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YAGEO DG Marketing Dec 15, 2004

YAGEO. Passive Components Introduction ---- MLCC ----. YAGEO DG Marketing Dec 15, 2004. Content:. 1. MLCC introduction MLCC Reliability test MLCC application Product Introduction & Development. Construction of MLCC. Terminations. Electrodes. Ceramic Green Sheet. Printed Electrode.

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YAGEO DG Marketing Dec 15, 2004

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  1. YAGEO Passive Components Introduction----MLCC---- YAGEO DG Marketing Dec 15, 2004

  2. Content: • 1. MLCC introduction • MLCC Reliability test • MLCC application • Product Introduction & Development

  3. Construction of MLCC Terminations Electrodes Ceramic Green Sheet Printed Electrode Electrode End Ceramic Material

  4. Dielectric material Electrode Grain Grain Boundary Ø BaTiO3 ,CaTiO3, SrTiO3 , NbTiO3 , TiO2 , La2O3 ... Type I (Class I) : Temperature Compensation ex. NP0 (COG) Type II (Class II) : High Dielectric Constant ex. X7R, X5R, Y5V, Z5U

  5. The principle of capacitance designing Electrode Ceramic W effective Distance L effective e= Permittivity of ceramic e0 = 8.841910-12 F/m A = Area, (LeffxWeff) Ne = Number of electrode D = Distance of electrode A x ( Ne-1 ) Capacitance = e e0 D Unit : F (farad, from Faraday)

  6. Values of dielectric constant K (= e e0 )

  7. MLCC material and construction Plating Termination Noble Metal Electrode (NME) MLCC Base Metal Electrode (BME) MLCC Pd/PdAg/Ni Sn Ni Ag/Cu Ceramic

  8. MLCC Production Process PdAg Ni PVA NPO H20 foil Ball Mill Slip Foil Casting Drying Screen Printing 1100~1300C Sintering Binder Burn Out Notching Pressing Tumbling Dipping/Curing Plating Testing Taping

  9. Principle of Notching Process Upper Knife N/T knife : 30um Apply extrinsic stress from upper/lower knife to break product spontaneously Lower Knife

  10. Principle of Notching Process Top & Bottom Surface Side Notching Surface

  11. The classification of ceramic material Type I (Class I) : Temperature Compensation Liner function of cap. with temp. ex. NP0 (COG) Type II (Class II) : High Dielectric Constant Non-liner function of cap. with temp. ex. X7R, X5R, Y5V, Z5U

  12. Symbols of temperature coefficients (EIA) Ex. : C0G = NP0, T.C.= 0  -1  30 ppm C : 0 N : Negative 0 : -1 P : Positive G : 30 ppm 0 : 0 Class I

  13. Temperature coefficient of class I MLCC

  14. Symbols of temperature characteristics (EIA) Ex. : X7R Y5V Z5U X : -55C Y : -30 C Z: +10 C 7 : +125 C 5 : +85 C 5 : +85 C R : 15% V : +22 to -82% U: +22 to -56% Class II, & III

  15. Temperature coefficient/characteristic of MLCC

  16. Content: • 1. MLCC introduction • MLCC Reliability test • MLCC application • Product Introduction & Development

  17. Test Specification & Reference Documents • YAGEO Product Spec. • IEC 60115-8 Clause • IEC 60068 Method • JIS 5202 General rule • JIS 5201 Test method • EIA/IS 703 • MIL-STD-202F

  18. MLCC Electrical Characteristic

  19. MLCC Environmental Characteristic

  20. Content: • MLCC introduction • MLCC Reliability test • MLCC application • Product Introduction & Development

  21. Measuring conditions of MLCC

  22. A. Capacitance measuring low • Cause: • Equipment Accuracy- measuring range limitation • Measuring Environment

  23. Temperature Coefficient/Characteristic 20 NP0 10 • Requirement: •  C/C = (C1-C0)/C0 • NP0:  30 ppm/° C • X7R:  15% • Y5V: +22% ~ -82% • Z5U: +22% ~ -56% 0 -60 -40 -20 0 20 40 60 80 100 120 140 -10 ° Temperature ( C) X7R -20 -30 C/C (%) -40 D Z5U -50 -60 -70 Y5V -80 Temperature characteristic vs Ceramic material -90

  24. B. Poor Solderability

  25. Six factors cause poor solderability a. Preheating and heating conditions b. Temperature distribution inside the furnace and on the board 1. Uneven heating a. Termination shape and dimensional accuracy b. Termination solder wettability 2. Chip components 3. Board material and thickness 4. Land shape, geometry (relation with chip termination dimensions), and land solder wettability a. Flux composition, chemical activity b. Solder amount (coated area and coating thickness) and coating accuracy 5. Solder paste 6. Reflow soldering method selected

  26. The theory of thermal shock effect Termination Sn/Pb and Ni over Ag glass frit (CTE=18ppm/ C; dT=381W/m K) Ceramic (CTE=9.5~11.5ppm/ C; dT=4~5W/m K) F F F Electrodes (CTE=16ppm/ C; dT=140W/m K) F MLCC structure with coefficients in thermal expansion (CTE) and thermal conductivities (dT) listed

  27. The typical failure modes in the board bending test Small and thick chip capacitors (0603, 0805 & 1206) Small and thin chip capacitors (0603, 0805 & 1206) Crack Crack Land pattern Land pattern Solder Solder Board Board Small and medium thick chip capacitors (0603, 0805 & 1206) Large chip capacitances (1812 & 2220) Crack Crack Land pattern Land pattern Solder Solder Board Board

