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电镀工艺学. 第十一章 复合电镀. Plating technology Chapter ⅩⅠ Composite plating. Plating technology Chapter Ⅰ Introduction. 电镀的基本概念 定义:电镀 — 是用电化学方法在固体表面沉积一层金属、合金或金属与非金属复合电沉积的过程。. Plating technology Chapter Ⅰ Introduction. 我们可以利用电镀技术做: 1 表面处理 增强零件的抗腐蚀性能 2 表面处理 增强零件的装饰功能
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电镀工艺学 第十一章 复合电镀 Plating technologyChapter ⅩⅠ Composite plating
Plating technology Chapter Ⅰ Introduction • 电镀的基本概念 • 定义:电镀—是用电化学方法在固体表面沉积一层金属、合金或金属与非金属复合电沉积的过程。
Plating technology Chapter Ⅰ Introduction 我们可以利用电镀技术做: 1 表面处理 增强零件的抗腐蚀性能 2 表面处理 增强零件的装饰功能 3 表面处理 增强零件的特殊功能如抗高温氧化、抗磨、减磨、 微孔吸附、增强材料强度、增强材料导电性能等 4 电铸 提纯金属或湿法冶金 5 电加工 某些精密的零件,机械加工困难,可采用电加 工成型技术 6 表面处理 制备特殊用途材料如发泡镍、中空镍纤维等 7 高科技 如电沉积法制备一维纳米线 8 材料制备 制备催化材料、复合材料、金属膜材料等
Plating technology Chapter Ⅰ Introduction Electrochemical behavior of electrodeposited Ni–WC composite coatings M. Surender et al.
Plating technology Chapter Ⅰ Introduction Electrochemical behavior of electrodeposited Ni–WC composite coatings M. Surender et al.
Plating technology Chapter Ⅰ Introduction Electrochemical behavior of electrodeposited Ni–WC composite coatings M. Surender et al.
Plating technology Chapter Ⅰ Introduction Electrochemical behavior of electrodeposited Ni–WC composite coatings M. Surender et al.
Plating technology Chapter Ⅰ Introduction Study on Overpotential of the Electrochemical Hydrogen Storage of Multiwalled Carbon Nanotubes FengHui et al.
Plating technology Chapter Ⅰ Introduction Study on Overpotential of the Electrochemical Hydrogen Storage of Multiwalled Carbon Nanotubes FengHui et al.
Plating technology Chapter Ⅰ Introduction Study on Overpotential of the Electrochemical Hydrogen Storage of Multiwalled Carbon Nanotubes FengHui et al.
Plating technology Chapter Ⅰ Introduction 碳纤维非电解镀镍Susumu Arai等
Plating technology Chapter Ⅰ Introduction Ni-deposited multi-walled carbon nanotubes by electrodeposition Susumu Arai et al.
Plating technology Chapter Ⅰ Introduction Ni-deposited multi-walled carbon nanotubes by electrodeposition Susumu Arai et al.
Plating technology Chapter Ⅰ Introduction Ni-deposited multi-walled carbon nanotubes by electrodeposition Susumu Arai et al.
Plating technology Chapter Ⅰ Introduction 纳米多层膜断面扫描电镜形貌 天津大学 姚素微 国家自然科学基金优秀项目