EPIX: Enabling Pixels for Innovative eXperiments

1. EPIX: Enabling Pixels for Innovative eXperiments An ITN multi-site proposal to get EU funding for 14 young researchers for pixel developments

2. What is an ITN ? • ITN: Initial Training network • Multisite (in Europe), Min 3 partners • Max 500man-months per ITN • ESR (Early Stage Researcher): 3 year (PHD highly encouraged), ~4kE/month • ER (Experienced Researcher) : 2 year ~post-doc (max ~2 in ITN) • Confortabletraining/travel budget ( ~1800E/month per ESR) • Max ITN: ~14 = 2 ER of 2 years, + 12 ESR of 3 years • Full partners (European) can get 1 – 5 MC (Marie Curie fellows) • MC can not have worked/studied for more than 12months during the last 3 years in the country where he/she will be hired as MC. (rotation between ITN partners) • All nationalities can apply as MC • Companies as full partners, a must to succeed • Associated partners ( Other institutes, Non EU, Companies , ,) • EU purpose: • Training of young researchers in international network working on “top of the line” research, including industries. Preparation for job market and/or future researcher. • Our Purpose: • Get good young, motivated and “experienced” people to work on our specific projects and R&D.

3. ITN • ITN proposal success rate • Global: ~7%, CERN: ~30% Significant efforts have been spent on writing non successful ITN proposals ! • Significant overhead: • Writing proposal • Manage ITN: Admin, EU reporting, Extensive training, Outreach, etc. • Vital to get good MCs • Otherwise return on investment can be negative !. • Deadline Nov. 22 2012 • 2013: Most likely no call ! • 2014 - ?: Framework 8 program, ITN ?, budget costs ?

4. Pixel ITN • Pixels is a HEP domain with a good chance for EU funding as we develop front-line pixel detectors for particle (radiation) detection • Sensors (LHCb) • Pixel detector systems (Talent – ATLAS IBL): Sensor – ASIC integration, low mass modules, interconnect technology, cooling, readout systems , , • Pixel ASIC’s and electronics: Complex Mixed signal IC’s, Low power, Radiation tolerant, Integration with sensor, readout , • Spin-offs to industry have been demonstrated • Medipix - Panalytical, (plus others) • Nikhef – Amsterdam Scientific Instruments • CPPM - Imxpad, • VTT - Advacam • (PSI-Pilatus – Dectris), • Others ? • Good training environment for ASIC design, radiation tolerance, High density interconnect, General electronics, detectors, readout systems and general instrumentation, , , • Good opportunities for PhD work.

5. LHC pixel upgrades • CMS: Phase 2, 65nm: ~50um x 100um, Hybrid, Very high rate, Very high radiation, triggered, trigger functions ?, , • INFN Torino, INFN-Perugia, CERN, Fermilab, (PSI, Pisa, DESY)INFN-Padova • ~2020 • ATLAS: Phase 2, 65nm, ~50um x 100um, Hybrid, Very high rate, Very high radiation, triggered , trigger functions ? , , • Bonn, Marseilles, NIKHEF, LBNL • ~2020 • LHCb(/Timepix): Phase 1, 130nm: ~55um x 55um, Hybrid, High rate, no trigger, , • Good synergy between Timepix/LHCb pix • NIKHEF, CERN, • ~2016 • CLIC: 65nm, ~25um x 25um, Hybrid, Low rate, Low mass, No trigger. • CERN, ? • > 2020 (2030?) • ALICE: 180nm, ~20um x 20um, Monolithic, Moderate rate, low mass, triggered • CERN, ? • ~2016

6. How this “fit together” High rate, High radiation Moderate rate, High resolution ALICE: 180nm Monolithic Mid term: ~2016 LHCb: 130nmHybrid Triggered Long term: > 2020: ATLAS/CMS: 65nm Hybrid CLIC: 65nm Hybrid

8. Companies • Spin-offs from HEP pixels: • ASI: Pixel detector systems based on timepix (Nikhef - CERN) • imXPAD: Pixel detectors (CPPM) • Interconnect technology: • IZM: Fine pitch bump bonding and 3D interconnect • Advacam: Fine pitch bump bonding and TSV(edgeless sensors) • Rockwood: Wafer thinning • Dr.Megenthaler: Laser welding/soldering • Radiation tolerance: • MAPRad: radiation test/qualification for aerospace • Instrumentation: • Agilent: Simulation tools for high speed signals, instrumentation

9. EPIX work packages • High rate radiation hard pixel ICs: 6 ESR, 1 ER • Project: 65nm for ATLAS/CMS pixels • CERN-CMS: Modelling and optimization of intelligent and fault tolerant very high rate pixel architecture • INFN Perugia-CMS: Design and optimization of very low power pixel region logic • INFN Torino-CMS: Development of very low power small size analogue electronics for high rate pixels • INFN Padova: Radiation hardness assessment of 65nm technology • Bonn-ATLAS: Radiation hard mixed signal chip design in 65nm • Nikhef-ATLAS: Radiation hard timing circuits in 65nm • CPPM-ATLAS: SEU tolerant memories and registers • Associated partners: Perugia university (electronics and computing), Pisa University (engineering and computing) , MAPRad, LBNL, Fermilab • High density and low mass interconnect and packaging: 3 ESR, 1 ER • Projects: ALICE, CLIC, ATLAS • CERN–CLIC: High density interconnect for pixel detectors and X-ray imaging • CERN–ALICE: Low mass and low cost interconnect solutions for pixel detectors • IZM–ATLAS: 3D interconnect for hybrid pixels. • Advacam CLIC: Ultra-fine pitch Cu pillar flip-chip interconnect • Associated: Rockwood, Mergenthaler • High speed readout and characterization: 3 ESR • Project: LHCb + commercial pixel systems • CERN–LHCb: High bandwidth data interface for pixel detectors • ASI: Readout and characterization system for pixel detectors • imXPAD: Pixel chip simulation, readout and calibration system • Associated: Agilent

10. ITN Proposal • Science and Technology: 10 pages • Training: 10 pages • Implementation: 8 pages • Impact: 4 pages • Capacities of participants, Letters of commitment, Ethics issues, Gantt chart 68 pages put together in ~1 month and submitted last Thursday. Thanks to all participants and in particular Frank Cliff. If accepted it will add significant (young) manpower to the R&D program of ATLAS/CMS pixel phase2 Feedback from EU: ~February Possible start: ~September