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Dilbert and Wally deal with a highly skilled co-worker as their boss gives a pointed hair-raising pep talk. Meanwhile, Wafer Dicing is showcased using a Microautomation 1100 dicing saw with a diamond blade. The process involves cutting the antenna wafer into individual antennas, shown by a video camera. Gear up and focus on creating impactful PowerPoint slides!
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Wafer Dicing • Cutting the antenna wafer into individual antenna
When complete, the wafer will be cut into individual antenna
Now is the time to start working on your PowerPoint presentation slides