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GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A

GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A. Luca Latronico INFN-Pisa luca.latronico@pi.infn.it. Relevant Documents. LAT-PS-01801 Integration of TMCM and SSD Ladders onto Tracker Trays released LAT-PS-03534 Single Tray Electrical Test Plan

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GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A

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  1. GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A Luca Latronico INFN-Pisa luca.latronico@pi.infn.it

  2. Relevant Documents LAT-PS-01801 Integration of TMCM and SSD Ladders onto Tracker Trays released LAT-PS-03534 Single Tray Electrical Test Plan released Production company: G&A Engineering, Carsoli-Oricola (AQ)

  3. INFN provides G&A with tray panels, TMCMs, ladders, (and their relative locations on the tray) + Nusil adhesives Alignment jig (WS-B1) provides: TMCM planarity Pitch adapter planarity Bonding pads alignment (HV and shield pads) Dry assembly test to check TMCM connectors clearance Adhesive distribution (WS-B2) Assembly of TMCM onto tray (WS-B3) Metrology (WS-B4) Current production rate ramping up: need to match CC pocket and MCM connector depth extra screening on TMCM pitch adapter (missing connections on signal strips and HV lines – PA debondings) alignment jig Assembly and test flow-chart WS-A Material receiving and inspection WS-B TMCM Integration

  4. Ladder test (WS-C1) Tray Z positioning under CMM (WS-C2) 50m wrt nominal position Ladder positioning on the bridges (WS-C3) Alignment from bridge itself used as reference and excellent alignment of SSD inside ladder (~2 mm RMS) Glue deposition (WS-C4) 19 spots of siliconic glue/SSD 4 spots conductive glue + 1 unbroken line across ladders Ladder assembly (WS-C5) Ladder metrology (WS-C6) Ladder height 0.250.1 mm Ladders relative parallelism of 0.1 mm Wire bonding (WS-C6) Destructive pull tests on coupons (>5g each) Visual inspection Functional test by INFN with tray inside box LAT-PS-03534 DRB and shipping to INFN Ladder assembly tools Assembly and test flow-chart WS-C Ladders integration WS-D Final disposition

  5. Availability of components and tools • Bare panel trays after TVAC test in Roma2 • 27 trays available – planned supply is 4trays/day • SSD Ladders from G&A and Mipot • ~1400 ladders available - 400 more from G&A (200 to test, 200 being built) – 900 will be built from Mipot asap • MCM from SLAC through quick functional verification at INFN-Pisa • Currently 38+32 • Could match 14 trays (26 TMCMs) from first lot of 38 because of connector stick-out issue • 6 TMCMs sent back to SLAC for PA debondings • Nusil at G&A for ~3/4 of tray production • G&A tools • TMCM alignment tools: 5 • Ladder integration tools (tray alignment + ladder bridges): 6 • CMM: 2 (1 for alignments, 1 for metrology) • Glue dispenser: 2 • wire-bonder: 2 • 2 working shifts per day to grant production rate of 4 trays/day • EGSE for functional tests • 1 full EGSE system installed at G&A and operated by INFN

  6. Data exchange with INFN-Pisa • From INFN to GA: • List of subparts (ladders and TMCM) from INFN-Pisa • From GA to INFN: • List of subparts with G&A reference SNs (neede for tray box) • Progress of assembly (weekly) • Quality Assurance • Rely on G&A certified QA program for internal activity • Handle major NCR notified from G&A (MARECO) with Pisa system

  7. Tower 0 tray production • 14 complete trays assembled (27 TMCMs and SSD Ladder planes) • 23 Si layers were within specs • 4 Si layers had short for problems related to bias circuit delamination • All went through thermal tests • 4 Si layers (bottom side of heavy trays) had many disconnected channels because of CTE mismatch impact on wire-bond encapsulation  MRB on wire-bond encapsulation • 23 SSD layers operated successfully up to now

  8. y x L02 L02 L03 L01 silicon #1 silicon #2 silicon #3 silicon #4 Pin 1 Pin 3 L11 L13 L12 MCM side L23 L21 L22 Pin 2 Pin 4 L31 L33 L32 Metrology of ladders alignment Metrology: with a CMM with interchangeable mechanical-optical heads, the positions of 12 “C” markers, 3 for each ladders, and the positions of the MCM alignment pins are measured on both sides of the tray.

  9. Results – ladders alignment

  10. Functional test results – leakge current 079MID front: 1.67 uA @ 150 V 079MID back: 1.85 uA @ 150 V 050MID front: 2.02 uA @ 150 V 050MID back: 1.77 uA @ 150 V

  11. Functional test results – trigger rates vs threshold 079MID back 079MID front 050MID front 050MID back

  12. Functional tests results – bad channels • Total number of bad channels well within specs (16 max) • High reliability of PA screening test on TMCM • High yield of wire-bonding

  13. Conclusions • Assembly and test procedures well tuned and tested on EM trays and tower 0 • G&A moving rapidly to planned production rate • High yield of assembly so far • > 100 ladders glued and wire-bonded with no failures and well within specs • Tower A production well within specs • Leakage current • Noise and thresholds performance • Bad channels

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