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Integration and Test Critical Design Review Rick Sterling University of California – Berkeley

Integration and Test Critical Design Review Rick Sterling University of California – Berkeley Thm_CDR_IT_Revc. Agenda. Agenda Requirements and Responsibilities Facilities (Integration and Environmental) Instrument I&T Requirements Instrument I&T Set-up (MGSE, EGSE) Instrument I&T Flows

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Integration and Test Critical Design Review Rick Sterling University of California – Berkeley

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  1. Integration and Test • Critical Design Review • Rick Sterling • University of California – Berkeley • Thm_CDR_IT_Revc

  2. Agenda • Agenda • Requirements and Responsibilities • Facilities (Integration and Environmental) • Instrument I&T Requirements • Instrument I&T Set-up (MGSE, EGSE) • Instrument I&T Flows • Instrument-Spacecraft Integration • Issues

  3. Responsibilities • Responsibilities • Provide Clean Room Facility (Room 125) • Access Control & Clean Room Training • Develop MGSE • Instrument Harness Mockups & Test Platforms • Fabricate Instrument Harnessing • Support Instrument-Provided GSE • Mu-Metal Enclosures for FGM & SCM • N2 Purge Systems for ESA, SST • Sphere Sensor Boxes for EFI • Integrate & Functional Test of EM, F1-F6 • Provide EMC, MAG, Vibration & TV Testing • Daily Logistic Planning & “Standup” meetings • Deliver & Support to Swales for Spacecraft I&T

  4. Facilities – Integration Lab • Instrument Integration Lab • Secure Key-Coded Lock • Class 100K Clean room • Air Quality Monitored Weekly by Assurance • Positive Air Flow • Feed Thru’s to Adjacent Lab • Gowning Area • Storage Shelving for Component Storage • Separate Flight and non-Flight Storage • Oxygen Sensor (when Nitrogen Purge used) • Used for HESSI, CHIPSAT, Stereo Impact

  5. Facilities - Environmental • Thermal Chambers • Space Sciences Lab • New Chamber for EFI Booms • Cal Chamber Upgrade for SST • Test Chamber Requirements • Pre-Test Clean • Pre-Test Bakeout • TQCM Monitoring • Cryo-Pump • Final Bakeout • GN2 Backfill • Vibration Facilities • Wyle • AMES • EMI/EMC • EMCE Engineering – Fremont Available Chambers Type Comment HiBay L1 TV AXB Booms HiBay L2 TV STEREO 320 T10 TV STEREO 320 Cal Vac ESA Cal 320 “Mini” TV SCM, Bake-outs B20-TV “Bayside” TV EFI B20-Large TV TV Payload TV B20-Cal VAC2 Vac SST Cal SST, IDPU, EFI B20-TV “Snout” TV ESA MCPs 339-TV Cal

  6. “Large Chamber(“Bertha”) • Developed for EUVE • 8’ diam x 16’ depth • Adding thermal capability • Can do two Themis units at a time if desired.

  7. Other Chambers • Basement SSL • Being refurbished

  8. Chamber for Boom Deploy • “Jeffrey” • EFI AXB scheduled for 5/04 • Developed for Stereo • Sharing with Stereo • There is another chamber with “snout” extension for boom deploy testing.

  9. Chamber Schedule

  10. Chamber Schedule

  11. Thermal Testing • TV Plan • 2 Component-Level TV Cycles Prior to Instrument-Level I&T • 6 Instrument Level TV Cycles at Instrument-Level • Survival, Cold Start, Cycles (Functional at extremes), Bake-out • Deployments in Vacuum • SPB: Full Deploy w Takeup reel • AXB: Deploy Hot & Cold • MAG: First Motion Hot & Cold • Typical TV Profile:

  12. Instrument Requirements • Instrument Cleanliness/Contamination Requirements • ESA and SST require continual nitrogen gas purge • Regulate and use viewcam to monitor remotely • Oxygen meter following instruments and gas purge equipment • Normal ESD concerns • Magnetometer sensor to be boxed except when under test and before flight • Instrument-Provided GSE Accommodation • Mu-Metal Enclosures for FGM & SCM • N2 Purge Systems for ESA, SST • Sphere Sensor Boxes for EFI • Instrument Red/Green Tag Items Tracking • IDPU - Arming plug enables actuators causing boom deployment • EFI  - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug • EFI  - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers • SST -  Covers to be removed before flight • ESA -  Cover; Arming plug; purge fitting;cocking pin nut

  13. Integration Set-up - Instruments at SSL integrated on platform same form factor as probe   - 80/20 framing supports platform and sets comfortable work height   - Metal rack alongside holds electrical GSE (power supply, UPS, scope)    - GSE communicates with BAU Simulator via hardwire or ethernet INSTRUMENT PAYLOAD ASSEMBLY PLATE

  14. Instrument Payload I&T Flow Harness Bake-out IDPU-Harness Safe-to-Mate FGM Functional (Level 2) SCM Functional (Level 2) Mag Boom Deploy Mag Alignment MAG INTEGRATION EFI Functional (Level 1) EFI AXB Deploy EFI SPB Deploy EFI Functional (Level 2) EFI/SCM/FGM Phasing EFI INTEGRATION ESA/SST INTEGRATION SST Functional (Level 2) ESA Functional (Level 2) ESA/SST Timing Payload CPT Instrument PER Payload EMC/EMI/MAGl Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review

