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KEK (+ UniGe ) Status. Y. Unno et al. Double-side modules. Leakage current after SB assembly. (*) ) later identified due to “no wire” wire-bonding, i.e., wedge hit sensor. Revised new jig (of KEK). Vacuum chuck with uniformly spaced vacuum holes, a la “SCT barrel module assembly jig”
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KEK (+ UniGe) Status Y. Unno et al.
Leakage current after SB assembly (*) )later identified due to “no wire” wire-bonding, i.e., wedge hit sensor.
Revised new jig (of KEK) • Vacuum chuck with uniformly spaced vacuum holes, a la “SCT barrel module assembly jig” • Sorry, no photo yet Before assembly (HPK) Before assembly (HPK) After SB assembly After SB assembly Back-side Front-side
Summary • KEK is required to provide 4 double-side modules to the super-module program. • Two are under fabrication, through very slow steps (wire-bonding debugging, assembly jig debugging, …) • Prospect: up to 4 would be completed by mid. Oct. • The revised new jig seems promising against the damage to the sensor in the SB assembly. • Need to watch out, yet.