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Advanced Nanoelectronics Devices in European R&D Programmes Georg Kelm Nanoelectronics Components and Systems Information Society & Media Directorate-General European Commission. Presentation Outline. ICT FP7 Current situation Today’s opportunities: WP 2011-12 + FET And WP 2013?

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  1. Advanced Nanoelectronics Devices in European R&D Programmes Georg KelmNanoelectronics Components and SystemsInformation Society & Media Directorate-GeneralEuropean Commission

  2. Presentation Outline • ICT FP7 Current situation • Today’s opportunities: WP 2011-12 + FET • And WP 2013? • Something on the future 8th FP

  3. ICT for socio-economic challenges 5. ICT for Health, Ageing, Inclusion & Gov. 6. ICT for Lower-Carbon Economy 7. ICT for Manufac. & Enterprise 8. ICT for Learning & Cultural Resources ~10% ~11% ~12% ~6% ~4% ~9% +AAL incl FI PPP PPP 2 PPPs 1. Network and Service Infrastructures ~11% ~26% 2. Cognitive Systems and Robotics ~6% Future & Emerging Technologies (FET) Basic ICT technologies & infrastructures 3. Component and Systems +JTIs ~17% 4. Digital Content and Languages ~7% International cooperation, Cooperation in an enlarged Europe, Pre-commercial Procurement What is the money spent on? (in 2011-12) ••• 3

  4. Financial support • FP7: master & shape research & development • CIP: ensure wider uptake & better use of research • + Regional and Structural Funds,… FP7-CIP/ICT Budget Profile: 70% increase in period 2011-13

  5. ICT in FP7: Where do we stand? • In 2011, the FP7 ICT Programme is in its fifth year of implementation • Six main calls have been launched and evaluated • Total EU funding of 3,9 B€ • Total number of projects ~1200 • Launch of two JTIs and AAL • 3 Calls launched for 220 M€ • WP 2011-12 done, WP 2013 (1.5 B€) still to be drafted

  6. ICT in FP7: In Summary • ICT in the FP supports collaborative R&D projects • industry - academia from at least 3 Member or ASs • Project size between 3M€ and 20 M€ of funding • 4 to 20 partners per project • Supports ~17000 researchers and engineers/year • During 2007-10 • ~ 5000 distinct organisations, ~14000 participations • 1250 projects running (FP6 + FP7)

  7. Presentation Outline • ICT FP7 Current situation • Today’s opportunities: WP 2011-12 + FET • And WP 2013? • Something on the future 8th FP

  8. Nanoelectronicsand Smart Systems”Small, smaller, smarter” Lower cost, higher performance and more functionality performance Enabled by Smart design and Smart manufacturing of Smart Components and Systems • Power consumption More than Moore: Diversification Analog/RF Passives HV Power Biochips SensorsActuators 130nm Interacting with people and environment Non-digital SoC & SiP - 90nm 65nm Combining SoC and SiP: Higher Value Systems Moore’s Law: Miniaturization 45nm Information Processing Digital content SoC Baseline CMOS: CPU, Memory, Logic 32nm 22nm Beyond Moore

  9. ICT Work Programme 2011-12 Objective 3.1: Very Advanced Nanoelectronics Components • a) Beyond CMOS technology • b) Circuit-technology solutions • c) Nano-manufacturing and Joint Equipment Assessment • d) Coordination and Support Actions Objective 3.2: Smart components and smart systems integration • Smart components • Smart (miniaturized) systems • Micro-Nano Bio Systems (MNBS) • Coordination and Support Actions Call 8 - MNBS 39M€ Call 8 60M€

  10. Objective 3.1: Advanced Nanoelectronics Technology • To stimulate interaction of system and technology to better explore European system competences. • To address energy efficiency needs for mobile applications • Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing. • To prepare for “beyond” traditional shrinking (ITRS roadmap) 35 nmGate Length

  11. ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms. Objective 3.1: Advanced Nanoelectronics Technology • Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep impact of its results on the applications and markets. • Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures. • Integrate-abilityof novel technology with CMOS and their reliability become key factors.

  12. 3.1 Very advanced nanoelectronic components • a) Beyond CMOS technology • - New switches and interconnects (scalability, performance and • energy efficiency gains, operational reliability and RT operation); • - Advanced system integration technology and new methods for • computation; • - Emerging memories targeting the concept of non-volatile universal • memory; • - Nano-photonic devices & interconnects integrated with nano- and • Beyond-CMOS; • - Carbon based electronic devices; • -Novel materials for interconnects , nano-packaging, Beyond-CMOS • (logic and memory); • - Understanding fundamental artefacts and limits: nano-scale thermal processes; computational material and device science. Developed components and technologies need to fulfil the criteria of “systemability”,“integratability”, and – in the end – of “manufacturability”

  13. Metrology Using X-Ray Techniques Jordan Valley, CEA-LETI, STMicroelectronics Crolles II, NXP Crolles R&D Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic Device Generations AIXTRON, Fraunhofer IISB, Infineon Munich Semiconductor Equipment for Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec 3D Integration of Bulk Si Wafers EV Group, CEA-LETI, STMicroelectronics Crolles II Low Energy and Dose Implant Test SEMILAB, Fraunhofer IISB, ST Microelectronics Crolles II, NXP Crolles R&D Objective 3.1: c)Manufacturing and Equipment assessment • Access to nano-manufacturing and to advanced technologies to be assured in Europe. • Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated.

