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GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7 Aug-1 Monthly Review Gunther Haller haller@slac.stanford.edu (650) 926-4257. TEM/TPS Status. Status All units delivered by assembly vendor. Contract being closed.

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GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7

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  1. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7 Aug-1 Monthly Review Gunther Haller haller@slac.stanford.edu (650) 926-4257

  2. TEM/TPS Status • Status • All units delivered by assembly vendor. Contract being closed. • Qual unit review still to occur • 14 flight units delivered to I&T • A & B & 12 more units • 6 units ready to be reviewed (i.e. finished/passed all testing) • 2 of those units were demated and will be used to replace TwrA and TwrB TPS’s • Last unit in TV until next Sunday • To do • Review of end data packages for 4 units above • Review of last unit presently in TV • Modification of 2 TPS’s taken off TwrA and B • Mating with TEM’s • Vibration • End data package review

  3. PDU Status and Schedule • 1st unit (flight) • All testing complete • To do: • Closing of NCR’s • Collecting/posting data • Review • 2nd unit (spare) • Pre-coat stage box just received at SLAC • Testing (safe-to-mate & performance) to start next week • Followed by • Return to vendor for conformal coating • Environmental testing • Schedule depends on setting priorities compared to other modules (e.g. SIU). Assume low priority compared to all others for now.

  4. GASU Status and Schedule • First Unit • In conformal coating at vendor, followed by integration with flight harness • From last months review: • Estimated Delivery of final box at SLAC: Sept 15 • Best estimate is now Sept 21 due to parallel work on SIB, etc • Followed by test/mass/TC/test/vib/test/TV: 23 days • Followed by EMI (10 days) • Estimated delivery to I&T: first week of November • Schedule for 2nd unit • Estimated delivery to I&T: 6 weeks after delivery of first unit

  5. SIU/EPU (1) • SLAC Qual testing of boards assembled at Aeroflex • Testing was all completed without failures • To do: correlate pins tested to results of X-rays from GSFC, await file from GSFC • Backplanes • Assembled cCPI connectors on flight backplanes at SAI • SAI assembled 7 backplanes (3 to follow) • I had short, neither SLAC nor SAI could repair. However pins are not used so NCR with “use-as-is” • 7 boards were xrayed, some pins were touched-up, re-xrayed • 3 board were mailed to Aeroflex for remaining assembly • Are in conformal coating followed by harness assembly • Additional ones will be mailed to Aeroflex after balance of 3 backplanes from SAI are received and evaluated and compared to other 4 backplanes. • Hope to receive at least 1 fully assembled backplane end of next week (for proto-flight testing of SIU)

  6. SIU/EPU (2) • 1st SIB, LCB, CPS (for proto-flight testing of SIU) • One each was tested, pre-conformal stage • (also xray’s were taken and some pins were touched up, the connectors had been assembled at AF before SAI experiments started) • Integrated in SIU crate with RAD750 processor • Short performance tests at –40C and 55C passed • Boards were sent back to Aeroflex for conformal coating • Final SIB and LCB assemblies were received at SLAC yesterday • CPS expected beginning of next week • Note that this SIB contains chlorine-contaminated EEPROM, other modules could be flight • 2nd and 3rd SIB/LCB/CPS (for 1st and 2nd flight SIU/EPU) • cCPI connectors were assembled at SAI • Xrayed and touched-up at SLAC • Sent to AF for further assembly • Pre-conformal coat boards expected next week for testing at SLAC • Followed by conformal coating • Integration in 1st and 2nd SIU (or EPU) • Environmental testing • Expected delivery to I&T 11/30 –12/5 • Remainder of crates follow in 5-day increments (mainly TV) • cCPI connectors were just assembled by AF on boards • Manual assembly will follow • EEPROM for SIB: • Passed CSI at Austin Semi • Delivery to SLAC is Sept 15

  7. Harness & Heater Control Box & Interconnect Box • Harness in assembly, almost complete (some spare cables in rework) • HCB • Boards assembled • Await harnesses and enclosures • Assembly lower priority compared to GASU/SIU • HIB (Interconnect box) • Parts kitted at SLAC • To be assembled at SLAC

  8. Thermo-testing support/ VSC • EGSE for thermal-test shipped to Lockheed • TV Testing to be completed end of this week • VSC’s available for FSW/I&T • Remaining features of VSC being implemented

  9. Level 3 Milestone Count

  10. Level 3 Milestone List

  11. Level 3 Milestone List

  12. Level 3 Milestone List

  13. Level 3 Milestone List

  14. Cost Report

  15. FTE Report (DOE/NASA-funded only)

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