1 / 66

電信等級開放平台 AdvancedTCA 之技術趨勢與規格介紹

電信等級開放平台 AdvancedTCA 之技術趨勢與規格介紹. 黃嘉淵 博士 工研院電通所 2005/12/02. Agenda. Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others. 通訊產業海外產值增長趨勢. 國內成熟的通訊產品近年來生產基地持 續外移， 其中包括了國內產值前三名的 產品， WLAN 、 SOHO Router 、 DSL CPE 。

joanne
Download Presentation

電信等級開放平台 AdvancedTCA 之技術趨勢與規格介紹

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. 電信等級開放平台AdvancedTCA之技術趨勢與規格介紹電信等級開放平台AdvancedTCA之技術趨勢與規格介紹 黃嘉淵 博士 工研院電通所 2005/12/02

  2. Agenda • Preface • What is AdvencedTCA • Mechanical • Shelf management • Power distribution • Thermal • Data transport • MicroTCA and others

  3. 通訊產業海外產值增長趨勢 • 國內成熟的通訊產品近年來生產基地持 • 續外移， 其中包括了國內產值前三名的 • 產品，WLAN、SOHO Router、DSL CPE。 • 提升國內產值的策略為，持續研發高技 • 術性之通訊產品以提升國內廠商之技術 • 水準， 增加產品的附加價值，減低對低 • 勞工成本的依賴。 Source: IEK 2005

  4. 網通產業的現況與升級契機 • 產業現況 • 台灣廠商以SOHO/SME/CPE 端低價設備量產為主，利潤微薄 • 全球新興網路與服務佈建快速成長, IP/Ethernet為基礎建設之主流 • 電信等級基礎與應用設備將是高附加價值的重要市場 電信等級(Carrier Grade)技術為我國通訊產業升級之核心關鍵 • 產業升級契機 • 電信等級設備由私有(Proprietary)架構趨向標準開放架構 • 標準開放架構具備標準化及模組化之特性，有利於國內廠商切入原為Proprietary 封閉技術之電信設備市場，將造成產業供應生態結構性的改變，不再由少數大廠壟斷 • 國內產業現有domain knowledge + 電信等級技術 切入 電信等級標準化模組 供應鍊 • 累積各種 電信等級標準化模組，建立標準開放平台技術能量促成各種高附加價值電信等級設備與應用服務產業發展

  5. 將注入更多的服務創新 !! Validation & Test Validation & Test Software & Solution R&D Software & Solution R&D 全心投入解決方案的開發 Platform R&D Proprietary Hardware and ASICs Platform R&D 利用標準模組快速建立平台 Commercial Processors and Building Blocks 開放架構設備開發成本 傳統設備開發成本 開放架構平台的影響-更專注於提供創新的Total Soultion

  6. 電信等級開放平台相關標準 Standards-BasedOpen Commun. Arch. Proprietary Standards Bodies Network Element Network Element Service Availability Forum AIS/HPI/SMS specs Proprietary & 3rd party Applications Proprietary Applications OSDL Carrier-Grade Linux Std. App API HA Middleware Proprietary HA Middleware NGN Services & Infrastructure Std. Platform API PICMG 3.X AdvancedTCA Proprietary Real-time OS Standard Carrier Grade OS IEEE 802.3ap Backplane Ethernet Standard HA Hardware Proprietary Hardware ASI-SIG Commercial Backplane Fabric/Silicon Proprietary Fabric/Silicon ITU-T OCAF-CGOE AIS: Application Interface Spec HPI: Hardware Platform Interface SMS: System Management Spec. OSDL: Open Source Development Labs NGN: Next Generation Networks SAF: Service Availability Forum PICMG: PCI Industrial Computer Manufacturers Group AdvancedTCA/ATCA: Advanced Telecommunications Computing Architecture ASI-SIG: Advanced Switching Interconnect Special Interests Group OCAF: Open Communications Architecture Forum CGOE: Carrier Grade Open Environment

  7. Blades Chassis Platform Software Middleware Applications Operating System IWF IWF GbE Switch GbE Switch GbE Switch GbE Switch GbE Switch Carrier Card Carrier Card RTU (DSP or NPU) RTU (DSP or NPU) Disk Module Disk Module Quad OC-3c I/F Quad OC-3c I/F Quad OC-3c I/F Quad OC-3c I/F GbE I/F GbE I/F GbE I/F GbE I/F DP Switch DP Switch DP Switch DP Switch DP Switch SS7 Processor SS7 Processor SS7 Processor E1/DS1 I/F E1/DS1 I/F E1/DS1 I/F E1/DS1 I/F Compute Module Compute Module Compute Module Compute Module Compute Module MediaGateway BladeServer SGSN RNC CG Linux CG Linux CG Linux CG Linux CG Linux 開放架構模組化之彈性組合 可重覆使用之模組 共通之機架, OS, &平台軟體 SGSN:Serving GPRS Support Node RNC: Radio Network Controller

