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Your Technology Experts …2017

Your Technology Experts …2017. Your Full Service, Time Sensitive, Printed Circuit Board Solution.

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Your Technology Experts …2017

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  1. Your Technology Experts…2017

  2. Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. TeleCom Mil / Aerospace DataCom Industrial Medical 2

  3. Streamline Circuit Corp’s Facility Manufacturing all levels of technology Time sensitive prototyping through production The facility was established in 1982 New management team installed September 2003 70,000 sq. ft. PCB manufacturing facility Complete manufacturing process under one roof 1 mile from the San Jose Airport Delivery convenience for out of state customers Located in Silicon Valley Short car ride away for pick up & deliveries Financially secure in current market conditions Low cost infrastructure Located in Silicon Valley 3

  4. The Team & Their Experience Chuck Dimick- CEO | Founder Over 35 years of experience in PCB manufacturing.  Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson- President | Founder Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak-Vice President of Sales & Marketing | Founder Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Ed Pitney- Operations Manager Over with 34 years of PCB manufacturing experience. Ed spent his early career with NTI Inc. as a Director of Manufacturing Operations later purchased by DDI Global Inc. Steve Morris – Director of Engineering Over 30 years of PWB Design & Engineering experiencing. Former VP of Advanced Technology for Multek (a division of Flextronics) and a key member of the HP PWB Corporate commodity team. JR Ramirez- Production Manager| Founder Over 35 years of experience in the industry. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Lorraine Hook - Director of Quality Over 44 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager. 4

  5. Customer Service Support Customer Service (24 hours - 7 days a week) Sales, Engineering, Manufacturing and Quality Dedicated customer service readily available-our support group’s located onsite in the facility Quick response to all requests such as: Job status Delivery pull-in Quantity Increases Engineering design modification Inside Sales Customer Support 5

  6. Proactive Engineering Services Manufacturing Capabilities Prototype though volume All time sensitive builds DFM (Design for Manufacturability) DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System Controlled Impedance Verification Stack up assistance Copper distribution Material verification Cam Valor Stations 4 Laser Direct Imaging units 6

  7. Pre-Production Engineering Services • “In Plan” planning software • Customer Specific Rules Based Automation • Valor front end CAM (Unlimited Seats) • Industry Standard for front end engineering • Stack up consultations, Service OfferedNo Charge $ • Insight Frontline DFM’s, Service OfferedNo Charge $ • Tech Seminars /Webinars • Material Science, Latest in Laminates and Pre Preg’s • R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready! 7

  8. Quality Reassurance Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification Automated Optical Inspection In house Mil & deliverable Lab 8

  9. On Time Delivery Reassurance 100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification 8 flying Probe Testers Vacuum Lamination press 9

  10. Continuous Improvement Programs Working daily on: Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program Management meetings 7 Laser drills 10

  11. A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28:1 High Aspect Ratio 3.23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. AS9100 Rev. C / ISO 9001 / ISO 13485 Mil-Spec 55110 / ITAR RoHS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24” x 30” Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non-Conductive Filled) 65+ Materials (Hybrid Constructions) 11

  12. PCB TECHNOLOGY ROADMAP Emerging Technology Engineering walk through Standard Manufacturing Advanced Manufacturing .0038” .0038” +/-.001” .003” .003” +/-.001” .002” .002” +/-.00075” .001” .001” +/-.0005” .0005” .0005” +/-.00025” Line Width 1. Line and Space Line Space Tolerance Drill Size .008” +.010” 28:1 .004” +.008” 20:1 .003” +.006” 20:1 .003” +.002” 28:1 2. Drilled Via Size Pad Diam Aspect Ratio Up to 36 Up to .187” <16”X22” 36 to 48 Up to .300” <19”X22” 48 to 60 Up to .350” <22X28 >.350 Layer Count 3. Misc. Attributes Thickness Board Size FR4 Polyimide PTFE HC (Rogers) Nano Foils Alternative Resin Systems Next Generation HSD Advanced Interposers Interposer Substates UTR’s 4. Laminate Materials Rigid Flex Rigid Flex FR4 Stiffeners High Speed Flex High Reliability Flex Data Security UL Multilayers EMI Shield Conductive Bond Ply Thin Flex UL Approved Flex *UTR = Ultra Thin Rigid 12 http://streamlinecircuits.com/high-speed-materials/

  13. TECHNOLOGY ROAD MAP CONTINUED 5. Micro Via Size Emerging Technology Engineering Walk through Standard Manufacturing Advanced Manufacturing .003” +.004” 1:1 Via Size .004” +.005” .6:1 .002” +.004” 2:1 .001” +.003” 3:1 Pad Dam Aspect Ratio HASL Entek Imm Silver ENIG ENEPIG LF HASL Eless Au Sel Solder Imm tin Solder Bump TBD 6. Surface Finishes +/-.003” .006” +/-.002” .003” +/-.001” .002” Tangency Registration 7. LDI Soldermask Min opening Min hole .012” 8:1 .010” 12:1 .008” 18:1 <.008 20:1 8. Conductive and Non-Conductive Via Fill Aspect Ratio 13

  14. Nadcap ISO 9001:2000 IPC 6012,13,15,16,18 Class 3 ITAR AS9100 Rev C Mil-Spec 55110 Mil-Spec 31032 in process

  15. Q-Pulse Total Quality Management • Quality Assurance Systems • Q-Pulse Quality System • NCMR’s and Corrective Actions • Audits • Training • Equipment Calibrations 15

  16. Streamline’s Capital Expenditures • Use advanced equipment technologies to manufacture today's printed circuit board requirements • The future in PCB manufacturing is about technology and automation • Hire and Train equipment operators • High percentage engineering personnel and staff Laser Direct Imaging Cuposit & Electroless Line DES Inner Layer Stripline

  17. V-Stacks: Patented MicroVia technology that will change everything A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology is a cost effective route for advanced technology. 17

  18. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex 8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

  19. IPC Manufacturing Class & Industries 19

  20. Streamline Circuits Corp. 1401 Martin Ave, Santa Clara, CA 95050 USA (877) 264-0343 sales@streamlinecircuits.com

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