  28. Bending test method

  29. The stress vs. position on PCB during bending Chip mounting close to board separation point Prerouted Corners to Relieve Stress 0.200”(5 mm) Minimum 5 4 Perforation Pre-routed corners 2 2 3 1 Shear line Slit SMT components Magnitude of stress 1 > 2  3 > 4 > 5 Multi-assembly panel

  30. Content: • MLCC introduction • MLCC Reliability test • MLCC application • Product Introduction & Development

  31. Focus applications Communications Consumer Multimedia Automotive & General Industrial Computing

  32. Standard Capacitance Series Range

  33. Yageo’s product portfolioMultilayer Ceramic Capacitors (MLCC) • Dielectric: NP0, X7R (X5R), Y5V, Z5U • Rated voltage: 6.3V to 4 kV • Size: 0201 - 2220 • Terminations: NiSn, NiAu • Special ranges: • High capacitance values • High voltage • Micro wave • Capacitor arrays • Low inductance capacitors • Ultra small • X2Y • Low profile

  34. Tolerance vs. type & TC

  35. YAGEO MLCC Coding Rule

  36. Integration components development trends R-Array R-Network More Functionality Design RC Network C-Feed-throgh C-Array C-Network Fine Pitch Design

  37. Integration 2-capacitor array • Only 50% less space comparable to 0402 discrete capacitors. • Save the pick and place cost by using capacitor arrays • Low inductance characteristics • High capacitance per unit volume • NP0 10pF to 1nF • X7R 120pF to 150nF

  38. Cost saving by using C-array

  39. Low inductance MLCC ESL Measurement of CMC X7R / 100nF Types 1.0 • Lower Equivalent Series Inductance (ESL) and higher noise absorption than traditional MLCC. • Lower inductance and higher Self-Resonant Frequency (more bandwidth) 1206 0603 Inductance (nH) 0.5 0805 0612 0508 0.0 10MHz 100MHz 1GHz 10GHz Frequency Total 33 pieces of 0508 LIC used

  40. MLCC application in semiconductors

  41. Ceramic capacitor trend for miniaturization application Small Size YAGEO Solution Miniaturization 0201 C-array Integration RC Network Thinner Low profile

  42. Miniaturization trend 0201 0402 0603 0805 1206 >1206

  43. Advantages of product miniaturization

  44. Miniaturization down to size 0201 Power amplifier module with 0402 MLCC 6*6 mm2 Power amplifier module with 0201 MLCC (same scale) 6 mm

  45. Technology trends discrete ceramics Higher Capacitance Values 100µF 10µF 1µF Higher Dielectric constant Thin-layer technology Higher Voltages Miniaturization -DC up to 4kV - Pulse load High Accuracy Technology 1206, 0805, 0603, 0402, 0201 CUSTOMER High Frequency Integration - Microwave - Narrow tolerance - Low inductance - Feed Through - X2Y Capacitor/Resistor array’s R/ RC Networks Cost effective Bulk case Base metal electrodes (BME)

  46. 物質名稱 • Environmental Concern • According Sony SS-00259 2nd version 重金屬 Cadmium and cadmium compounds 鎘及鎘化合物 Lead and lead compounds 鉛及鉛化合物 Mercury and mercury compounds 汞及汞化合物 Hexavalent chromium compounds 六價鉻化合物 有機氯化合物 Polychlorinated biphenyl 多氯聯苯(PCB) Polychlorinated naphthalene 多氯化萘(PCN) Chlorinated paraffin 氯代烷烴(CP) Mirex 滅蟻靈 Other chlorinated organic compounds 其他有機氯化合物

  47. 有機溴化合物 Polybrominated biphenyls 多溴聯苯(PBB) Polybrominated diphenyl ethers 多溴二聯苯 Tetrabromobiphenol-A-bis-(2,3-dibromopropylether) TBBP-A-bis 四溴雙酚-A-雙-(2,3-二溴丙醚)(TBBP-A-bis) Other brominated organic compounds 其他有機溴化合物 Organic tin compounds (Tributyl tin category & Triphenyl tin category) 有機錫化合物(三丁基錫化合物,三苯基錫化合物 Asbestos 石綿 Azo compounds 偶氮化合物 Formaldehyde 甲醛 Polyvinyl chloride (PVC) and PVC blends 聚氯乙烯(PVC)以及聚氯乙烯化合物

  48. Item Material 物质 • New European Directives Restriction on Hazardous Substances [ROHS] 1 Lead 铅 2 Mercury 汞 3 Cadmium 镉 4 Hexavalent Chromium 六价铬 5 Polybrominated Biphenyls (PBB) 联本基复合溴 6 Polybrominated Diphenyl Ethers (PBDE) 乙醚溴苯复合溴

  49. Yageo MLCC Meet Sony SS-00259 2nd version Requirement Technology Roadmap for Technology Roadmap for Leadfree Termination Components Leadfree Termination Components ~2000 2001 2002 2003 A. Sample Request for Customer MLCC Rchip B.Manufacture Technology Ready MLCC Rchip C. Quality Evaluation MLCC (test by LF solder paste) Rchip D.SMT Application Evaluation MLCC (Cooperate with customers) Rchip

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