1 / 11

Maxim 3287 Gigabit Ethernet Design: Optimize Performance & Safety Features

Explore the key components and features of the Maxim 3287 kit for Gigabit Ethernet design, with a focus on performance optimization and safety mechanisms. Learn about testing procedures, laser mounting considerations, and component analysis to ensure reliable networking solutions.

jamesjwillis
Download Presentation

Maxim 3287 Gigabit Ethernet Design: Optimize Performance & Safety Features

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Gigabit Ethernet – IEEE 802.3zThe Choice of a New GenerationDesign Presentation ECE 4006c G2- Gigabit Ethernet Intel/Agilent TX Javier Alvarez, gte006r Astou Thiongane, gt3083a Ebrima Kujabi, gte212s

  2. Objectives • General Use • MAXIM 3287 Kit • Board Specs • Basic Features • Component Analysis • Safety Features • Issues with Laser Mounting • Testing Procedures • Design Board

  3. General Use of MAXIM board • Remove transceiver Module from Intel PRO/1000 Board. • Replace transmitter with MAXIM 3287 • Optical Transmitter Module

  4. Board Specs • Basic Features • Optimized operation at 1.25 Gbps. • Supports a current modulation up to 30mA. • Deterministic Jitter of approx. 22 ps. • Requires a 3.3 V to 5V power supply.

  5. Component Analysis • Differential Input & Output • Eliminates noise in channel • Reference Voltage • Used for programming a laser bias current in VCSEL applications (~0.8mA) • Monitor Diode • Monitors Laser Current • Not supported by board

  6. Component Analysis (Cont’d) • Current Modulation Control (Pin 15) • Temperature Coefficient Control (Pin 16)

  7. Laser Mounting • VCSEL Mounting • Common-Cathode Configuration • Avoiding Laser Ringing or Overshooting • Reduce Length of Leads • Typical Package Leads have inductances of 25nH/in.

  8. Common-Cathode Configuration

  9. Safety Features • Shutdown Driver Output (SHDNDRV) • Power-On Reset (POR) • Resets Laser when turned off. • Rejects Noise caused by VCC during power-on or hot plugging. • Bias Controlling Transistor Driver (BIASDRV) • Transistor placed between BIASDRV and VCC • Ensures Low Noise Operation • Rejects Power Supply Noise • Decoupling Capacitors at VCC & GND

  10. Testing Procedures • The Eye Mask from IEEE 802.3z • Distinction between logical 1 and 0 • Allows to see amount of jitter • Bit Error Testing • Tektronic BERT • Testbed

  11. Board Design • Parts List Consists: • VCSEL (~850 nm) • SMA Connectors • SMA Cable • Resistors • Capacitors • Inductors • 3 to 5 Volt Power Supply Picture provided by: http://www.ece.gatech.edu/academic/courses/fall2001/ece4006/1G2/

More Related