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Exploring Computer Intelligence and Architecture - CSCI-365

Dive into CSCI-365 to unravel the coordination of abstraction layers in computer systems, from software to hardware. Understand CPU functions, instruction sets, and MIPS architecture, exploring the levels of representation from high-level languages to machine code and hardware design. Discover the anatomy of a computer, transistor circuits, and IC packaging. Delve into technology trends, including microprocessor complexity and memory capacity growth. Witness the remarkable evolution of computer technology, highlighting major performance advancements and storage capacity improvements over the years.

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Exploring Computer Intelligence and Architecture - CSCI-365

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  2. Course Information • Course Website http://www.stfx.ca/people/igondra/csci365

  3. Are Computers Smart? • To a programmer: • Very complex operations / functions: • (map (lambda (x) (* x x)) '(1 2 3 4)) • Automatic memory management: • List l = new List; • “Basic” structures: • Integers, floats, characters, plus, minus, print commands Computers are smart!

  4. Are Computers Smart? • In real life at the lowest level: • Only a handful of operations: • {and, or, not} • No automatic memory management • Only 2 values: • {0, 1} or {low, high} or {off, on} Computers are dumb!

  5. CSCI-365 What is CSCI-365? Coordination of many levels (layers) of abstraction Application (ex: browser) Operating Compiler System (Mac OSX) Software Assembler Instruction Set Architecture Hardware Processor Memory I/O system Datapath & Control Digital Design Circuit Design transistors

  6. Instruction Set Architecture • Basic job of a CPU: execute lots of instructions • Instructions are the primitive operations that the CPU may execute • Different CPUs implement different sets of instructions. The set of instructions a particular CPU implements is an Instruction Set Architecture (ISA) • Examples: Intel 80x86 (Pentium 4), IBM/Motorola PowerPC (Macintosh), MIPS, Intel IA64, ...

  7. software instruction set hardware Instruction Set Architecture

  8. MIPS Architecture • MIPS – semiconductor company that built one of the first commercial RISC architectures • We will study the MIPS architecture in some detail in this class • Why MIPS instead of Intel 80x86? • MIPS is simple, elegant. Don’t want to get bogged down in gritty details • MIPS still widely used in embedded applications

  9. CSCI-365 Levels of Representation High Level Language Program (e.g., C) lw $t0, 0($2) lw $t1, 4($2) sw $t1, 0($2) sw $t0, 4($2) temp = v[k]; v[k] = v[k+1]; v[k+1] = temp; Compiler Assembly Language Program (e.g.,MIPS) Assembler Machine Language Program (MIPS) 0000 1001 1100 0110 1010 1111 0101 1000 1010 1111 0101 1000 0000 1001 1100 0110 1100 0110 1010 1111 0101 1000 0000 1001 0101 1000 0000 1001 1100 0110 1010 1111 Machine Interpretation Hardware Architecture Description (e.g., block diagrams) Architecture Implementation Logic Circuit Description(Circuit Schematic Diagrams)

  10. Anatomy of a Computer Keyboard, Mouse Computer Processor Memory (where programs, data live when running) Devices Disk(where programs, data live when not running) Input Control (“brain”) Datapath (“brawn”) Output Display, Printer

  11. Primarily Crystalline Silicon 1mm - 25mm on a side 2007 feature size ~ 65 nm = 65 x 10-9 m(then 45, 32, 22, and 16 [by yr 2013]) 100 - 1000M transistors (25 - 100M “logic gates”) Integrated Circuits Bare Die Chip in Package • Package provides: • spreading of chip-level signal paths to board-level • heat dissipation • Ceramic or plastic with gold wires

  12. Let’s look closer… PowerPC Die Photograph

  13. a b c 0 0 1 0 1 1 1 0 1 1 1 0 Transistor Circuit Rep. vs. Block diagram • Chips composed of nothing but transistors and wires • Small groups of transistors form useful building blocks E.g., NAND gate • Blocks are organized in a hierarchy to build higher-level blocks: E.g., adders “1” (voltage source) “0” (ground)

  14. Printed Circuit Boards • fiberglass or ceramic • 1-20 conductive layers • 1-20 in on a side • IC packages are soldered down • Provides: • Mechanical support • Distribution of power and heat

  15. Technology Trends: Microprocessor Complexity Gordon MooreIntel Cofounder # of transistors on an IC 2X Transistors / Chip Every 1.5 years Called “Moore’s Law” Year

  16. Technology Trends: Memory Capacity (Single-Chip DRAM) year size (Mbit) 1980 0.0625 1983 0.25 1986 1 1989 4 1992 16 1996 64 1998 128 2000 256 2002 512 2004 1024 (1Gbit) 2006 2048 (2Gbit) Bits Year • Now 1.4X/yr, or 2X every 2 years • 8000X since 1980!

  17. Technology Trends: Uniprocessor Performance (SPECint) 1.20x/year 1.52x/year Performance (vs. VAX-11/780) 1.25x/year • VAX : 1.25x/year 1978 to 1986 • RISC + x86: 1.52x/year 1986 to 2002 • RISC + x86: 1.20x/year 2002 to present

  18. Computer Technology – Dramatic Change! • Memory • DRAM capacity: 2x / 2 years (since ‘96); 64xsize improvement in last decade • Processor • Speed 2x / 1.5 years (since ‘85); [slowing!]100X performance in last decade • Disk • Capacity: 2x / 1 year (since ‘97)250Xsize in last decade

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