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Wiring architecture. Overview Presentation. Presentation Outline. Derived Requirements Subsystem Components Power Telemetry collection & Command distribution Design Constraints & Solutions Future Work. Derived Requirements. Shall have low outgassing levels
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Wiring architecture Overview Presentation Karim A. Barakat
Presentation Outline • Derived Requirements • Subsystem Components • Power • Telemetry collection & Command distribution • Design Constraints & Solutions • Future Work Karim A. Barakat
Derived Requirements • Shall have low outgassing levels • Shall operate and survive 15,000 g • Shall operate and survive thermal shock • Shall consume no more than 5% - 10% of dry mass Karim A. Barakat
Options • Digital Data • Bus architecture (e.g. CAN bus, I²C bus) • Simple set of wires (e.g. RS 422) • Analog Data • Dedicated wires • Power • Power bus • Point to point Karim A. Barakat
Subsystem Components Wiring Harness Connectors Dielectric Insulating Material Tetrafluoroethylene or crossed-linked polyolefin Power: e.g. AWG 22 or AWG 30 D connector Electrical: e.g.9-pin electrical D-type Conductor Space grade options: Silver plated copper Karim A. Barakat
Power Batteries Power Control Unit (Distribution & Control) Voltage Regulator +3.3 V +5 V -5 V +28 V CDH Communications Propulsions Payload’s Instruments Karim A. Barakat
Design constraints & Solutions Karim A. Barakat
Future Work • Gather necessary information from subsystems • Work more on the power distribution layout • Perform trade off studies on material selection • Develop 2 or more different solutions • Perform trade off study between proposed solutions • Finalize and model wiring architecture Karim A. Barakat
Questions? Karim A. Barakat