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The Development of Tin Whiskers in Lead-free Solder

The Development of Tin Whiskers in Lead-free Solder. Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co -Investigator Palmetto Scholars Academy North Charleston, SC. Tin Whiskers. S mall , crystalline structures

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The Development of Tin Whiskers in Lead-free Solder

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  1. The Development of Tin Whiskers in Lead-free Solder Joseph Garveyand Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto Scholars Academy North Charleston, SC

  2. Tin Whiskers • Small, crystalline structures • 0.006 to 10 micrometers thick and up to 10 millimeters long • Havebeen known to cause short circuits • Causes are unknown-- theories say they could be caused by compression

  3. Tin whiskers have degraded or destroyed… • Galaxy IIIR • Galaxy VII • Solidaridad 1 • OPTUS B1 • DBS-1 • PAS-4 • DirecTV 3 • Pacemakers • Patriot and Phoenix missiles • Cellphones • Computers

  4. Experiment Design • 120 mm x 5 mm x 2 mm (99.3% tin, 0.7% copper) rectangular piece of tin made from tin solder (quantity of 4) • 120 mm x 5 mm x 2 mm fiberglass, copper clad circuit board (quantity of 4) with a maximum of 4 mL of copper cladding; fiberglass is 0.1 cm in height, copper cladding is .06 cm in height • Max of 3g of tin solder (percentage by weight): maximum of 97% tin; maximum of 4.2% silver; maximum of 3% hydrogenated rosin; maximum of 0.9% copper • Polyethylene foam packing cylinders for securing test bed and PCBsin tube (10 cylinders -- 0.5 cm in diameter, 1.27 cm in depth)

  5. Our FME Key for test tube This is a depiction of what our type 1 FME will look like. Red= electroplated tin testbed 120 mm x 5 mm x 2mm Orange= printed circuit board 120 mm x 5 mm x 2 mm Blue= Polyethylene foam packing 0.5 cm in diameter, 1.27 cm in depth Black= plugs to seal the test tube White= test tube

  6. Experiment Design • 4 Type 1 FME’s will be constructed in the same manner according to the instructions above. • 1 Type 1 FME will be randomly selected for spaceflight. • The ground truth FME’s will be static but oriented in a different position: • One ground truth FME will be oriented vertically • One ground truth FME will be oriented upwards • One ground truth FME will be oriented downwards

  7. Our Goal We want to determine whether spaceflight affects the development of tin whiskers We expect that the FME that goes to the ISS will develop more tin whiskers than the ground truths.

  8. Data Analysis • Mass will be measured with a microscale from College of Charleston • Solder will be analyzed with a scanning electron microscope from National Oceanic and Atmospheric Administration

  9. Acknowledgements Partners • Space and Naval Warfare Systems Command (SPAWAR) • Center for the Advancement of Science in Space (CASIS) • National Center for Earth and Space Science Education • College of Charleston • Citadel University • Medical University of South Carolina (MUSC) • National Oceanic and Atmospheric Administration (NOAA) Sponsors • ISHPI • Google • South Carolina Space Grant Consortium • Center for the Advancement of Science in Space (CASIS)

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