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LOW TEMPERATURE PLASMA STUDIES AND APPLICATIONS

LOW TEMPERATURE PLASMA STUDIES AND APPLICATIONS. Xiaogang Wang Dalian University of Technology. OUTLINE. Relationship with Industry Major Applications Plasma Sources Beams Pulsed Power Technology Atmospheric Pressure Discharge Plasma Etching Dusty Plasma Applications

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LOW TEMPERATURE PLASMA STUDIES AND APPLICATIONS

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  1. LOW TEMPERATURE PLASMA STUDIES AND APPLICATIONS Xiaogang Wang Dalian University of Technology

  2. OUTLINE • Relationship with Industry • Major Applications • Plasma Sources • Beams • Pulsed Power Technology • Atmospheric Pressure Discharge • Plasma Etching • Dusty Plasma Applications • Biophysical Applications • Discussions

  3. RELATIONSHIP WITH INDUSTRY • Basic structure (USA) • Basic researches (government support) • Industry R & Ds (Private sectors) • Industry • Sources & Beams, Processing, Films, Electronics, Computer, etc. • Current structure in China • Basic researches (government support) • Industry R & Ds (none) • Industry applications (???)

  4. Basic researches (in US) • Pure scientific researches • What is going to happen in 20 years? • Such as: computer beyond silicon • Basic physical, chemical, biological processes • “Basic” applied researches • New sources, new ways, new materials • Such as: helicon in 90s, sources & beams for “big science” , PSII in 80s, pulsed tech, OAPUGD • Computer codes

  5. Basic researches (in China) • Pure scientific researches • What is going to happen in 20 years? (??) • Basic physical (Yes), chemical (?), biological (?) processes • “Basic” applied researches • New sources, new ways, new materials (?) • Computer codes (??)

  6. Industry R & Ds (in US) • New sources, new ways, new materials • Overlap with basic researches, more profit-oriented • Computer codes • Overlap with basic researches, more specific • New processes • Very detail improvements

  7. Industry R & Ds (in China) • State sectors • Government R & D • Wealthy & weak, but unwilling to share resource • State owned industry • In bad shape itself, no enough resource • Private sectors • “Publicly traded”: strongly rely on import • Privately owned: limited resource and vision

  8. Industry in US • High tech leaders • Computer chips • New materials • Medical and biological applications • Government sectors • Aero-space industry & • Environment industry • Big sciences • Reactors and Beams • Sources

  9. Industry in China • Not a leader • rely on import • Not a major manufacturer in high tech • Japan: at least need process improvement • China: small size, low-end, no such needs • Government • Separation of funding and human resources • Big sciences • Limited

  10. INDUSTRIAL APPLICATIONS OF PLASMAS Surface Treatment: Ion implantation, hardening, Welding, cutting, drilling Film deposition Volume Processing: Flue gas treatment, Metal Recovery, Waste Treatment Water purification, Plasma spraying

  11. Light Sources High Intensity, Discharge Lamps, Low Pressure Lamps, Specialty Sources, Lasers, Field-Emitter Arrays, Plasma Displays Switches: Electric Power, Pulsed Power

  12. Energy Converters: MHD Generators, Thermionic Energy Converters, Beam Sources Radiation Processing: Ceramic powders, Plant growth Medicine: Surface treatment, Instrument Sterilization

  13. MAJOR APPLICATIONS • Plasma Sources • Beams • Pulsed Power Technology • Atmospheric Pressure Discharge • Plasma Etching

  14. PLASMA SOURCES • Helicons • ECRs • ICPs • Magnetrons • Gyrotrons • Thrusters • GEC reference reactors

  15. GEC Reactor • Gaseous Electronics Conference (GEC) Reference Reactor (Hargis et al, 1991) • Capacitive coupled plasmas • RF discharge (13.56 MHz, ~100 V) • Detailed computer simulation code

  16. GEC Reactor: Basic parameters • Rc = 5 cm • Rr = Ra = 5.25 cm • RT = 10 cm • Xc = Xr= 3.5 cm • Xa = 6.25 cm • XT = 10 cm • d = Xa-Xc = 2.75 cm

  17. BEAMS • Laser beams • Ion beams • Electron beams • Energetic particle beams

  18. Ion beams: Plasma focusing • Off–focus of charged particle beams • Plasma focusing

  19. Applications to microelectronics • “Nano” microelectronics: • Quantum Ge/Si dots • Growth by molecular beams + electron beam evaporators for Si and Ge deposition • Enhancement by ion implantation • Low energy As+ beam (1 keV) • Depositing current density 0.02 mA/cm2

  20. PULSED POWER TECH • Pulsed voltage • Pulsed beams

  21. Experiments at Materials Modification Lab, DUT • C on Al surface • Bombarded by pulsed electron beams • Regular deposition thickness: mms • After a single pulse: ~ 1mm • Multi-pulses: Better results Anomalous diffusion effect ?