  8. Source: Intel

  9. 電信等級開放平台市場趨勢 Open Std. Chassis market**: CAGR=54.4% ATCA’s CAGR = 104.9% ATCA’s share in 2009 = 64.5% ATCA is the main stream of OSC in Comunications * Other OSCs include CompactTCA, MicroTCA, VMEbus, and BladeCenter ** Market segments counted for OSC: Service Provider Edge/Core, DSLAMs,VoIP GW, SoftSW, MultiService Switches, IP Service Switches, GE Switches, Voice Switches, Telco Servers, MSPPs, Cellular Infrastructure Equipment, Other. ATCA CAGR in: Communications =104.9% Enterprise >220% Carrier Grade characteristicsalso fit Enterprise’s needs CAGR = Compound Annual Growth Rate Source: In-Stat, 02/05

  10. ATCA Shelf ATCA shelves are designed to fit 19,23-inch,or ETSI cabinets and provide between 2 and 16 slots. Sources :Motorla 14 slots(left), Schroff 5 slot(right))

  11. ATCA Components

  12. RadiSys and Continuous Computing Shelf RadiSys Promentum ATCA-3000 Continuous Computing FlexChassis ATCA-5U-5(left) ATCA-12U-14

  13. PICMG history • PCI Industrial Computer Manufacturers Group (PICMG) • PICMG's original mission was to extend the PCI standard for computer systems • PICMG (founded in 1994) • over 450 companies • http://www.picmg.org • PICMG Europe: • 61 members • http://www.picmgeu.org/ • PICMG Japan • 27 members • http://www.picmg-japan.com • PICMG China (1998-02-20 founded) • 25 members • http://www.compactpci-systems.com/columns/picmg/china.html

  14. PICMG 1.X • Specifications: • PCI/ISA (1.0)-1994, 13 page • PCI-ISA card edge connector proposal for single board computer • PCI/ISA Bridging (1.1)-1995, 21 page • PCI-PCI bridge board specification for single board computer • PCI Only (e-PCI-X) (1.2)-2002, 34 page • Embedded PCI-X specification for system host boards and backplanes supporting single or dual PCI-X busses

  15. CompactPCI(PICMG 2.X) • Specifications: • PCI/ISA(1.0) -> CompactPCI(2.0) • 2.0->2.20 • 2.50 CompactTCA • CompactPCI objectives • CompactPCI use industry standard mechanical components and high performance connector technologies to provide an optimizes system intended for rugged applications

  16. What is AdvancedTCA? • Specifications: • PCI/ISA(1.0) -> CompactPCI(2.0) -> AdvancedTCA Serial Interconnect(3.0) • Advanced Telecommunication Computing Architecture (AdvancedTCA) • PICMG 3.X family of standards • Primary application focus: • Telecom Carrier Grade applications based on standard fabric solutions

  17. AdvancedTCA Standards • Base Spec (PICMG3.0) covers mechanical, power, cooling, interconnect of the AdvancedTCA family of specs • ratified 12/30/2002 • Subsidiary specs: • 3.1: Ethernet and Fiberchannel Transport • 3.2: InfiniBand Transport • 3.3: StarFabric Transport • 3.4: PCI Express Transport • 3.5: Serial RapidIO • Additional PICMG efforts: • AMC.0 AdvancedMC Mezzanine Module • AMC.1 PCI Express and AS on AMC • AMC.x Ethernet on AMC • AMC.y Fibre Channel on AMC • AMC.z Serial ATA on AMC • SFP.0 System Fabric Plane

  18. AdvancedTCA Standards Source: Intel

  19. Agenda • Preface • What is AdvencedTCA • Mechanical • Shelf management • Power distribution • Thermal • Data transport • MicroTCA and others

  20. ATCA Mechanical Requirements • Targeted for 16 slot shelves in 600 mm ETSI cabinets • 14 slots will fit in an EIA 19” cabinet • 23” telecom cabinets also supported • Large enough board for future requirements • Increased board pitch and room for SMT components on rear side • Cooling for 200W per board • No exotic (expensive) cooling systems • Reliable mechanics • Serviceability, shock and vibration • EMC

  21. Chassis Mechanical

  22. Chassis Mechanics

  23. Board Mechanics • Front board size 8U x 280 mm • Rear board size 8U x 70 mm • Connects directly to front board • Board width 6HP (1.2”) • PCB thickness: 1.6mm - 2.4 mm allowed • Simplified Telecom Packaging • Provisions for 4 PMCs • Provisions for 8 AMCs • Alignment/Key pins

