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COMP541 Memories II: DRAMs

COMP541 Memories II: DRAMs. Montek Singh Mar 21, 2012. Topics. Last class: Read-Only Memories (ROMs) Static Random-Access Memory (SRAM) Today: Dynamic Random -Access Memory (DRAM). Dynamic RAM. Very “ light-weight ” bit-level memory a single capacitor holds charge (= value)

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COMP541 Memories II: DRAMs

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  1. COMP541Memories II:DRAMs Montek Singh Mar 21, 2012

  2. Topics • Last class: • Read-Only Memories (ROMs) • Static Random-AccessMemory (SRAM) • Today: • Dynamic Random-Access Memory (DRAM)

  3. Dynamic RAM • Very “light-weight” bit-level memory • a single capacitor holds charge (= value) • no charge = ‘0’ • a single transistor acts as gate • Write: connect switch & add charge to store a ‘1’… • … then disconnect switch • Read: read by connecting switch

  4. DRAM Bit Cell • Very lightweight • contrast with SRAM • DRAM cell consists of one transistor and one capacitor! • SRAM cell has at least 6 transistors SRAM bit cell: DRAM bit cell:

  5. Hydraulic Analogy: Writing Storage Full (1) Empty (0) Pump fills tank to 1 value Pump drains tank to 0 value

  6. Hydraulic Analogy: Reading Outside water begins at intermediate level (black wavy line) Tank had a 1 value – raises water level Tank had a 0 value – lowers water level

  7. DRAM Characteristics • Destructive Read • When cell is read, charge is (partially) removed • Must be restored after each read! • Refresh • Also, there’s steady leakage • Charge must be restored periodically

  8. DRAM Logical Diagram Control circuitry Core memory storage

  9. DRAM Read Signaling • Since DRAM is often on a separate chip • number of pins available can be a limitation • lower pin count by using same pins for row and column addresses Delay until data available

  10. DRAM Write Signaling

  11. DRAM Refresh • Many strategies • refresh circuits on chip • here a simple row counter: reads and writes back

  12. Refresh Timing • Say, need to refresh every 64ms • Distributed refresh • Spread refresh out evenly over 64ms • Say on a 4Mx4 DRAM, refresh window for row 64ms/4096=15.6 us • Total time spent is 0.25ms, but spread • Burst refresh • Same 0.25ms, but all at once • May not be good in a computer system • Refresh takes low % of total time

  13. Bidirectional Lines • Another optimization for reducing pins: • Many chips have one set of data pins • same pins used as data input for write operations • same pins used as data output for read operations • otherwise float them (i.e., tri-state) • Makes sense because don’t need both read/write data at once

  14. Synchronous DRAM (SDRAM) • Has a clock • Common type in PCs late-90s • Typical DRAMs still synchronous • Multiple banks • Pipelined • Start read in one bank after another • Come back and read the resulting values one after another

  15. Modes of DRAM operation • DRAMs optimized to read & write entire blocks • or at least a few consecutive locations • Several different modes • normal/basic mode • Nibble or Burst Mode • Fast Page Mode • Extended Data Out (EDO) Mode

  16. Basic Mode of Operation Address Row Column RAS CAS Data Data • Slowest mode • Uses only single row and column address • Row access is slow (60-70ns) compared to column access (5-10ns) • Leads to three techniques for DRAM speed improvement • Getting more bits out of DRAM on one access given timing constraints • Pipelining the various operations to minimize total time • Segmenting the data in such a way that some operations are eliminated for a given set of accesses

  17. Nibble (or Burst) Mode RAS ---- ---- ---- ---- ---- ---- ---- ---- ---- CAS CAS CAS CAS RA CA D1 D2 D3 D4 • Several consecutive columns are accessed • Only first column address is explicitly specified • Rest are internally generated using a counter

  18. Fast Page Mode RAS ---- ---- ---- ---- ---- ---- ---- ---- ---- CAS CAS CAS CAS RA CA1 CA2 CA3 CA4 D1 D2 D3 D4 • Accesses arbitrary columns within same row • Static column mode is similar

  19. EDO Mode RAS ---- ---- ---- ---- ---- ---- ---- ---- ---- CAS CAS CAS CAS CAS CAS CAS RA CA1 CA2 CA3 CA4 CA5 CA6 CA7 D1 D2 D3 D4 D5 D6 • Arbitrary column addresses • Pipelined • EDO = Extended Data Out • Has other modes like “burst EDO”, which allows reading of a fixed number of bytes starting with each specified column address

  20. DDR DRAM • Double Data Rate (DDR) SDRAM • Transfers data on both edges of the clock • Currently popular • You get two memory accesses per clock cycle!

  21. RAMBUS DRAM (RDRAM) • Another attempt to alleviate pinout limits • Many (16-32) banks per chip • Made to be read/written in packets • Up to 1200MHz bus speeds • XDR – 8 bits per clock, 16-bit wide bus, 6.4GB • But DDR doing very well also • Quite expensive • almost disappeared from consumer PCs • still present in servers and specialized chips

  22. DRAM Controllers • Very common to have a separate chip/module that controls memory • Handles banks • Handles refresh • Multiplexes column and row addresses • RAS and CAS timing • Called “Northbridge” on PC chip set

  23. Conclusions • RAMs with different characteristics • For different purposes • Static RAM • Simple to use, small, expensive • Fast, used for cache • Dynamic RAM • Complex to interface, largest, cheap • Needs periodic refresh

  24. Links • Ram Guides (not very technical) • http://arstechnica.com/paedia/storage.html • Your Nexys 3 board manual

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