  22. Experiments at MMLab: Pulsed electron beam parameters • Width: ~ mm • Power: 27.8 keV • Energy density: 3.2 J/cm2 1. Cathode, 2. Anode, 3. Target, 4. Vacuum chamber, 5. Cathode plasma, 6. Anode plasma, 7. Coils, 8. Sparks

  23. ATMOSHERIC DISCHARGES • Arc discharges • Circuit breakers • Plasma guns & furnaces for steel, auto and environment industries • Surface physical simulation of re-entry • Corona discharges • Environment industry • Glow discharges • Filament glow discharges • OAUGD

  24. Physical simulation of re-entry • Fluid model (electrostatic MHD) • Kink instabilities • Two stream instabilities • Numerical simulation codes

  25. DUSTY PLASMA APPLICATIONS • Dust particles in reactors • Removal by heart-beating waves • Removal by bipolar diffusions • Other applications

  26. Dust particles in reactors: Particle creations • Particle creation & growth phases • Cluster formation • Nucleation and cluster growth • Coagulation • Particle growth

  27. Particle creations : Major processes • Surface processes: • Etching • Sputtering • PECVD processes: • Walls • Chemical polymers

  28. Dust particles in reactors: Impacts of particles • Surface contamination • Effects on sheath and electron density • Application of dust energetics • Particle size control and nanostrutrued thin films

  29. Surface contamination • Particle emission and trapping in plasma processing reactors • ICPs • CCPs • Helicons and ECRs

  30. Effects on sheath and electron density • Energy absorption • Electron density reduction

  31. Dust-free processing • Dust cleaning (removal) techniques • Magnetization and E X B drift • Dust trajectory calculations • Electrical potential configurations

  32. Application of dust energetics • Dust energetics • Heavy particle deposition • “Dust-enhanced” PECVD • Dust charging and distribution studies

  33. Dust size control and nanostructured thin films • Opto-electronics applications of nano-structure thin films • Nano-crystallite with dusty plasma technology

  34. BIOPHYSICAL APPLICATIONS • Electroporation • Drug delivery and gene therapy • Seed modification (ion & plasma beams) ? • Surface sterilization • Anti-bioterrorism application • Medical and other industry applications • Surface modification • To artificial organs etc. • High power, low duty circle pulses • Applications to biological systems

  35. Electroporation: Basic processes • Applying short electrical pulses • Charging of lipid bilayer membranes • Fast local structure rearrangement • Transition to “pore” stage • Tremendous enhancement of ionic and molecular transport • Possible candidate for seed modification?

  36. Electroporation: Basic parameters • Pulse width: ~ ms – ms • Pore creation period: ~ ms • Pore relaxation time: > 1 s • Pore radii: ~ nm • Bilayer thickness: ~ mm • Membrane voltage: > 1 V • Electrical field: ~ kV/cm

  37. Surface sterilization: Anti-bioterrorism application • Large scale anthrax outbreak • Soviet Union, 1979 (Science266, 1994) • USA, 2001 • Plasma sterilization for large areas • No damage to the surface • Fast cleanup: > 10cm/s • In-place agent destruction, no hazard waste • Tools • Montec steam plasma torch • TTU arc-jet thruster

  38. Surface sterilization: Plasma parameters • Power: 60 – 100 kW • Work plasma: Water steam & • Temperature: > 1500 K • Threshold: > 3000 K • Rate > 10 cm/s • Kill rate: > 80 %

  39. DISCUSSIONS • Plasma cloaking • Drag-reduction and EM waves absorption • Plasma shock formation and its effect • Plasma etching • Plasma chemistry

  40. University Research Centers in US • UW-UM Center for Plasma Aided Manufacturing • Research Areas: • Thin Film Deposition • Thick Film Deposition • Plasma Etching • Surface Modification

  41. Thin Film Deposition • Plasma-mediated, surface modification of organic and inorganic polymeric substrates for generating controlled etching reactions, creating specific surface topographies, and implanting specific functionalities onto various substrate surfaces.

  42. Deposition of novel and conventional macromolecular layers (e.g. Teflon-like thin layers and IR transparent films) on inorganic and organic surfaces by involving plasma-state and plasma-induced reaction mechanisms, including template polymerization reaction mechanisms initiated from surfaces with plasma-enhanced crystallynity. Investigation of the influence of plasma parameters (electron energy distribution, power, frequency, pressure, etc.) on the discharge-induced gas phase molecular fragmentation and surface-mediated plasma-chemistry mechanisms

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