  15. FGM I&T Flow FGB Vibration FGB/SCB Thermal FGB Acceptance FGM BOOM (FGB) • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics FGS Vibration FGS Thermal FGS Acceptance FGM SENSOR (FGS) • Boom Levels • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics FGE Acceptance IDPU Safe-to-Mate FGM Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance FGM ELECTRONICS (FGE) • Inspection • Backplane • Without FGS • 2 cycles T-V • Bake-out +60C • FGS Functional • (Level 1) • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate FGM Functional (Level 2) Mag Boom Deploy Alignment EFI/SCM/FGM Phasing FGM / PAYLOAD INTEGRATION • Harness • Sensor in TCU PAYLOAD ENVIRONMENTAL Instrument PER Payload EMI/EMC/MAGl Payload T-V Payload Vibration Payload Acceptance • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • FGM Functional Lev1)

  16. FGM Test Configurations • FGM Level 0 – Without Sensor (Aliveness) • B-field about zero if FGM in Cal Mode (preferred mode) • B-field saturated if feedback is closed • Interface full functional • Power consumption reduced by about 200mW • FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test) • B-field about 10,000nT, Noise about 1nT • Full functionality, but B-field not representative • FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • B-field < 10nT, Noise <10pT/sqrt (Hz) • B-field has to be available in full quality • Delta in calibration coefficients known

  17. SCM I&T Flow SCB Vibration FGB/SCB Thermal SCB Acceptance SCM BOOM (SCB) • 14.1g RMS • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics SCM Sensor Vibration SCM Sensor Thermal SCM Sensor Bake-out SCM Sensor Acceptance SCM SENSOR (SCM) • Boom Levels • 3 cycles (air) • Bake-out +60C • Inspection • Mass Properties • DC Magnetics SCM Pre-Amp Thermal SCM Pre-Amp Bake-out SCM Pre-Amp Acceptance IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance SCM PRE-AMP • 3 cycles (air) • Bake-out +60C • Inspection • Mass Properties • DC Magnetics • 2 cycles T-V • Bake-out +60C • SCM Functional • (Level 1) • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate Functional (Level 3) Mag Boom Deploy Alignment EFI/SCM/FGM Phasing SCM / PAYLOAD INTEGRATION • Harness • SCM Sensor in Mu Metal PAYLOAD ENVIRONMENTAL Instrument PER Payload EMI/EMC/MAGl Payload TV Payload Vibration Payload Acceptance • 6 cycles T-V • SCM Functional (Lev 2) • ONLY if req’d • (workmanship) • Test Review

  18. SCM Test Configurations • SCM Safety – Feedback Plug • Required when SCM Pre-Amp is powered and sensor is not connected • SCM Level 0 – With SCM EGSE I/F Box (Aliveness) • Same Power, Command, Analog output interfaces • Power and Cal Mode identification by LED • Cal Signal re-injected to the input • Signal generator connected to input • Validation by analysis of data • SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • Sensor kept in mu metal box during integration • Axis identification • Re-verification of end-to-end calibration • Phase relation • Check of conducted noise • SCM/EField timing reference

  19. ESA I&T Flow ESA Thermal ESA Acceptance ESA SENSOR • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics ETC Acceptance IDPU Safe-to-Mate ESA Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance ESA ELECTRONICS (ETC) • Inspection • Backplane • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate ESA Functional (Level 2) ESA/SST Timing ESA / PAYLOAD INTEGRATION • Harness • Instrument Functional • Cover Simulator Test Instrument PER Payload EMI/EMC/MAG Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • ESA Functional (Lev 1)

  20. SST I&T Flow SST Vibration SST Thermal SST Acceptance SST SENSOR • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics DAP Acceptance IDPU Safe-to-Mate SST Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance SST ELECTRONICS (DAP and ETC) • Inspection ETC Acceptance • Backplane • Without SST • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics • Inspection Payload Safe-to-Mate SST Functional (Level 2) ESA/SST Timing SST / PAYLOAD INTEGRATION • Harness • SST w/ Radiation Source • Attenuator Test Instrument PER Payload EMI/EMC/MAGl Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • SST Functional (Level 1)

  21. EFI I&T Flow AXB Vibration AXB Thermal AXB Acceptance EFI AXIAL BOOM (AXB) • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics SPB Vibration SPB Thermal SPB Acceptance EFI RADIAL BOOM (SPB) • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics EFI Pre-Amp Vibration EFI Pre-Amp Thermal EFI Pre-Amp Bake-out EFI Pre-Amp Acceptance EFI PRE-AMP • 3 cycles (air) • Bake-out +60C • Inspection • Mass Properties • DC Magnetics BEB Acceptance IDPU Safe-to-Mate EFI Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance EFI ELECTRONICS (BEB and DFB) • Inspection • Backplane • Without sensors • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics DFB Acceptance • Inspection Payload Safe-to-Mate EFI AXB Deploy EFI SPB Deploy EFI Functional (Level 2) EFI/SCM/FGM Phasing EFI / PAYLOAD INTEGRATION • Harness • Sensor in Mu Metal Instrument PER Payload EMI/EMC/MAGl Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • EFI Functional (Lev 1)

  22. Instrument I&T with SC • Berkeley to Provide: • GSE Equipment for independent verification instrument operation. • Purge monitoring support • Safety control support (securing of deployable items etc)

  23. Instrument Delivery to SC • Schedule – Overview of Key Dates • ETU: I & T 7/04 – 8/04 • Integrating and Testing Flight Units Fall 2004 – Spring 2005. • Delivery P1:   2/10/05 • Delivery P2:   4/6/05 • Delivery P3:   5/4/05 • Delivery P4:   6/6/05 • Delivery P5:   7/1/05 • With each instrument suite we deliver harnesses, GSE computer, booms, sensors in protection boxes.

  24. Issues • Transportation/Shipping Berkeley to Swales • Ground or commercial air? Under consideration. • Access for Red/Green Tag Instrument Items when all probes on PCA • Logistics and timing of removal/addition of red and green tag items still to be detailed. • Detailed I & T Plans, Functional Procedures, etc. • In development.

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