1 / 4

450mm Wafers Size Conversion

450mm Wafers Size Conversion. 450mm Wafer Conversion is at 2013. Background Wafer size changes are driven by productivity curve to continue Moore’s law. Need to move to 450mm may be accelerate or slow based on economic needs. Historically, wafer size changes are done every 9 years.

karyn-everett
Download Presentation

450mm Wafers Size Conversion

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. 450mm Wafers Size Conversion ITRS Factory Integration TWG

  2. 450mm Wafer Conversion is at 2013 • Background • Wafer size changes are driven by productivity curve to continue Moore’s law. Need to move to 450mm may be accelerate or slow based on economic needs. • Historically, wafer size changes are done every 9 years Single IDM Driven Single IDM Driven Consortia Driven (I300I/J300/etc) Consortia Driven (??I450I/J450??) ITRS Factory Integration TWG

  3. 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 Basic 450mm Research Development of Methods, Standards, equipment, solutions Pilot Line -> HVM Factory 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 Important Roadmap Points for 450mm • Wafer size conversion will be economically [productivity] driven • Based on 300mm key learning, 5-6 years are required to develop methods (eg 25 wafer FOUP), standards, equipment, and to start pilot production prior to high volume manufacturing • Consortia’s (ex. J300/I300I/ISMT/SELETE) will drive timing, methods, and standards • Basic research should start 2-3 years before this applied development • For a 2013 intercept, this means that development should start 2007 and research should start 2005 (2 major roadmap changes from now) • Industry will likely undergo major change from bulk CMOS technology to other device structures in 2010. • As a result, a wafer size change may not occur at the same timeframe ITRS Factory Integration TWG

  4. 200mm/1990 (125/150mm - 1981) 300mm/2001 450mm/2013 675mm/2019 [* 300mm wafer generation delay from 2-year accelerated technology node cycle [return to 3-year cycle (Sc. 2.0) after 2001] 9 yrs + 0yrs delay 9 yrs + 0yrs delay 9 yrs + 2yrs delay* Wafer Size Conversion History ITRS Factory Integration TWG

More Related