ITS FPC : INNER MODULE FLEX (IMF)

ITS FPC : INNER MODULE FLEX (IMF) Antoine JUNIQUE

CONTENTS • - CHIP floorplan • IMF layout • Etching profile • Differential impedance • S-Parameter Antoine JUNIQUE

CHIP floorplan Layout version 1 – Baseline at date From ITS WP6&7&8 03.04.2014, Gianluca Aglieri Rinella Antoine JUNIQUE

IMF_V12 layout 366.8 mm 15.750 mm IMF_V12 76 mm UEC5-019-X-D-RA-A SAMTEC UCC8-010-1.05-X-X-XX SAMTEC Antoine JUNIQUE

IMF_V12 to Coax-cable connexion Antoine JUNIQUE

IMF_V12 layout 366.8 mm IMF_V12 76 mm AVDD DVDD High speed lines M-LVDS lines Antoine JUNIQUE

IMF_V12 layout 0.5 mm 0.4 mm Chip1 Chip2 1 mm 1 mm 0.4 mm 0.4 mm Chip1 Chip2 Antoine JUNIQUE

IMF_V12 layout 3D view (Extension part) UEC5-019-X-D-RA-A SAMTEC UCC8-010-1.05-X-X-XX SAMTEC Power connexion area Chip1 detail Antoine JUNIQUE

ETCHING PROFILES 100 µm 100 µm 100 µm Solder-mask 25 µm Cu or Al 25 µm Polyimide 50 µm or 75 µm Cu or Al 25 µm Solder-mask 25 µm Profile 1 (Ideal world) Profile 4 (Ideal world) 100 µm 100 µm 100 µm 70 µm 70 µm Solder-mask 25 µm Cu or Al 25 µm Polyimide 50 µm or 75 µm Cu or Al 25 µm Solder-mask 25 µm Profile 2 (Chemical etching) Profile 5 (Chemical etching) 120 µm 82 µm 120 µm 88 µm 88 µm Solder-mask 25 µm Cu or Al 25 µm Polyimide 50 µm or 75 µm Cu or Al 25 µm Solder-mask 25 µm Profile 3 (Laser etching) Profile 6 (Laser etching) Antoine JUNIQUE

Differential impedance Antoine JUNIQUE

S-PARAMETERS (Setting) 100 µm 100 µm 100 µm 70 µm 70 µm Solder-mask 25 µm Cu or Al 25 µm Polyimide 75 µm Cu or Al 25 µm Polyimide : - Dielectric constant = 3.5 - Dissipation factor = 0.002 Solder-Mask: - Dielectric constant = 3.7 - Dissipation factor = 0.029 Solder-mask 25 µm Profile 5 (Chemical etching) IMF_V12 high speed differential lines length Antoine JUNIQUE

S-PARAMETERS -8 dB Limit to no equalisation Antoine JUNIQUE

Conclusion • Developed first design of an extended FPC for an inner layer module and set up simulation tools for studying differential impedance and S-Parameters. • Next steps: • Complete drop voltage, current flowand PWR impedance. • Compare simulation result with Aluminium prototype. • New layout with ALPIDE layout version 2. • Extension length and mechanical improvements. Antoine JUNIQUE

ITS FPC : INNER MODULE FLEX (IMF)