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INFN and Università Bari , Comenius University Bratislava, INFN and

The Silicon Pixel Detector (SPD) for the ALICE Experiment V. Manzari/INFN Bari, Italy for the SPD Project in the ALICE Experiment. INFN and Università Bari , Comenius University Bratislava, INFN and Università Catania, CERN Geneva, Institute of Experimental Physics

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INFN and Università Bari , Comenius University Bratislava, INFN and

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  1. The Silicon Pixel Detector (SPD)for the ALICE ExperimentV. Manzari/INFN Bari, Italyfor the SPD Project in the ALICE Experiment INFN and Università Bari, Comenius University Bratislava, INFN and Università Catania, CERN Geneva, Institute of Experimental Physics Kosice, INFN Laboratori Nazionali Legnaro (LNL), INFN and Università Padova, INFN and Università Salerno, INFN and Università Udine V. Manzari - Quark Matter 2004 - Oakland

  2. 2 strips 2 drifts The Inner Tracking System(ITS) Silicon Pixel Detector 2 pixels Rout=43.6 cm ALICE Layout: the ITS and the SPD ALICE • B-field < 0.5 T • Charged particle multiplicities of up to 8000 per unit of rapidity (head-on Pb-Pb collisions) V. Manzari - Quark Matter 2004 - Oakland

  3. The ALICE SPD • Secondary vertexing capability (c,b) • Track impact parameter resolution: rf < 50 mm • (pt >1.3 GeV/c) • Two barrel layers: Ri = 39 mm, Ro = 76 mm • Inner layer pseudorapidity coverage: || < 1.95 • [ITS coverage || ≈ 0.8] • Total Si surface: ≈ 0.24 m2 • Individual pixel cell: 50 mm (rf) x 425 mm (z) • Occupancy (central Pb-Pb): < 2% Track densities at r = 4 cm (1st pixel layer): up to 100/cm2 • Radiation level at the inner layer for 10 years standard running: • TID ≈ 5kGy, F ≈ 6•1012 (1MeV neq)/cm2 (working values!) V. Manzari - Quark Matter 2004 - Oakland

  4. LV cables MCM & bus lines Capillar tubes CuNi 1.5/1.8 mm Optical fibers: 18 fibers/sector Service harness @ RB24 V. Manzari - Quark Matter 2004 - Oakland

  5. Carbon Fiber Support Sector (CFSS) SPD Mounting The 2 barrels will be built of 10 sectors 6 staves/sector (2 from inner layer and 4 from outer layer) Material budget (each layer): ≈ 0.9% X0 (Si ≈ 0.37, cooling ≈ 0.3, bus ≈ 0.17, CFSS ≈ 0.1) V. Manzari - Quark Matter 2004 - Oakland

  6. Ladder (5 chips+1sensor) Cooling tubes: 1 mm diameter, 40 mm thick wall MCM SPD Sector • FE power dissipation/sector: ≈ 150 W • Cooling: C4F10 (evaporative), operating temperature ≈ 25°C • Cooling test with a prototype module is currently under way V. Manzari - Quark Matter 2004 - Oakland

  7. Bus Bonds Readout Chip Sensor SPD Half-Stave SMD Components Optical Fibers Carbon Fiber Support Pilot MCM V. Manzari - Quark Matter 2004 - Oakland

  8. 13.5 mm 15.8 mm ALICELHCb1 Pixel ASIC • Mixed signal (analogue, digital) • Produced in a commercial • 0.25µm CMOS process (8” wafers) • Radiation tolerant design • (enclosed gates, guard rings) • 8192 pixel cells • 50 µm (rf) x 425 µm (z) pixel cell • ~100 µW/channel • ~1000 e- mean threshold (~200 e- RMS) • ~120 e- mean noise V. Manzari - Quark Matter 2004 - Oakland

  9. Pb-Sn Bump Bond VTT Bump-Bonding • VTT/Finland • Pb-Sn solder bumps: ~25µm diameter • p-in-n silicon sensor: 200mm thick (Canberra) • IBM readout chips: 750mm native thickness • thinned to 150mm after bump deposition • stand-off: ~20µm (Pb-Sn) SEM Pictures V. Manzari - Quark Matter 2004 - Oakland

