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真空报告

真空报告. 2009-06-09. 内、外真空. 内真空 5.22 号开始抽气,检漏; 5.25 装锂,重新抽气; 5.26 光谱换玻璃窗口、暴露大气, 27 日装锂重新抽气; 6.1 汤姆逊散射插板阀漏大气到 20000Pa ,重新充气装锂,重新抽气 , 开始烘烤; 6.5 内真空 Ar 放气源找到(软 X 射线能谱水平窗口的铍膜),对该系统抽气后真空从 8E-5 降低到 3E-5 ; 6.2 开始 GDC 。 6.4 内真空细检。 外真空 排除一个大漏(交叉密封圈已碎,真空只能抽到 40000Pa ,涂覆 703 胶后排除);

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真空报告

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  1. 真空报告 2009-06-09

  2. 内、外真空 • 内真空 • 5.22号开始抽气,检漏; • 5.25装锂,重新抽气; • 5.26光谱换玻璃窗口、暴露大气,27日装锂重新抽气; • 6.1汤姆逊散射插板阀漏大气到20000Pa,重新充气装锂,重新抽气,开始烘烤; • 6.5内真空Ar放气源找到(软X射线能谱水平窗口的铍膜),对该系统抽气后真空从8E-5降低到3E-5; • 6.2开始GDC。6.4内真空细检。 • 外真空 • 排除一个大漏(交叉密封圈已碎,真空只能抽到40000Pa,涂覆703胶后排除); • 一个4E-6Pa.m3/s外漏位置难以接近,没有排除; • 排除一个~E-2Pa.m3/s外漏,真空从8E-2降低到6E-4; • 内漏情况: • 磁体打He压10Kg时,漏率4.57E-5Pa.m3/s; • N2回路2Kg时,漏率7.3E-5Pa.m3/s

  3. 烘烤 • 5.27开始烘烤: • 内衬烘烤:283小时 • 感应烘烤:86小时 • 辉光 • He:44小时 • D2:6小时

  4. 装置真空度演变

  5. 内真空 质谱

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