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Wafer Bonding Total Solution

Wafer Bonding Total Solution. SUZHOU GUANGNIAN TECH, Co., Ltd. 苏州广年科技有限公司. 内容大纲. 制程简介 Bonding 基板 简介 Bonding 机台 介紹 雷切 代工 简介 雷切 机 台介紹 相关报价 相 关 成品 图 面. 制程简介. sapphire. Au. GaN. Au. WB. GaN. CuW/Moly/Si. Au. sapphire. CuW/Moly/Si. Lift-off. GaN. process. GaN. L C process.

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Wafer Bonding Total Solution

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  1. Wafer Bonding Total Solution SUZHOU GUANGNIAN TECH, Co., Ltd 苏州广年科技有限公司

  2. 内容大纲 • 制程简介 • Bonding基板简介 • Bonding机台介紹 • 雷切代工简介 • 雷切机台介紹 • 相关报价 • 相关成品图面

  3. 制程简介 sapphire Au GaN Au WB GaN CuW/Moly/Si Au sapphire CuW/Moly/Si Lift-off GaN process GaN L C process Au Au CuW/Moly/Si CuW/Moly/Si Chips

  4. Bonding基板简介 Moly基板 CuW镀金基板 si基板 厚度: 100μm 、150μm 、200μm 直径: 50.8±0.2mm 有平边 平坦度:±8%、±6.5%、±5% 成份:铜：11~14% 钨：86~89% Ra值:0.3~0.4um 镀膜: Ni/Au 0.4/0.2 um CuW基板与sapphire基板的热膨胀系数是6.7 ppm/K , GaAs 的热膨胀系数是5.5 ppm/K, Moly 的热膨胀系数是5.6 ppm/K .

  5. Bonding机台介绍 • 高温高压 • 2”~4” • 已销售约30台 • Bonding 量率稳定 机台售价约8.5万美金

  6. 雷切代工简介

  7. 雷切机台介绍-1

  8. 雷切机台介绍-2

  9. 雷切机台介绍-3

  10. 相关成品圆面-1

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