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Fundamentals of CMOS VLSI Circuit Design

This course covers the basics of CMOS VLSI circuit design, including MOS layers, stick diagrams, design rules, and layout examples.

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Fundamentals of CMOS VLSI Circuit Design

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  1. Subject Name: Fundamentals Of CMOS VLSI Subject Code: 10EC56 Prepared By: Aswini N, Praphul M N Department: ECE Date: 10/11/2014 Engineered for Tomorrow Prepared by : MN PRAPHUL & ASWINI N Assistant professor ECE Department Date : 11/10/14

  2. Engineered for Tomorrow Unit 2 Circuit design process

  3. Engineered for Tomorrow Syllabus • MOS Layers. • Stick diagram. • Design rules and layout • Examples

  4. Engineered for Tomorrow MOS layers • MOS circuits are formed on four basic layers: • N-diffusion • P-diffusion • Polysilicon • Metal • These layers are isolated by one another by thick or thin silicon dioxide insulating layers. • Thin oxide mask region includes n-diffusion / p-diffusion and transistor channel.

  5. Engineered for Tomorrow Stick diagrams • Stick diagrams may be used to convey layer information through the use of a color code. • For example: • n-diffusion --green • poly -- red • blue -- metal • yellow --implant • black --contact areas

  6. Engineered for Tomorrow Encodings for NMOS process:

  7. Engineered for Tomorrow Encodings for CMOS process: • Figure shows when a n-transistor is formed: a transistor is formed when a green line (n+ diffusion) crosses a red line (poly) completely. • Figure also shows when a p-transistor is formed: a transistor is formed when a yellow line(p+ diffusion) crosses a red line (poly) completely

  8. Engineered for Tomorrow Encoding for BJT and MOSFETs: layers in an nMOS chip consists of • a p-type substrate • paths of n-type diffusion • a thin layer of silicon dioxide • paths of polycrystalline silicon • a thick layer of silicon dioxide • paths of metal (usually aluminium) • a further thick layer of silicon dioxide

  9. Engineered for Tomorrow nMOS depletion inverter diagrams schematic stick diagram layout

  10. Engineered for Tomorrow CMOS inverter diagrams schematic stick diagram layout

  11. Engineered for Tomorrow NAND gate implementation using nmos depletion schematic stick diagram

  12. Engineered for Tomorrow NOR gate implementation using nmos depletion schematic stick diagram

  13. Engineered for Tomorrow NAND gate implementation using CMOS schematic stick diagram

  14. Engineered for Tomorrow NOR gate implementation using CMOS schematic stick diagram

  15. Engineered for Tomorrow Lambda based Design Rules: • Design rules include width rules and spacing rules. • Mead and Conway developed a set of simplified scalable λ -based design rules, which are valid for a range of fabrication technologies. • In these rules, the minimum feature size of a technology is • characterized as 2 λ . • All width and spacing rules are specified in terms of the parameter λ .

  16. Engineered for Tomorrow Design rules for the diffusion layers and metal layers Figure shows the design rule n diffusion, p diffusion, poly, metal1 and metal 2. The n and p diffusion lines is having a minimum width of 2λ and a minimum spacing of 3λ. Similarly it shows for other layers.

  17. Engineered for Tomorrow Design rules for transistors and gate over hang distance Figure shows the design rule for the transistor, and it also shows that the poly should extend for a minimum of 2λ beyond the diffusion boundaries.(gate over hang distance)

  18. Engineered for Tomorrow Via • VIA is used to connect higher level metals from metal1 connection. Figure shows the design rules for contact cuts and Vias. The design rule for contact is minimum 2λx2λ and same is applicable for a Via.

  19. Engineered for Tomorrow Buried contact and Butting contact Buried contact is made down each layer to be joined Butting contact The layers are butted together in such a way the two contact cuts become contiguous

  20. Engineered for Tomorrow CMOS LAMBDA BASED DESIGN RULES: Figure shows the rules to be followed in CMOS well processes to accommodate both n and p transistors

  21. Engineered for Tomorrow BASIC PHYSICAL DESIGN FLOW

  22. Engineered for Tomorrow SCHEMATIC AND LAYOUT OF BASIC GATES a) CMOS INVERTER NOT GATE Schematic Stick diagram Layout

  23. Engineered for Tomorrow b) NAND GATE Schematic Stick diagram Layout

  24. Engineered for Tomorrow

  25. Engineered for Tomorrow TRANSMISSION GATE Symbol schematic stick diagram layout

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