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Motion SPM ™ Introduction

Advanced Information. Motion SPM ™ Introduction. 22 st , Oct., 2007 Motion Control System Team HV Functional Power Group. Motion SPM Portfolio. Basic Structure. SPIM (CI). < 10kW ( 600V 75A 1200V 50A ).

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Motion SPM ™ Introduction

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  1. Advanced Information Motion SPM™ Introduction 22st, Oct., 2007 Motion Control System Team HV Functional Power Group

  2. Motion SPM Portfolio Basic Structure SPIM (CI) < 10kW ( 600V 75A 1200V 50A ) 6-IGBT/FRD for inverter + Gate Driver withProtection(SC, UV) + Thermistor + 3-phase Rectifier SPIM (Inv) < 10kW ( 600V 100A 1200V 75A ) 6-IGBT/FRD for inverter + Gate Driver with Protection(SC, UV) + Thermistor SPM2 < 5kW (600V 75A) 6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor + TSD function (from V4) SPM3 < 2.2kW (600V 30A) 6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Built-in Bootstrap diode & TSD function (from V4) SPM4 < 1kW (600V 15A) 6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor SPM5 < 0.1kW (500V 3A)-MOSFET 6-MOSFET for inverter + Gate driver with Protection ( UV) + OT,OC, FO function + Bootstrap diode (from V2) SPM6 < 0.5kW (500V 9A, 75V 75A)- MOSFET 2-MOSFET for inverter + Gate driver with Protection ( OC, OT, UV) + Bootstrap diode

  3. 60x31 44x26.8 26x10.5 29x12 45x28 54x29.5 External View 95x55 SPIM Series SPM2 Series SPM3 Series SPM5 Series SPM6 Series SPM4 SIP1 Series SPM4 SIP2 Series

  4. Line-up of SPM2 and SPM3

  5. SPM2 V1 • Line-up : - 600V/10A, 15A, 20A, 30A – with Ceramic Substrate, (Inner Bonding) - 600V/50A, 75A – with DBC Substrate (Out Bonding) • MajorApplications : - Consumer appliance inverters (Air conditioner, Treadmill) - Low power industrial inverters • Feature : - Built-in thermistor (NTC) - Active Low - Inner bonding/Out bonding • - Short-circuit protection with soft shut- down • control using sense-IGBTs • - Good thermal resistance and isolation capacity • with ceramic/DBC substrate • - 3 N-terminals for low-cost current sensing < Inner Bonding > < Out Bonding >

  6. SPM2 V4 (under development) • Line-up : - 600V/15A, 20A, 30A, 50A, 75A with DBC Substrate • MajorApplications : - Consumer appliance inverters (Air conditioner, Treadmill) - Low power industrial inverters • Feature : - Built-in thermistor (NTC) - Active Low - Inner bonding - Built-in TSD(Thermal Shut Down) function • - Short-circuit protection with soft shut- down control • - High efficiency & robust NPT IGBT adopted • - Good thermal resistance and isolation capacity with • ceramic/DBC substrate • - 3 N-terminals for low-cost current sensing < Inner Bonding >

  7. P (27) (19) V B(W) VB (18) V CC(WH) VCC OUT COM (17) IN (WH) W (26) IN VS (20) V S(W) (15) V B(V) VB (14) V CC(VH) VCC OUT COM (13) IN (VH) IN VS V (25) (16) V S(V) (11) V B(U) VB (10) V CC(UH) VCC OUT COM (9) IN (UH) U (24) IN VS (12) V S(U) (8) C OUT(WL) SC C(SC) (7) C FOD C(FOD) N (23) W (6) V FO VFO (5) IN (WL) OUT(VL) IN(WL) (4) IN (VL) IN(VL) N (22) V (3) IN (UL) IN(UL) (2) COM COM OUT(UL) (1) V CC (L) VCC N (21) U V SL SPM3 V2 • Line-up : - 600V/3A, 5A, 10A, 15A – with Ceramic Substrate - 600V/15A, 20A, 30A – with DBC Substrate • MajorApplications : - Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, etc) - Low power industrial inverters (Industrial inverter, Water pump, Treadmill, Sewing machine Door Controller, etc) • Feature : - Good thermal resistance - Active High - Out bonding • - Small size & Large pin-to-pin spacing • with zigzag package structure • - 3 N-terminals for low-cost current sensing < Out Bonding >