  14. 3.1 Very advanced nanoelectronic components: design, engineering, technology and manufacturability Summary • Call 8 • Open: 26 July 2011 • Close: 17 January 2012 (at 17:00 Brussels local time) • Funding schemes: • Beyond CMOS technology: STREPs • Circuit-technology solutions: STREPs and at least 1 IP • Nano-manufacturing and joint equipment assessment: STREPs and at least 1 IP • Support measures: CSAs • Indicative budget - 60 M€:

  15. Future & Emerging Technologies – FETSupporting high-risk transformative research in ICT Two complementary funding schemes • FET Open • Bottom-up approach • Open to any research idea • FET Proactive • Top-down approach • Set of novel pre-defined themes Nano-electronics related topics with EU funding ~ 30M€/year: Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based and towards zero power ICT

  16. Objective ICT-2011.9.8:Minimising Energy Consumption of Computing to the Limit(FET Pro-active) Target Outcome: Foundations for radically new ICT technologies striving for the theoretical limits in energy consumption • New elementary devices and inter-device-communication mechanisms • Novel computing paradigms with radically improved energy efficiency (e.g. inspired by biology, post-Boolean logics, …) • Software models and programming methodologies supporting the strive for the energetic limit (e. g. energy cost awareness,..) • Proof of concept, indication of expected energy gain, appropriate energy metrics or benchmarks for verification

  17. Objective ICT-2011.9.8:Minimising Energy Consumption of Computing to the Limit (MINECC) -Funding/Instruments: 15 MEuro for STREPs -Closing of Call 8 (tbc): 17 Jan 2012 -Contacts: Ralph.Stuebner (at) ec.europa.eu Francisco.Ibanez-Gallardo (at) ec.europa.eu

  18. ICT-2011.9.9: Quantum Information and Communication Technologies (QICT) Target Outcomes Push forward the boundaries of our knowledge in the Quantum-ICT area by demonstrating • Quantum simulators capable to operate on many-particle systems • Hybrid systems linking different quantum bit realizations. • Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication • Enabling methods and technologies to support aforementioned outcomes

  19. Objective ICT-2011.9.9: Quantum Information and Communication Technologies (QICT) “How the combination of quantum mechanics and information theory offers new concepts and resources for computing and communications.” -Funding/Instruments: 15 MEuro, STREPs & IPs 7 MEuro, ERA-NET Plus -Closing of Call 9 (tbc): 17 April 2012 -Contact:Werner.Steinhoegl (at) ec.europa.euDavid.Guedj (at) ec.europa.eu

  20. Work Programme 2011-12Objectives 3.1 and 3.2 vs FET Idea FET Proof-of-Principle Proof-of-Concept Objective 3.1: Advanced Nanoelectronics Technology Objective 3.2: Smart components and Systems Prototype demonstration

  21. Presentation Outline • ICT FP7 Current situation • Today’s opportunities: WP 2011-12 + FET • And WP 2013? • Something on the future 8th FP

  22. 2010 2011 2012 2013 2014 What is next? ICT WP 2011-12 FP7 ICT WP 2013 Preparatory work • 2011: Framework 8 Preparation • 9 Feb Green Paper • Feb-May Consultation based on Green Paper • 10/6 Consultation ‘wrap-up’ event in Brussels • June Proposal for next MAFF • Dec Proposal (s) for FP8/CIP-II Light and fast EIPs FP8 Strengthen, focus & simplify KETs Externalisation MAFF 2014+

  23. And in FP7 ICT WP 2013 ? • Advanced devices – more focus – but on what? • Stronger links Technology - Design • Mfg approaches for BC and adv MtM integration • Joint E&M assessments – focus on 450 mm? • Bridging to FP8: Innovation elements (pilots,research infrastructure, …)

  24. Focussed, Roadmap based Infrast and skills Testing, piloting Flexible, Open, agile Societal challenges Light WP Any time Small size SMEs specific e.g. Living labs CIP Pilots e.g. EIPs Industrial leadership e.g. Clean rooms, Innovation clusters CIP Pilots e.g. PPPs Excellence in science E-Infrastruct . e.g. FET flagships e.g. FET open ERC Towards a Common R&I framework in the next MAFF“3 sets of challenges, 4 type of activities, (funding schemes)” Some first and preliminary thinking on FP 8 Draft

  25. Summary • Two messages: • Input from Summer School is very welcome • Participate in Call 8 !!!

  26. THANK YOU Georg.Kelm@ec.europa.eu • Information Society and Media: • http://ec.europa.eu/information_society • http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html • European research on the web: • http://cordis.europa.eu • http://www.eniac.eu

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