equipotential lines accumulates at the implant decreasing the breakdown voltage. However, it is still possible to over deplete the detector. Simulation Accumulation of equipotential lines

  15. Trench + diamond saw cut

  16. Trench filled with polysilicon

  17. ATLAS upgrade readout electronics • Study of 3 tecnologies 0.25 μm SiGe BiCMOS from IHP (Germany) • 3 transistor types from SGB25VDtechnology (30, 50, 80 GHz) • Minimum transistor in tech. SG25H1 (0.17 μm2) • 2 different transistors from tech. SG25H3 (0.17μm2 & 0.35μm2)

  18. GICSERV • Easy access through the Spanish “Access to Large Facilities” Program: ICTS GICSERV • Last call January 2009 • 70 applications, 50 accesses • 7 projects approved (1 rejected) in detector technology for HEP • 3D medipix-type detectors. Diamond (UK) • Stripixels. Laaperanta and BNL (Finland and USA) • Thin pixel detectors. Univ. Santiago • Thin strip detectors. IFCA • Atlas pixels with slim edge. IFAE • Increased efficiency detectors. Univ. Liverpool (UK) • Bump bonding for DEPFETS. MPI Halbleiterlabor (Germany) • 5 projects in 2008, and 3 in 2007

  19. Conlusions • Transparent detectors processing. • Bump bonding working • Started activity in pixel and strip slim-edge detectors • ALIBAVA system finished and distributed • Activity in ATLAS upgrade evaluating BiCMOS technologies • GICSERV working satisfactory

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