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Yiren Wang and Shih-Hao Lee

Yiren Wang and Shih-Hao Lee. IUFRO Division 5 Conference 5. 02 .00 C Measurement methods including NDT Poster #20. Yiren Wang and Shih-Hao Lee. Predicting the Hygroscopic Warping of Solid-Wood Plate by Finite Element Analysis. National Chiayi University

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Yiren Wang and Shih-Hao Lee

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  1. Yiren Wang and Shih-Hao Lee IUFRO Division 5 Conference 5.02.00 CMeasurement methods including NDT Poster #20

  2. Yiren Wang and Shih-Hao Lee Predicting the Hygroscopic Warping of Solid-Wood Plate by Finite Element Analysis • National Chiayi University • Department and Graduate Institute of • Forest Products Science • #300 University Road • Chiayi 600 • Taiwan, ROC Taipei, Taiwan Chiayi

  3. Aim of work and methods • To gain the insight of warp mechanism in solid wood • To minimize the occurrence and amount of warp • Development of 3D finite element method to model and simulate warp in solid wood. • Exploratory case study with qualitative and quantitative methodology.

  4. Results The displacement of Ux, Uy, Uz The different color indicates the extent of the warping, which can be read from the scale bar. • The absolute value Ux is 0.00894 cm. The absolute value Uy is 0.221 cm. • The absolute value Uz is 1.532 cm. Figure 3. The isometric view of warping of full-scale solid-wood plate in the Uz. Figure 1. The isometric view of warping of full-scale solid-wood plate in the Ux. Figure 2. The isometric view of warping of full-scale solid-wood plate in the Uy.

  5. Conclusions • In this study, orthotropic finite element analysis was used successfully to simulate warping of solid plate due to moisture content gradient. • The moisture content gradient causes significant warping in the Uz. The least displacement, as expected, is in the Ux. • The practitioners can understand this behavior and serve as a guide to improve panel design by this simulation. • Limitation: • The accurate moisture content gradients • determination of visco-elastic behavior of solid wood at varying stress and moisture content levels.

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