  8. SPM3 V4 • Line-up : - 600V/3A, 5A, 10A, 15A – with Full-pack PKG - 600V/15A, 20A, 30A – with DBC Substrate • MajorApplications : - Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, etc) - Low power industrial inverters (Industrial inverter, Water pump, Treadmill, Sewing machine Door Controller, etc) • Feature : - Good thermal resistance - Active High - Inner bonding • - Small size & Large pin-to-pin spacing • with zigzag package structure • - Built-in Boot strap diodes • - Built-in TSD (Thermal Shut Down)function • - High efficiency & robust NPT IGBT adopted • - 3 N-terminals for low-cost current sensing < Inner Bonding >

  9. P (27) (19) V B(W) VB (18) V CC(WH) VCC OUT COM (17) IN (WH) W (26) IN VS (20) V S(W) (15) V B(V) VB (14) V CC(VH) VCC OUT COM (13) IN (VH) IN VS V (25) (16) V S(V) (11) V B(U) VB (10) V CC(UH) VCC OUT COM (9) IN (UH) U (24) IN VS (12) V S(U) (8) C OUT(WL) SC C(SC) (7) C FOD C(FOD) N (23) W (6) V FO VFO (5) IN (WL) OUT(VL) IN(WL) (4) IN (VL) IN(VL) N (22) V (3) IN (UL) IN(UL) (2) COM COM OUT(UL) (1) V CC (L) VCC V N (21) SL U SPM3 MOSFET • Line-up : - 500V/ 5A (1.35(typ.)), 6A (1.15(typ)) • MajorApplications : - Low power consumer appliance inverters (Refrigerator, Fan) • Feature : - 3-phase MOSFET inverter with driver IC - Good thermal resistance • - Small size & Large pin-to-pin spacing • with zigzag package structure • - 3 N-terminals for low-cost current sensing Chap. 2 SPM Introduction

  10. PSCM - SPM3 Package PSC-SPM (Partial switching PFC) • Line-up : - 600V/20A - SPM3 package with DBC - 600V/30A - SPM3 package with DBC (under development) • MajorApplications : - Low/Medium power consumer appliances such as Room air conditioner • Feature : - Good thermal resistance • - Same package as SPM3 • - Built-in thermistor for temperature sensing • - LVIC with UVP, OCP

  11. PFCM - SPM3 Package PFC-SPM (Full switching PFC) • Line-up : - 600V/20A, 30A, 50A - SPM3 package with DBC • MajorApplications : - Medium/high power consumer appliance such as Package/System air conditioner • Feature : - Good thermal resistance - Built-in shunt resistor (Optional) • - Same package as SPM3 • - Built-in thermistor for temperature sensing • - LVIC with UVP, OCP • - Tj = -20 ~ 150deg

  12. Boost PFCM - SPM3 Package • Line-up : - 600V/30A – SPM3 package with DBC • MajorApplications : - AC 85V ~ 264V single-phase front-end rectifier - Mid-power application especially for an air conditioners • Feature : - Low thermal resistance due to Al2O3-DBC substrate - Active High - Single-phase rectifier diode • - single-phase IGBT PWM semi-converter including a drive IC • for gate driving and protection • - Typical switching frequency of 20kHz • - Built-in thermistor for temperature sensing • - LVIC with UVP, OCP • - Tj = -20 ~ 150deg

  13. SRM 1Phase - SPM3 Package • Line-up : - 600V/50A - SPM3 package with DBC • MajorApplications : - Single-phase SRM drives (Vacuum cleaner) • Feature : - Good thermal resistance - Built-in thermistor (NTC) - Small size & Large pin-to-pin spacing • with zigzag package structure • - Divided N-terminals for low-cost current sensing Chap. 2 SPM Introduction

  14. Line-up of SPM4, SPM5 and SPIM * Gray color: Not fixed development plan

  15. SPM4 - SIP1 Package (under development) • Line-up : - 600V/10A, 16A, 20A, 30A • MajorApplications : - Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, Water pump, etc) - Low power industrial inverters (Fan Motor, Industrial Inverter, etc) • Feature : - Large pin spacing and signal/power pins separation - Single-In-Line package - Active High • - 3 N-terminals for low-cost current sensing • - Built-in thermistor • - High efficiency & robust NPT IGBT adopted

