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Taguchi Method and SPC system in Semiconductor Manufacturing

Taguchi Method and SPC system in Semiconductor Manufacturing . Chin-Yuan Chen 陳志遠 Quality Manufactory Advance Semiconductor Engineering Manufacturing Company, Ltd Fisher_Chen@aseglobal.com. April 30, 2010. Abstract:.

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Taguchi Method and SPC system in Semiconductor Manufacturing

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  1. Taguchi Method and SPC system in Semiconductor Manufacturing Chin-Yuan Chen 陳志遠Quality ManufactoryAdvance Semiconductor Engineering Manufacturing Company, Ltd Fisher_Chen@aseglobal.com April 30, 2010 Page 1

  2. Abstract: This presentation will cover the following topics, Taguchi Method Application in Assembly and Testing Site, SPC appliation system in Assembly process. • First, to present basic process introduction of semiconductor of assembly and testing. Taguchi Methodology and examples of assembly/test will be shown. To assist engineers to find root casue and enhance process capability, reduce variance, improve process capacity. Our company offer complete statistic training to new engineers. • However, SPC methodology is most important tool for process control. To understand SPC concept, QC tools and OCAP(Out of Control Action Plan) become basic request of engineers. • JMP software Page 2

  3. The statistical software in ASE Page 3

  4. The statistical software in ASE Page 4

  5. Content: • Assembly/Test brief introduction 2. Taguchi Method in test site - Enhance wrinkle bump yield 3. Taguchi Method in Assembly site - Gold Wire Diameter Reduction Evaluation 4. SPC in Assembly site Page 5

  6. 1. Assembly/Test brief introduction Page 6

  7. What common point they had? Page 7

  8. Page 8

  9. Page 9

  10. Page 10

  11. ASE Vision:The Comprehensive Solution Module, Board Assembly & Test (DMS) Final Test Assembly Wafer Bumping/Probing Foundry Materials Circuit Design Engineering Test Page 11

  12. . . . . . . . . . . 晶圓 (研磨後) . . 缺點檢查 Brief Assembly Process 研磨 晶片切割 缺點檢查 黏晶片 已切割 Page 12

  13. . . . . . . . . . . . . Brief Assembly Process 上銀膠 黏晶粒 銲線 Page 13

  14. Brief Assembly Process 銲線缺點檢驗 金線直徑(20um)約頭髮直徑(40um)的一半 Page 14

  15. Brief Assembly Process 封膠 正印 植球 Page 15

  16. Brief Test Process 測試 Page 16

  17. Contact pushor TESTER Contact blade Dut socket Handler Loadboard TEST HEAD Interface 晶圓Wafer Brief Test Process Page 17

  18. 2. Taguchi Method in test site Page 18

  19. Bump Status Check Wrinkle bump issue Low Yield Normal bump Wrinkle bump Page 19

  20. Test Pin Test Pin Normal Bump Wrinkle Bump Page 20

  21. Normal Bump Wrinkle Bump If you are engineer, then what will you improve? Page 21

  22. Hint Good Contact Good Yield Page 22

  23. Normal Bump Wrinkle Bump Contact deeper (Enhance Over Drive) Page 23

  24. Taguchi Method Page 24

  25. Taguchi Method - Analysis To choose L9 Taguchi experiment matrix and consider two response(y) as above table. Page 25

  26. Taguchi Method- Analysis Page 26

  27. 3. Taguchi Method in Assembly site Page 27

  28. History • Customer want cost saving with device, and to reduce gold wire diameter. • Current diameter is 25um, customer request to reduce as 20 um. • Current composition is Au, customer need to replace by Au-Pb. Page 28

  29. Structure 652 golden wire Page 29

  30. Taguchi Matrix Page 30

  31. Taguchi Analysis Result On Desirability Functions The desirability functions are smooth piecewise functions that are crafted to fit the control points. The minimize and maximize functions are three-part piecewise smooth functions that have exponential tails and a cubic middle. The target function is a piecewise function that is a scale multiple of a normal density on either side of the target (with different curves on each side), which is also piecewise smooth and fit to the control points. These choices give the functions good behavior as the desirability values switch between the maximize, target, and minimize values. For completeness, we implemented the upside-down target also. JMP doesn't use the Derringer and Suich functional forms. Since they are not smooth, they do not always work well with JMP's optimization algorithm. Page 31

  32. 4. SPC in Assembly site Page 32

  33. Page 33

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  35. Page 35

  36. 授權書 範例內容(Enhance wrinkle bump yield, Gold Wire Diameter Reduction Evaluation) 的原作者之授權 Page 36

  37. 攜帶物品 八吋晶圓(破片)乙片 PBGA(正印已處理過)四顆 PBGA 空基版四條 Page 37

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