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Layer 0 Status

Layer 0 Status. 48 modules, 96 SVX4 readout chips 6-fold symmetry 8 module types different in sensor and analog cable length. Analog cable. Pitch Adapter. SVX4. sensor. hybrid. L0 Status. Layer 0 consists of: 48 sensor/analog cable/readout modules of 8 types 7 and 12 cm sensors

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Layer 0 Status

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  1. Layer 0 Status • 48 modules, 96 SVX4 readout chips 6-fold symmetry • 8 module types different in sensor and analog cable length

  2. Analog cable Pitch Adapter SVX4 sensor hybrid L0 Status • Layer 0 consists of: • 48 sensor/analog cable/readout modules of 8 types • 7 and 12 cm sensors • x 4 analog cable lengths • SVX4 readout chips, BeO hybrids • Digital jumper cables • Carbon Fiber Support structure • Readout Components • Junction cards/twisted pair cables/adapter cards • Installation components • Supports attached to the Run2a SMT structure • Tooling to install and align Layer 0 and extract the Run2a beampipe

  3. Module Quality • All modules are built • 8 of each type (6 needed) • Require: • <1.5 mA current • no pinholes • <4 bad or noisy channels • Have one good spare for each type (one marginal)

  4. Component Status • Modules – done • Digital jumper cables – done (spares still being assembled at KU) • Carbon Fiber Support structure – done • Readout Components • Junction cards – done • Twisted pair cables – done • Adapter cards – done • Installation components being fabricated • Supports attached to the Run2a SMT structure • Tooling to install and align Layer 0 and extract the Run2a beampipe

  5. Module Installation • 48 to install, started June 2 • Problems with the stability of the CMM slowed the start • Two sets of fixtures. Plan to install two modules/day (north+south). Procedure • Remove vacuum, electrical test of previously installed modules • Glue on foam spacers • Measure locations of previously installed sensors • Glue on next sensor/hybrid pairs • Allow to cure overnight • Scheduled for 6 weeks • Six facets (3 inner, 3 outer) • Stop after inner layer is complete for ~2 week electrical test • Assumes 1 additional day/facet for rotation and alignment

  6. Module Installation

  7. System Tests and Grounding • Layer 0 performance depends on the grounding scheme developed for Run2b • Carbon fiber cocured with kapton ground mesh • Low inductance connections to sensors and hybrids • Isolation of adapter card grounds to break ground loops • Minimum gap between analog cables and conductors (mesh spacers) • A series of system tests have been performed with pre-production modules beginning last fall. • Used mechanical prototype support structure (electrically good) • Installed 10 modules (in stages). • Good overall noise performance • Effects of digital signals on hybrid coupling to analog cable (negligible at 396ns bandwidth) • Pedestal splitting (also negligible at 396ns bandwidth) • Verified need for low impedance grounding • Checked that there is no effect of adding modules on adjacent facets, opposite ends • Tested effect of a signal generator on CF support

  8. Full System Tests Two parallel efforts: • Full system test at Sidet • Plan to read out full Layer 0 withfinal electronics. • 10 electrical modules already read out • First stage inner layer only end of June • Found timing problems – addressed by sequencer firmware changes • Hybrid strings installed at Dzero, test crate 79 • Testing with conditions similar to operations Use real DAQ with Trigger Framework • Preparation and exercising of online software • See similar timing problems which still need to be addressed • Test crate progress slow – have now resolved interference with normal data taking – should make faster progress ungrounded

  9. Dzero Installation Tooling Layer 0 is installed by bringing the detector in through the EC beam pipe, a carbon fiber installation pole is passed through the SMT, picks up Layer 0 and guides it through the SMT. • Carbon fiber insertion tools • Half of “long tool” built, second, tapered half should take ~2 weeks • Stages and support tables designed, stages have been received • Alignment and coupling tooling • Reuse parts used for aperture survey last Fall • Junction card support being fabricated • Layer 0 to SMT couplings partially fabricated, some redesign to provide more compliance in supports • Need to fabricate Layer 0 to insertion tool coupling sections • Expect to begin Lab 3 tests in the beginning of July

  10. Installation Sequence Long tool inserted Through SMT Layer 0 connected to tool L0 partially inserted in SMT Layer 0 in installed position

  11. Cabling DJ cables in installedposition DJ cables in insertion position Twisted pair cables(not shown) Run 2a Support Junction Cards (12/side)

  12. Cabling • Preparation • Decable and remove H disks • Remove outer H disk low mass cables • Install adapter cards, LV wire gauge transitions, temperature monitor interface cards on horseshoe • Installation • Connect DJCs to junction card/twisted pair assembly and secure to junction card ring • Test readout • Connect 12 temperature monitor cables • Insert and recable inner H disks 4 ch. Adapter Card at HorseShoe

  13. Schedule Summary

  14. Schedule (April 05 update) Milestones we are watching: • Begin module installation (June 2) • Completion of inner layer (June 21) Two weeks of testing • Completion of module installation (July 27) Four weeks of testing Complete and ready to move (Sept 16) • D0 Installation • Test fixtures at Lab 3 (June 20-July 20) • Modify and complete (July 21-Aug 30) Ready for mechanical installation Aug 30 We assume that Layer 0 needs to be available at the start of the shutdown

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