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Design and Implementation of VLSI Systems (EN1600) Lecture 32: Pad Frame Design and Packaging

Design and Implementation of VLSI Systems (EN1600) Lecture 32: Pad Frame Design and Packaging. Prof. Sherief Reda Division of Engineering, Brown University Spring 2008. [sources: Weste/Addison Wesley – Tanner Manual]. Packaging choices. Traditionally, chip is surrounded by pad frame

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Design and Implementation of VLSI Systems (EN1600) Lecture 32: Pad Frame Design and Packaging

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  1. Design and Implementation of VLSI Systems (EN1600) Lecture 32: Pad Frame Design and Packaging Prof. Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison Wesley – Tanner Manual]

  2. Packaging choices

  3. Traditionally, chip is surrounded by pad frame Metal pads on 100 – 200 mm pitch Gold bond wires attach pads to package Lead frame distributes signals in package Metal heat spreader helps with cooling Chip-to-Package Bonding

  4. Pad frame So far we looked at core design This lecture we look at pad frame design

  5. MOSIS AMI 0.5u Tiny Chip frame Tanner reserves one of the left pins for VDD and one of right pins for GND

  6. Generic pad layout

  7. Static electricity builds up on your body Shock delivered to a chip can fry thin gates Must dissipate this energy in protection circuits before it reaches the gates ESD protection circuits Current limiting resistor Diode clamps Diodes must be large to sustain significant current Example: Consider charge on human body discharged at a rate (current) = 10 uA for 1us at to a capacitor C=0.025pF → Voltage buildup = 400V destroys the transistor gate ESD protection

  8. Example 1: PADARef offers basic ESD protection metal 2 distributes VDD metal 1 distributes signal D Simplest pad

  9. Example 2: PADOUT Pad has internal buffer

  10. Automatic generation of pad frame in Tanner Tools • Add the pad library to your S-Edit design • Modify your design to use the pads. • Naming convention: if you name nets getting into a pad as PAD_L1 places the pad at the first left location in the pad frame.

  11. Automatic generation of pad frame in Tanner Tools 3. In L-Edit, change SPR setup to In padframe setup, Change the layout size to 1.5mm x 1.5mm Use the new library with the pads and press initialize setup In padroute setup, make sure you have these design rules

  12. Automatic generation of pad frame in Tanner Tools Finally run the place and route and make sure to mark “PadFrame generation” and “Pad route” You might get a few DRC violations in metal2 that you would need to fix yourself

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