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Precision Machining

Precision Machining. Extreme Tolerances Exotic Materials ( SiC , Sapphire, Ceramics, Hard Materials Sub-micron precision, small and large parts MEMs scale parts and features by direct machining CNC Milling Wire EDM micro EDM Grinding Wafer Dicing Wafer Thinning Lapping, CMP

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Precision Machining

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  1. Precision Machining • Extreme Tolerances • Exotic Materials (SiC, Sapphire, Ceramics, Hard Materials • Sub-micron precision, small and large parts • MEMs scale parts and features by direct machining • CNC Milling • Wire EDM • micro EDM • Grinding • Wafer Dicing • Wafer Thinning • Lapping, CMP • Precision Tooling • Diamond Turning* (fly cutting at sister shop, internally soon)

  2. High Speed High Accuracy CNC Milling • Linear Motors • 14 in stages • .25 um accuracy • High Speed • Ceramics • Hard Metals

  3. Wire EDM • 8 axis controller • Fine wire • Linear Motors • Sub-micron accuracy

  4. Micro Sinker EDM • Linear Motors • Sub-micron accuracy • Holes as small as 5 um

  5. Grinding • 4 surface grinders • Tropel flatness measurement • Air bearing spindles • Sub-micron flatness

  6. Wafer Dicing • Sub-mircon position accuracy • Silicon • Compound Semi • Ceramics • Glass Lapping & Polishing • Diamond and other compounds • Hard and soft plates and pads • ELG (electronic lapping guides) • CMP

  7. Complex Wafer Chuck Precision sub-micro accuracy CNC machining of Zerodur glass Metrology Post Cr thin film transmission test Light-weighted Zerodur backside

  8. Semiconductor Wafer Tooling Examples Zerodur Glass 300mm Wafer Chuck SiCWafer-to-Wafer Bonding Plates – Upper and Lower Pair

  9. SiC Vacuum Chuck Tools Lower Substrate Vacuum Chuck 400 um x 200 um deep vacuum channels Upper Bond Arm Pick Up Chuck for rectangular chip 800 um vacuum thru holes in 6 mm thick SiC

  10. SiC Tooling for National Lab Customer – Arc Design

  11. Fine Wire EDM

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