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Module 1: Introduction to Windows CE. Overivew. Windows CE Design Goals Windows CE Architecture Supported Technologies, Libraries, and Tools System Memory Architecture. Windows CE Design Goals. Small Protable Modular and Compact Win32 Compatible Development Tool Support Connectivity
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Overivew • Windows CE Design Goals • Windows CE Architecture • Supported Technologies, Libraries, and Tools • System Memory Architecture
Windows CE Design Goals • Small • Protable • Modular and Compact • Win32 Compatible • Development Tool Support • Connectivity • Real-time
Small • Typical hardware: 4MB-8MB ROM • Samllest footprint: 500K • Win32 API is only API • Win32 API is subset of desktop • Compared to Windows Me(100MB) or Windows 2000(500MB)
Portable • Easy portability to new processors • Most parts of the OS written in C • Various processors supported • Easy portability to new platforms • OAL layer
Modular and Compact • Modules • Kernel, GWES, Filesys, and Communications • Each module is divided into components • Build an OS image that fits your needs • Windows CE configurations: MINKERN, MININPUT, MINCOMM, MAXALL, IESAMPLE. . . • Components can be added, deleted, or replaced • Execute In Place (XIP) from ROM
Win32 Compatible • Uses the same Win32 programming model • Supports a large number of Win32 API functions • Supports other programming interfaces: MFC, ATL and Embedded VB • Advantages: • Ease of porting existing Windows applications • Many developers have good Windows knowledge
Development Tool Support • Not restricted to a particular language • Strong development support • Embedded Visual Basic/C++ • Tools: Remote debugger, emulators • Tech: COM, DCOM and MSMQ • APIs: TAPI, Winsock. . . • Lib: ATL, MFC
Connectivity • Win CE devices designed for mobility • Support connectivity to desktop PC, other Win CE devices, and the Internet • Wide variety of comm options and API: serial, LAN, modem, infrared. . . • Secure comm at all levels • Synchronization model: ActiveSync
Real-time • Interrupt Handling • Guaranteed maximum latency for highest priority interrupt • Nestable (Prioritized) interrupt handling • Thread Scheduling • Guaranteed maximum latency for highest priority thread • 256 thread priorities • Controllable thread quantum
Windows CE Architecture • Overview of Windows CE Architecture • The Hardware • The OEM Adaptation Layer • The Kernel Module • The Filesys Module • The GWES Module • Communication Support
Remote Connectivity Windows CE Shell Services WIN32 APIs COREDLL, WINSOCK, OLE, COMMCTRL, COMMDLG, WININET, TAPI Overview of Windows CE Architecture OEM ISV, OEM Microsoft Applications Embedded Shell Kernel Library GWES File Manager Device Manager IrDA TCP/IP Network drivers File drivers Device drivers OAL Boot loader Drivers OEM Hardware
The Hardware • Minimum hardware requirements: • Supported processor • Timer for Scheduler Interrupts • Memory • Reference platforms: • HARP • CEPC • Blue Planet
The OEM Adaptation Layer • Layer between the kernel and the H/W • Coded by OEMs to adapt WinCE to their own platforms • Linked with processor-independent code provided by MS to build the kernel • Set of functions related to system startup, interrupt handling, power management, profiling, timer, and clock
The Kernel Module • Portable across supported processors • NK.EXE, COREDLL.DLL • Support RAM and ROM execution • Modules can be compressed in ROM • Demand paging
The Filesys Module • Three types of persistent storage • File systems • Registry • Property Database • The object store is built on an internal heap • The internal heap is transacted to ensure integrity • The internal heap is compressed to save memory
The GWES Module • Graphics, Windows, and Event manager • Graphic output(display and print) • User input: keyboard, stylus, mouse, etc. • Windows management: message routing, etc. • GWES is the most componentized WinCE module • GWES exports only a subset of the Win32 API functions