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A Survey on Dual Interface and Multi Technology Cards

A Survey on Dual Interface and Multi Technology Cards. ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek. Content. Introduction DIC Dual Interface Cards Application, Technology, Challenges Multi Technology Cards Status on Components and Applications

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A Survey on Dual Interface and Multi Technology Cards

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  1. A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek

  2. Content • Introduction • DIC Dual Interface Cards • Application, Technology, Challenges • Multi Technology Cards • Status on Components and Applications • Technology and Development • Driving factors • Summary ICMA Expo, Prague

  3. Introduction Increasing complexity • Early 60s Plastic Cards started • Early 80s Chip Cards with Memory Chip • Mid 80s Processor Cards • Early 90s GSM SIM Cards • Late 90s Open Platform OS • Today Rapidly increasing Memory Various Open Platform OS Cryptographic Means Dual Interface Cards ICMA Expo, Prague

  4. Introduction Increasing complexity • Increasing Employment of Dual Interface Cards • Dedicated Contactless and Contact Usage • Integration of Electrical Functional Components • Battery, Display, Solar Power Unit, Switch,Sensors (e.g. Biometric) etc. • Project driven  Customizing, Non Standard • Low Volume and High Costs ICMA Expo, Prague

  5. Dual Interface Card- Application • Wireless Interface for Identification • Access • Low security ID • Contact Interface for Security/Signature • PKI for Transaction • Data Exchange with High Rates/Volume • High Security ID (e.g. Biometric) • Local and National ID Documents • Banking, Internet, E-commerce ICMA Expo, Prague

  6. Dual Interface Card- Technology • Module – Contacts – Antenna • Electrical Connection by • Isotropic conductive adhesive (ICA) • Welding Technologies (Solder) • Mechanical Connection (Crimping) • Anisotropic conductive adhesive (ACA) ICMA Expo, Prague

  7. *Anisotropic Conductive Adhesive adhesive matrix connection particals micro connections micro contacts adhesive matrix Dual Interface Card- Technology • ACA* Technique • Adhesive conducting the electricity just in one direction • Module adhesion and contact to the antenna in one step ICMA Expo, Prague

  8. Dual Interface Card- Challenges • Connection Module – Antenna • Mechanical and Environmental stress • Lifetime up to 10 years • Bridging technology from contact to contactless ICMA Expo, Prague

  9. DISPLAY KEYPAD SWITCH BATTERY RELOADABLE B. ANTENNA DIODES SENSORS BIOMETRIC SENSOR SOLAR POWER UNIT DATA STORAGE COMPUTING Multi Technology Cards- Status of Components ICMA Expo, Prague

  10. Multi Technology Cards- Status of Applications • Display Cards • Sensor Cards • Fingerprint means • Analog sensor ICMA Expo, Prague

  11. Button MCM-Module Internal interface Sensor Array External interface (ISO) Microcontroller External Power source Internal power source Sensorcard – presented by ORGA at Cartes 2000 Multi Technology Cards- Status of Applications ICMA Expo, Prague

  12. Multi Technology Cards- Status of Applications • Display Cards • Sensor Cards • Fingerprint means • Analog sensor • Audio Cards • Active RFID Label • Combinations ICMA Expo, Prague

  13. Multi Technology Cards- Technology Challenges RESET - Roadmap for European Research on Smartcard rElated Technologies • Communication and Network Protocol • Systems and Software • Smart Card Accepting Devices, Interfaces • Embedded Peripherals, Subsystems and Microsystems • High-End Cryptography, Tamper-Proof and Security Technologies • Micro-Electronics ICMA Expo, Prague

  14. Multi Technology Cards- Development • Few development activities specific to smart cards • High development activity for certain components • Driving factor are electronic devices (e.g. PDA, Mobile, electronic paper) DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH - DIODES - BATTERY - ANTENNA - SENSORS - AKKUMULATOR - SOLAR POWER UNIT - DATA STORAGE - COMPUTING ICMA Expo, Prague

  15. Multi Technology Cards- Driving factors • Business opportunities and market requirements • E-Business Services • Protection and Management of Digital Content • Contactless Access • Consumer requirements • Direct Interactivity • Fraud Reduction • Multi Application ICMA Expo, Prague

  16. Summary • Increasing DIC demand will lead to a reliable Module/Antenna connection • Products with Complex Electronic Circuits have been Proposed • High R&D Activity will Lead to New Components and Technologies for Smart Cards • Industrial High Volume Production not until 2006 • High Potential for Lucrative Business Cases ICMA Expo, Prague

  17. A Survey on Dual Interface and Multi Technology Cards THANK YOU FOR YOUR ATTENTION More Information: COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany Phone: +49-(0)4347-703526 – Email : janczek@cocaso.com www.cocaso.com ICMA Expo, Prague

  18. ICMA Expo, Prague

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