  24. AMC Mechanics • New mezzanine for ATCA carriers • 12V power source • 60 W maximum dissipation • 181.5 mm deep modules • Single/double width module • 73.8 mm wide for single width • 148.8 mm wide for double width • Half/full height modules • 13.88 mm high for half height • 28.95 mm high for full height

  25. Board Mechanics, Component Height • 21.33 mm maximum component height on side 1 • maximum component height on side 2 depends on the board design • ~1.99 mm with flexible side 2 cover and 1.6 mm PCB • ~1.19 mm with flexible side 2 cover and 2.4 mm PCB • ~2.45 mm with 1 mm rigid side 2 cover and 1.6 mm PCB • ~1.65 mm with 1 mm rigid side 2 cover and 2.4 mm PCB

  26. Chassis Mechanics, Sheet Metal

  27. Board Mechanics, ESD Discharge Strips • ESD discharge strips on bottom edge of Front Board and RTM • Segment 1: 10 MOhms to Face Plate • Discharges installer • Segment 2: 10 MOhms to Logic Ground • Discharges board • Segment 3: 0 Ohms to Face Plate • Solid ground even if the board is not mated with the backplane

  28. Board Mechanics, Alignment & Keying • Four stages of alignment • Subrack Guide Rails • Backplane alignment/key pins • Front Panel alignment/key pins • Connectors • Front Board key (A1) • RTM key (rA1) • Front Board to RTM key (A2) • Eight key and receptacle positions • 64 possible combinations

  29. Agenda • Preface • What is AdvencedTCA • Mechanical • Shelf management • Power distribution • Thermal • Data transport • MicroTCA and others

  30. Purpose of Shelf Management • Monitor & control low-level aspects of ATCA boards and other Field Replaceable Units • Watch over basic health of the shelf, report anomalies, take corrective action when needed • Retrieve inventory information & sensor readings • Receive event reports and failure notifications from boards and other intelligent FRUs • Manage power, cooling & interconnect resources (electronic keying) • Enable visibility into a shelf for a logical System

  31. System Management view

  32. Typical Shelf-Management Modules

  33. FRU • Field Replaceable Unit (FRU) • Define two types of FRUs • Intelligent FRUs include IPM Controller • Managed FRUs are either Intelligent or represented by an Intelligent FRU • Directly attaches to IPMB-0 must an Intelligent FRU • IPMC may implement additional FRUs • Sensor Data Records (SDRs)

  34. Internet Protocol based services • Simple Network Management Protocol • Remote Boot • Disk Services • Web-Based Enterprise Management Protocol • Remote Management Control Protocol

  35. IPM Controller Interfaces

  36. Agenda • Preface • What is AdvencedTCA • Mechanical • Shelf management • Power distribution • Thermal • Data transport • MicroTCA and others

  37. Power Requirements • -48/-60 VDC power input • -40.5 to -57 VDC, -50 to -72 VDC • Redundant power inputs • Distribution of ringing voltages • Capacity of over 3,200 Watts per shelf • Local power conversion • DC-DC converters on each board

  38. Power Distribution

  39. Zone 1 Connector

  40. Board power sequencing • Power and ground sequencing • 1. ESD segment #1 and the Guide Rail provide the first electric contact • 2. The first pins to mate in the power connector are the logic and Frame/Shelf Grounds and the EARLY_A; EARLY_B;VRTN_A; and VRTN_B pins. • 3. The last pins to engage in the power sequence are the enable pins ENABLE_A and ENABLE_B • Management power(<10W) • Payload power

  41. Board power sequencing

  42. Agenda • Preface • What is AdvencedTCA • Mechanical • Shelf management • Power distribution • Thermal • Data transport • MicroTCA and others

  43. Shelf – Cooling • 200 Watts per slot • – Dual slot up to 400 Watts • Airflow Direction • Bottom to top • Right to left • Minimum requirement to support 5 W RTMs

  44. How much flow per slot

  45. Slot operating point

  46. Agenda • Preface • What is AdvencedTCA • Mechanical • Shelf management • Power distribution • Thermal • Data transport • MicroTCA and others

  47. Data transport zone (Zone 2)

  48. Base and Fabric Channels

  49. Zone 2 Backplane Interfaces • Base Interface • 10/100/1000 BASE-T Ethernet • Dual Star fabric topology • Fabric Interface • SERDES (3.125 Gbps min) • 1x, 2x, or 4x Channels • Star or Mesh fabric topology • Interoperability defined by subsidiary specifications • Synchronization Interface • Three dedicated clock interfaces(8kHz, 19.44 MHz, user defined) • Redundant buses • MLVDS signaling • Update Channel • Point to point connection between two slots

  50. ATCA backplanecommunication topologies

More Related