  10. SPD Ladder • 1 p-in-n sensor (200mm thick) • 5 readout chips (150mm thick) • 4960 bump bonds • Idet @50V=120-200nA, Vfd=15V • Sr-Measurements : • Chip43 Chip46 Chip42 Chip32 Chip30 • Working pixels 99.7% 99.95% 99.98% 99.98% 100% • Missing pixels 28 4 2 2 0 Chip 43 Chip 46 Chip 42 Chip 32 Chip 30 V. Manzari - Quark Matter 2004 - Oakland

  11. Multi Chip Module (MCM) Multi Chip Module (MCM) ALICE1LHCb chip • Analog Pilot (AP) • Digital Pilot (DP) • GOL (Giga-bit optical link) • Optical Module (OM) AP • Optical Module • Laser and pin diode • In Si-case • 1.2 x 17 x 5.5 mm3 • Analog Pilot: • Reference bias • ADC (T, V and I monitor) DP GOL OM • Digital Pilot: • Timing, Control and Readout • Outogoing Data Stream • Trigger and JTAG configuration data • LHC 40 MHz clock V. Manzari - Quark Matter 2004 - Oakland

  12. 2mm 11mm SMD component 7 7 7 7 6 6 5 5 4 3 2 2 1 1 PIXEL DETECTOR Aluminum Polyimide READOUT CHIP Glue COOLING TUBE SPD Multilayer Bus • 5 layer Al-Kapton flex 240 mm thick • wire bonds to the readout chips and MCM • provides data -, control- and power-lines between readout chips and MCM 240µm 200µm 150µm V. Manzari - Quark Matter 2004 - Oakland

  13. AGND 300µm VVDA 300µm SIGNALS 300µm VDD GND Wire Bonding on Bus and Ladder • ~1100 Wire bonds/half-stave • 25µm diameter wire • Bonding pads on the bus: 80 x 300µm2 • Step height: 40-60µm V. Manzari - Quark Matter 2004 - Oakland

  14. SPD Components 1200 read out chips 240 sensors 240 Bump bonded ladders 120 MCMs 120 buses 120 half-staves 10 sectors ALICE SPD 2 spare sectors + 1 pre-production sector V. Manzari - Quark Matter 2004 - Oakland

  15. Ladder 2 Ladder 1 MCM MCM Carrier bus Extender bus Adhesive Mask Half-stave Assembly (I) Side view Top view V. Manzari - Quark Matter 2004 - Oakland

  16. Half-stave Assembly (II) V. Manzari - Quark Matter 2004 - Oakland

  17. SAS GGT RSS Stave Alignment System Rotating Sector Support Grease & Glue Tower Stave Jig Tower SJT Barrel Sector Assembly System (I) V. Manzari - Quark Matter 2004 - Oakland

  18. Barrel Sector Assembly System (II) V. Manzari - Quark Matter 2004 - Oakland

  19. Target SingleAssemblies 2003 Beam Test Setup SPD Testbeam Setup (In-beam) • 158 GeV/A In ion beam • ≈ 104 ions/spill • 15 days • Pb target 4mm thick • 120 GeV protons • 3 days Pb-Target Plane 0 1 2 3 Table Quartz MWPC Scintillators Table: 150 cm Half-stave • Up to 6 planes (= 5 singles + half stave) in the beam (up to 122 880 active pixels) • Plane 0 - Plane 3 distance ≈ 80 cm, vertically adjusted for tracking • Target: 4 mm Pb • Trigger: quartz counter (beam) + 2 cm x 2 cm scintillator (interactions) • Half-stave read out through MCM including optical module • 2.8 GB of data collected • DCS (PVSS) system for HV V. Manzari - Quark Matter 2004 - Oakland

  20. First Results (very preliminary) Hit correlations between the planes (stripped In ion beam) V. Manzari - Quark Matter 2004 - Oakland

  21. Indium Ion Beam on Single Assembly Beamspot (32V sensor bias) 104 ions/spill Rows Columns V. Manzari - Quark Matter 2004 - Oakland

  22. Summary • Challenging constraints on geometry and material budget. • Specific technology developments and extensive tests of the SPD components have been carried out. • Half-stave and Sector assembly procedures have been developed and tests with dummy components are currently being completed. • Construction of prototypes with real components has been started: • a half-stave with real ladders has been delivered for cooling test, a half-stave for the validation of the multilayer bus with working ladders is under construction. • SPD components have been tested in a heavy-ion beam (October 2003): offline analysis of collected data ongoing. V. Manzari - Quark Matter 2004 - Oakland

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