  16. SPM4 - SIP2 Package (under development) • Line-up : - 600V/ 10A, 15A • MajorApplications : - Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, Water pump, etc) - Low power industrial inverters (Fan Motor, Industrial Inverter, etc) • Feature : - Cross-Conduction Prevention Logic - Single-In-Line package - Active High • - 3 N-terminals for low-cost current sensing • - Built-in thermistor • - High efficiency & robust NPT IGBT adopted

  17. SRM 2phase - SIP2 Package (under development) • Line-up : - 600V/ 10A, 20A, 30A • MajorApplications : - 2-phase SRM drives (Vacuum cleaner) • Feature : - 2-phase asymmetric bridge converter - Active High - Single-In-Line package - Built-in bootstrap diode - Built-in thermistor (NTC) - Low saturation voltage - Large pin spacing and signal/power pins separation - High efficiency & robust NPT IGBT adopted Gray color : Not fixed development plan

  18. SPM5 V1 • Line-up : - V1 SPM5 DIP: 500V/2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ)) & 250V/3A(1.4 (typ)) - V1 SPM5 SMD: 500V/2A, 4A, 5A & 250V/3A - MV SPM5 DIP and SMD : 60V/20A( 48m(typ) ) (Under development) - Transfer-molded full-pack package • MajorApplications : - Fan motor, water pump, etc. - Small motor applications up to 150W • Feature : - High power density compared to small package - Ruggedness (Switching and short-circuit) - Low conducted and radiated EMI (Slow dV/dt & dI/dt) - HVIC with UVP

  19. SPM5 V2 (under development) DIP SMD Double DIP • Line-up : - V2 SPM5 DIP: 500V/ 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ)) & 250V/ 3A(1.4 (typ)) - V2 SPM5 SMD: 500V/ 2A, 4A, 5A & 250V - 3A - Transfer-molded full-pack package • MajorApplications : - Fan motor, water pump, etc. - Small motor applications up to 150W • Feature : - High power density compared to small package - Ruggedness (Switching and short-circuit) - Low conducted and radiated EMI (Slow dV/dt & dI/dt) - HVIC with UVP - Built-in bootstrap diode - No external REH connection - Multi-function I/O, FO

  20. SPIM-CI (under development) • Line-up : - 1200V/ 30A, 45A - 600V/ 50A, 75A - Transfer-molded DBC package • MajorApplications : - Industrial Inverter, System A/C • Feature : - High power density in a small package - 3-phase Rectifier and IGBT inverter - Built-in Thermistor for temperature sensing - Good thermal resistance • - 3 N-terminals for low-cost current sensing < 1200V > < 600V > Gray color : Not fixed development plan

  21. SPIM-INV (under development) • Line-up : - 1200V/ 30A, 45A, 60A - 600V/ 50A, 75A, 100A - Transfer-molded DBC package • MajorApplications : - Industrial Inverter, System A/C • Feature : - High power density in a small package - 3-phase IGBT inverter - Built-in Thermistor for temperature sensing - Good thermal resistance • - 3 N-terminals for low-cost current sensing < 1200V > < 600V > Gray color : Not fixed development plan

  22. SPM6 (under development) 10.5x26 • Line-up : (Q2, ’08 code S) - 500V/ 9A, 13A MOSFET (UNIFET) - 600V/ 3A, 5A, 8A IGBT (NPT IGBT) - 75V/ 75A MOSFET (ULTRAFET, PT3 MOSFET) • MajorApplications : - Consumer appliance inverters (Washing machine, Refrigerator, etc) - E-Bike, Power Tools (B&D) • Feature : - Single-In-Line 9-SIP compact package - Built-in fault-out and external shut-down functions • - Built-in Bootstrap diode • - OC, OT, UV protection Function • - FO function(not fixed) • - Thermal Shut-down(not fixed) • - Two kinds of Form Package(9-SIP-Y or 9-SIP-L) Not fixed

  23. Thank You.

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