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This document provides a brief overview of the ALICE Pixel detector bus/MCM concept discussed at the RIKEN/CERN PHENIX Silicon Upgrades Meeting. The plans for building a Pixel detector module for PHENIX using CERN pixel technology are also discussed.
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Status of plans for pixel detector ladders at RIKEN/CERN PHENIX Silicon Upgrades Meeting 27 February 2003 Johann M. Heuser, Hiroaki Ohnishi RIKEN - Radiation Laboratory
Brief overview of the ALICE Pixel detector bus/MCM concept r/o direction r/o direction pilot MCM - ladder à 10 pixel chips - 120 half staves à 2 ladders - 120 MCMs - 1200 pixel chips, 10 M pixels total J.M. Heuser
bus detector chip passive components 290µm Kapton aluminium glue 150 to 200µm PIXELS DETECTOR READOUT CHIP 150 to 200µm cooling carbon fiber support Pixel bus ladder ladder J.M. Heuser
extender LASER DIODE Power supplies connector 28 47 Flash Ana Dig 13.8 GOL 11 ADC PILOT PILOT Laser + 2 pin diodes 8 95 Space reserved for connections between mcm and extender Pilot MCM J.M. Heuser
analog pilot digital pilot GOL ALICE Pixel Detector Some impressions from the comprehensive ongoing prototype testing: ladder/half-stave prototyping bus prototyping: Cu Al/Kapton pilot MCM prototyping J.M. Heuser
NA60 Pixel Detector GOL digital pilot 4-chip plane with new pilot-GOL type control. Feb. 2003: Works! 8-chip prototype plane with old “MB” type control. J.M. Heuser
RIKEN plans - We know how to use this pixel detector technology. - We know the requirements for a PHENIX application. - Private discussions on technological issues and approaches were started with the ALICE pixel and CERN Microelectronics groups. - To arrive at a RIKEN plan on how to build a Pixel detector module for PHENIX using CERN pixel technology, we will first discuss inside RIKEN to consolidate ideas and approaches. Those will be discussed in PHENIX. J.M. Heuser