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Surface Concept Position Sensitive MCP Detectors Novel Solutions A. Multi-Segment Detectors

Surface Concept Position Sensitive MCP Detectors Novel Solutions A. Multi-Segment Detectors. Multi-hit 2D/3D 4-fold delay line detector Up to 4 multi hits with absolutely zero dead time Up to 400 multi hits per 1 µs Burst rates above 100 MCPS equivalent

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Surface Concept Position Sensitive MCP Detectors Novel Solutions A. Multi-Segment Detectors

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  1. Surface Concept Position Sensitive MCP DetectorsNovel SolutionsA. Multi-Segment Detectors

  2. Multi-hit 2D/3D 4-fold delay line detector • Up to 4 multi hits with absolutely zero dead time • Up to 400 multi hits per 1 µs • Burst rates above 100 MCPS equivalent • 60 x 60 mm² (or 80 x 80 mm²)active area of DLD body and  80 mm active MCP area • Down to 30 µm of pixel size • < 250 ps over all time resolution • Linear response due to single event counting • Extremely low dark count rate:  0.2 cps/ cm² • Up to 40 MCPS random hit rate in 2D/3D mode Position sensitive 4 Quadrant DLD layouts 3D-DLD4040-4Q (80 mm diameter) and 3D-DLD3030-4Q (60 mm diameter): 4 fold segmented DLD using 4 independent DLD readout systems in parallel each segment has low dead times (15 ns DLD4040-4Q / 9 ns DLD3030-4Q)

  3. Single particle detectors but > 100 Multihits by means of multiline MCP detectors!!! The logical consequence: 256 fold multi-line delay line detectors where as each line is working separately: multi hit capability will exceed 100 when each 1D-delay line can detect double hits! Callenging Project of Surface Concept in collaboration with CFEL at European XFEL in Hamburg: 256 Multi-Lines at the MCP anode as separated 1D-Delay Lines

  4. Readout Principle of a 64 fold Multi-line Delay Line Detector

  5. The Delay-Cluster-Anode-Detector DCA4020 2D delay line based electron detector for very high multi-hit number recognition (FEL optimized detector) • 9 Energy Channels on 40 mm length • 16 Angle Slices on 20 mm • Up to 140 parallel hits recognizable • Dead time after multi-hit flash < 100 ns • >1000 time slices for micro-bunch assignments Features / Specifications Features / Specifications • 3D(x,y,t) detector with enhanced multi-hit cap. • CF150 mounting flange • active area of DCA anode: 40 mm x 20 mm • active MCP diameter:  40 mm 1 • typ. single anode size: 1.2 mm x 4 mm, 16 x 9 array • typ. time resolution:  500ps, • linear response due to single event counting2 • extremely low dark count rate: typ. < 0.2 counts per second per cm^2 • max. random countrate > 15 Mcps in 2D/ 3D mode • hardware handshake exposure feature for FEL structure synchronization

  6. Layout of the 16x9 multi-pad claster anode: • each line: 9 pads connected by 7 ns delays (8 in one row) • 16 delay lines which are read in separately, 16 vacuum feedthroughs • 16 amplifiers / discriminators • 16 channel time sequencer (TDC) with trigger for bunch structure 16 x 8 delays of 7 ns integrated into detector anode in vacuum 16 16 x Amplifier - Pulse – Processing USB 2.0 16 channel Time Sequencer And Trigger Unit PC Trigger from/ to FEL

  7. Surface Concept Position Sensitive MCP DetectorsSpecial SolutionsB. MCP Detectors with Phosphor Screen

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