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Investigation on MgO Long Feng, Jin Huan, Yu Min, Han Qiyan, Shi Yi 2 011-12-8. CN A-IVC 201112-F01. CONTENTS MgO purity Binder 3. Density and compaction ratio 3.1 Density 3.2 Compaction ratio 3.3 Conclusion 4. Other works. 2. MgO putity.
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Investigation on MgOLong Feng, Jin Huan, Yu Min, Han Qiyan, Shi Yi2011-12-8 CN A-IVC 201112-F01
CONTENTS • MgO purity • Binder • 3. Density and compaction ratio • 3.1 Density • 3.2 Compaction ratio • 3.3 Conclusion • 4. Other works 2
MgO putity Three suppliers for high purity MgO. × × Potential supplier: Dashiqiao, analysis on the Carbon content of Mgo block before and after sintering. 3
MgO putity (cont.) Carbon content of Mgo block before and after sintering Haicheng: purity of MgO 99.19%. Used for the last SSMI conductor short samples. Requirement of C content: ≤0.02 Suggestion: Relax the requirement of Carbon content for MgO material to ≤0.1. Further analysis for C content of MgO block after sintering. 4
2. Binder • Binder: • 107 glue • Deionized water • - Easy cracking • Polyvinyl alcohol • - 1% consistence and 2% mixture ratio with MgO × × √ Insulation resistance of MgO block with different binder after baking exposed to air and N2. 5
3. Density and compaction ratio Φ15mm MgO cake, polyvinyl alcohol binder Sintering temperature: 1000℃, 1050℃, 1100℃, 1150℃, 1200℃ 6
3. Density and compaction ratio After compression 16t compression jack 7
3.1 Density 570MPa compaction pressure 8
3.2 Compaction ratio 1t pressure force 9
3.3 Conclusion • For Φ15mm MgO cake, polyvinyl alcohol binder • Density after compaction is between 2.7~3g/cm3 • Less molding pressure higher compaction ratio • Compaction ratio is not stable when the compression pressure is less than 60MPa • Reduce the molding pressure of MgO block to improve the compaction ratio • - Target compaction ratio is 36% (24% of the three short SSMIC samples). • Compaction machine provide 600MPa for MgO block compaction • 10MPa molding pressure for VS&ELM MgO block • Sintering temperature is 1150℃ 12
Free supports • Displacement in between the two supports: • 10m • Dy=362mm • 5m • Dy=10mm • 2m • Dy=0.19mm 4. Other works - Gravity sag of CuCrZr conductor 13
4. Other works - Conductor baking (after compaction) Baking: 450℃/4hours Insulation resistance Before baking: 0.03MΩ After baking: >10GΩ@DC500V Baking: 500℃/12hours Insulation resistance Before baking: 32MΩ After baking: >10GΩ@DC500V 4 meters baking furnace in design for Cu conductor, jacket before assembly and SSMI conductor baking. 14
4. Other works - Short VS conductor sample compaction 15