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Beam tests of an integrated TPC endplate with 2-Phase CO2 cooling

Beam tests of an integrated TPC endplate with 2-Phase CO2 cooling. Gaseous detectors, upgrade of the Large Prototype at DESY Integration of endplate and module systems. P. Colas. Menu. Integration of electronics Cooling Advantages of 2PCO2 TRACI Test on one module at NIKHEF

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Beam tests of an integrated TPC endplate with 2-Phase CO2 cooling

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  1. Beam tests of an integrated TPC endplatewith 2-Phase CO2 cooling Gaseous detectors, upgrade of the Large Prototype at DESY Integration of endplate and module systems P. Colas

  2. Menu • Integration of electronics • Cooling • Advantages of 2PCO2 • TRACI • Test on one module at NIKHEF • Test on 7 modules at DESY Test Beam • Spending • Future (AIDA 2?) TPC module integration

  3. Integration of electronics • AFTER-basedelectronics (T2K) must beminiaturized to fit behind a module within 5cm and 0.25 X°. • This has been achieved (within AIDA) (62700 € in 2013) TPC module integration

  4. This is for AFTER chips. Similarworkisbeingdonewith S-ALTRO Integrated electronics • Remove packaging and protection diodes • Wire-bond AFTER chips • Use two 300-point connectors Front-End Card (FEC) 25 cm 4.5cm 12.5cm 14 cm 3.5cm 2.8cm 0.78cm 3.5cm AFTER Chip 0.74cm • The resistive foil protects against sparks

  5. COOLING: why 2-phase CO2? • Lowviscosityallowsverysmall pipe diameter and lowDP. • Very large latent heat and heatcapacitymakesit an excellent cooler • Can work at room temperature (avoidsdripping water by condensation) • Howeverneedsvery high pressures (50 bar for 20 degrees) TPC module integration

  6. COOLING: why 2-phase CO2? TPC module integration

  7. COOLING: TRACI • Weused the TRACI purchased by KEK and installed at DESY in February 2014. TPC module integration

  8. TPC module integration

  9. TPC module integration

  10. COOLING: Tests at nikhef(1 module) TPC module integration

  11. COOLING: Tests at nikhef(1 module) TPC module integration

  12. COOLING: Tests at DESY (7 modules) TPC module integration

  13. COOLING: Tests at DESY (7 modules) 7 temperature probes (1 per FEC, 1 FPGA) TPC module integration

  14. SPENDING • The ‘plumbering for the coolingcosted about 22 k€ in 2014. • 100% of the spending for this has been used. The resultsoverpass the initial goals. TPC module integration

  15. outlook • New materials. (Ex: TPG) lighterthan Al, withtwicebetter thermal conductivity • New technique (3D printing) allows micro-channels to bebuilt TPC module integration

  16. Summary • A demonstration of full integration of an endplate meeting the requirements of a LC TPC has been made. • A first try of using 2PCO2 for a TPC has been made, showingthatthis solution isvery attractive. • This opens the way to furtherdevelopments, using new materials (TPG) and new techniques (3D printing) to getuniformtemperatureacross the endplate. TPC module integration

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