Rochester Hills Process Facility

1. Rochester Hills Process Facility Jeff Fournier Rochester Hills Process Team April 2009

2. Rochester Hills Process • Process Facility • Sputter DepositionTools • MOCVD • RIE PECVD • Photolithography • Wet Chemistry • Metrology • Materials Lab

3. Facility • 300 ft2 of Class 1000 clean room • 1200 ft2 of Class 10000 clean room • 1500 ft2 of support space • DI H20 purification loop • Orbitally welded high purity gas system • Facilities for CDA, house vacuum, closed loop chiller loop, and house N2

4. Sputter Deposition Tools • KDF 3 target • 3 target inline sputter • KDF 4 target • 4 target inline sputter • OSMP cosputter • 3 confocal cosputter plus 3 additional • KDF Ci Cluster tool • State of the art cluster tool • Sputter etch / RPC • 3 confocal cosputter targets • Degas chamber • Heated electrodes to 500C

5. KDF sputter tools • Sputter deposition • 3 or 4 target • load locked • Multiple substrate size up to 12 inch • Sputter etch • Substrate degas and heat • DC and RF magnetron • Reactive sputter capability

6. KDF 643 GT

7. KDF 3 target Sputter Tool

8. KDF 4 target sputter tool

9. KDF Ci Cluster Tool • Description • PVD deposition cluster tool for materials research and device fabrication • 8 inch capable • Degas module • Soft Sputter Etch / RPC module • 3 magnetron co-sputter module 3 inch guns • 2 single magnetron modules 6 inch guns • Brooks Marathon robot module • All process deposition modules with shutters and heat capability to 500C

12. OSMP Sputter Tool • Research Tool • Three 6” magnetron sources • Cluster of three 3 inch confocal magnetron sources • High vacuum load lock • Substrate Heat • Substrate Rotation • Large inventory of sputter materials • Sputter up configuration • Reactive sputter capability • RF and DC pulsed power

14. Co-sputter Advantages • 3 magnetron cluster for alloy research • Co-sputtered materials with two or three sources • Quick turn alloy development without tooling target • When desired material is achieved targets are fabricated in house

15. RIE/PECVD • Trion cluster tool • 3 process modules dep/etch(2) • Loadlocked cluster configuration • HBr/Cl2 Module, metal, chal etch • F Module breakthrough, carbon etch • PECVD Module, Si3N4, SiO2 • ICP capability on all modules • Endpoint detection

16. Trion RIE/PECVD

17. Etch HBr Cl2 SF6 O2 CF4 CHF3 He Deposition SiH4 NH3 N2O H2 He NF3 TEOS RIE/PECVD gases

18. CVD Equipment Corporation MOCVD Cluster Tool • Cluster Tool configuration • Thru wall installation into cleanroom • Multi chamber • MOCVD module • PECVD module • Sputter Etch module

19. Lithography • Karl Suss MA6 aligner • Feature size ~ 0.7 micron • Contact • 8” capable • Currently processing 2x2, 8” wafers and 6” • Raith e-beam • lithography tool - 50nM min features

20. Karl Suss Aligner

21. Raith e-beam

22. Lithography • CEE spinner • Manual load auto dispense • PR spinning, spin developing • PR soft and hardbake • 8” capable, currently processing ¼ 8” and 6 “ silicon as well as coupons • Develop hood • MTI track system • 6” spin, bake, develop, cassette to cassette

23. MTI Track System

24. Wet Chemistry • Acid bench • 3 tanks, rinse dumper, sink • Solvent bench • 3 tanks, rinse dumper, sink • Acid bench CMP • Dedicated CMP clean bench • Spin Rinse Driers (2)

25. Air Control Wet Benches

26. Metrology • Dektak profilometer • FSM stress temp • Nanometrics optical thin film thickness • Geartner Ellipsometer • Nikon optical microscope • 4 point probe • Romulus stud pull/mechanical adhesion tester

27. Metrology

28. Misc Equipment • YES vacuum oven • Glen Asher • YES Vapor prime oven • Jiplec RTA • Strausbaugh CMP • MRL Tube Furnace

29. Materials Lab • In House Sputter Target Fabrication • Hot Vacuum Press • Bonding • Quick Turn • Research and Production Tool Products

30. Materials Lab