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IEEE Council on Electronic Design Automation. Report to SSCS Adcom Bryan Ackland 8/12/13. Members of CEDA. DTC TTC. Societies APS CAS CS EDS SSCS MTT. Tech. Member Org. DAC ICCAD DATE T-CAD ESL D&T CANDE DATC. SSCS Reps to CDA BOG: Bryan Ackland & Vivek Tiwari.
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IEEE Council on Electronic Design Automation Report to SSCS Adcom Bryan Ackland 8/12/13
Members of CEDA • DTC • TTC Societies • APS • CAS • CS • EDS • SSCS • MTT Tech. Member Org. • DAC • ICCAD • DATE • T-CAD • ESL • D&T • CANDE • DATC SSCS Reps to CDA BOG: Bryan Ackland & VivekTiwari
CEDA Highlights (1) • Conferences & Workshops • DAC 2013 in Austin (June) was 50th anniversary • 6 Keynotes spread across conference calendar • 1590 (full registration) 2360 (exhibit only) • Many special events including anniversary banquet including presentation of over 250 awards to those who had contributed over the years • Strategy Committee • Formed to develop long term plan and coordinate activities of various committees • June BoG meeting devoted to long term strategy brainstorming • Hardware EDA industry is mature and consolidating • Need to look for growth and emerging areas • Embedded Systems is a large growing community • mainly served by conferences & trade shows outside IEEE • Explore joint sponsorship in theses areas • Embedded Systems Week grow to 25%
CEDA Highlights (2) • Financial • Surplus of $167k at end of 2012 ($90k reinvested including $30k for web improvements) • Reserves of $1,136k at end of 2012 ( meeting goal of achieving $1M by 2015 goal). • 2014 plan is breakeven – will use $30k reserve to seed new outreach • Publications • Trans. on CAD generates significant income ($170k) - 35% acceptance rate – submission to publication ~ 11 months • Embedded System Letters in financial surplus – looking to grow readership • D&T continues to show net expense – control page budget and generate advertising • Awards • 2013 Newton Award: Keith Nabors and Jacob White for “FastCap: a multipole accelerated 3-D capacitance extraction program". IEEE TCAD Nov. 1991 • 2013 Kauffman Award: Chenming Hu, contributions in device physics, device modeling, and device reliability (BSIM and BERT models).