1 / 20

APV

CMS LHC strip readout system. APVMUX. CMS FED (9U VME). APV. analog opto-hybrid. ~100m. lasers. inner barrel sensor. 96. 12. laser driver. PA. readout hardware shopping list – for 8 sensors (4 XY planes) 8 CMS hybrids (6 chips version) 8 analogue opto-hybrids

magee
Download Presentation

APV

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. CMS LHC strip readout system APVMUX CMS FED (9U VME) APV analog opto-hybrid ~100m lasers inner barrel sensor 96 12 laser driver PA • readout hardware shopping list – for 8 sensors (4 XY planes) • 8 CMS hybrids (6 chips version) • 8 analogue opto-hybrids • optical stuff (need to discuss details with expert) • laser fibres -> 12 way ribbons -> long dist. cables -> FED • need 24 fibres altogether – 2 x 12 way ribbons • 1 FED • 1 TTCvi – provides electrical TTC signals • 1 TTCex – provides electro-optical conversion • 1 crate controller • control hardware • assume providing electrically • i.e. without CCU, etc.. • SeqSi (40 MHz/L1) • 2 x VI2C (4 chans / board) • trigger logic + power supplies, crates (1 or 2), cables, connectors, ….

  2. XY plane box (light tight) 250 mm 250 mm ~50 mm baseplate (dimensions not critical) adjustable feet for levelling

  3. XY plane box (light tight) RS diecast box (sides not at right angles to base) 250 mm ~100 mm 250 mm ~100 mm vertical piece to mount box on baseplate (dimensions not critical) method of fixing vertical piece to baseplate not shown adjustable feet for levelling

  4. XY plane XY plane XY plane XY plane few 10’s m ~ m ~ m • I2C: 1 bus per plane • actively split inside plane module • also opto-isolated • Ck/T1: 1 shielded pair per plane • CK/T1 combination at VME end • (separate module) • 1 fibre ribbon (50% utilised) per plane VI2C SeqSi TTCex TTCvi crate controller 9U/6U VME FED

  5. I2C link 5V 5V 5V 2.5V 5V 2.5V ~ 10’s m buffer buffer opto- isolate I2C de-mux level shift 1st APV/opto hybrid VI2C level shift 2nd APV/opto hybrid VME (1 channel) ancilliary I2C circuits separate VME buffer module (4 chan – can also incorporate Ck/T1 opto-buffering) within front end XY plane enclosure level shift resets Ck/T1 link ~ 10’s m Ck Ck/T1 combine 1st APV/opto hybrid SeqSi opto-buffer opto-receiver 2nd APV/opto hybrid T1 fibre-optic 1st APV/opto hybrid opto-buffer opto-receiver 2nd APV/opto hybrid 1st APV/opto hybrid opto-buffer opto-receiver 2nd APV/opto hybrid 1st APV/opto hybrid opto-buffer opto-receiver 2nd APV/opto hybrid

  6. power I2C, RST Ck/T1 HT 1 I2C bus comes in split into 3 (2 modules + Peltier) and also generate reset Ck/T1 comes in as combined signal but needs to be recovered and buffered as LVDS will need Peltier control circuitry AOH

  7. power I2C, RST Ck/T1 power I2C, RST Ck/T1 HT AOH HT AOH

  8. Optical rail system up to 2 m 50 mm 80 mm X48 system from www.newport.com assume this will sit on stable table (provided by someone else) feet allow some adjustment for levelling will still need some other mechanism for overall height

  9. HV

  10. 2k2 680 +HV 1k 10k

  11. power I2C, RST Ck/T1 HT AOH

  12. HV, LV I2C, RST Ck/T1 ceramic piece (same thickness as hybrid) ceramic hybrid sensor AOH Al support plate with cutout beneath sensor

  13. HV, LV I2C, RST Ck/T1 ceramic piece (same thickness as hybrid) ceramic hybrid sensor AOH Al support plate with cutout beneath sensor

  14. HV, LV I2C, RST Ck/T1 sensor AOH

  15. Al alloy plate 215 mm 12 mm 80 mm 75 mm 15 mm 18 mm ~3 mm

  16. HV, LV I2C, RST Ck/T1 ceramic piece (same thickness as hybrid) ceramic hybrid sensor AOH Al support plate with cutout beneath sensor peltier heatsink fan

  17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . power + contrl (type 1) power + contrl (type 2) HV board single sided Cu PCB colour + caps 0.1” pitch holes Cu only as viewed on surface of board RS 681-0743 2x10 way DIL horiz socket 0.2” 0.05”

More Related