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CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering. Ismail Fidan, Ph.D. Tennessee Technological University Cookeville, TN 38505. Outline of the Presentation. Introduction Research Background Current Development Future Research Directions Conclusions

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CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

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  1. CAPP for Electronics ManufacturingCase Study: Fine Pitch SMT Laser Soldering Ismail Fidan, Ph.D. Tennessee Technological University Cookeville, TN 38505

  2. Outline of the Presentation • Introduction • Research Background • Current Development • Future Research Directions • Conclusions • Acknowledgements

  3. Steps of Electronic Manufacturing and Rework Process

  4. Parameters affecting the Dispensing Quality

  5. Electronics Manufacturing/ Re-manufacturing Cell

  6. Initial Search and Ideas • Jean-Paul Clech • Solder Reliability Solutions, SRS 1.1 • Ismail Fidan and Russell Kraft • “Inline Troubleshooting for Electronics Manufacturing Systems,” • Proceedings of the 2000 IEEE/CPMT/IEMT Symposium, • pp. 338-343, Santa Clara, CA.

  7. Laser Soldering System used by Fidan for his Analytical Work

  8. Analytical Work done by Fidan

  9. Experimental Work done by Yang

  10. Computer-Aided Process Planning Tool for Elect. Mfg.

  11. Setting Parameters with the Computer-aided Process Planning Tool

  12. CAPP Evaluates the Settings and Reports the Final Joint Quality

  13. Parameters for Two Experiments Case # 1 2 Laser Source CO2 Nd:YAG Beam Type Pulsed Continuous Beam Power 20 W 15 W Beam Size 2 mm 3 mm Scan Speed 2 mm/sec 1 mm/sec Beam Height 10 mm 15 mm Final Joint Quality Unreliable Reliable

  14. Results Case 1 Case 1

  15. Results Case 1 Case 1

  16. Results Case 2 Case 2

  17. Future R&D Directions

  18. Future R&D Directions

  19. Conclusions • Correcting faulty PCBAs is an essential part of electronics Manufacturing • Knowledge-based Process Planning system extremely helpful to operator • CAPP eliminates trial and error runs - saves time and money • Future developments will add more electronic manufacturing processes

  20. Acknowledgements • NASA/ISGC • ILT Inc., IA • AIT Inc., NY • UNI Material Testing Lab., IA • TRW, WI • Rockwell/Collins, IA

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