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Problems to be studied Test protocol Thermal conductivity tests What next

STATUS OF GLUING AT 04.02.2003. Problems to be studied Test protocol Thermal conductivity tests What next. GLUING THE Silicon Pixel Detectors. Main problems to be studied: thermal contact mechanical stability with UV glue. TEST PROTOCOL (I). Thermal adhesive tests.

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Problems to be studied Test protocol Thermal conductivity tests What next

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  1. STATUS OF GLUING AT 04.02.2003 Problems to be studied Test protocol Thermal conductivity tests What next

  2. GLUING THE Silicon Pixel Detectors • Main problems to be studied: • thermal contact • mechanical stability with UV glue

  3. TEST PROTOCOL (I) Thermal adhesive tests • a) thermal conductivity measurements • measurements for about 0.1 mm adhesive thickness •  reduction of candidates to 2-3 • b) complete gluing tests • spreading the thermal adhesive on windowed kapton-glass samples fixed with UV glue above the cooling tube •  glue spreading procedure tests • c) thermal contact reliability tests w.r.t. thermal cycles • test of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedure(s) •  best candidate(s) selection and definition of gluing procedure • d) irradiation tests with best candidate(s) • thermal contact reliability test of best candidate(s) after irradiation •  final selection of thermal adhesive

  4. TEST PROTOCOL (II) Mechanical assembly with UV glue • a) UV gluing tests • - test the gluing strength with kapton-glass samples to be glued on CFSS • - tests of ungluing - tests of clip mounting  UV glue quantity and curing time • b) irradiation tests • - test the UV gluing strength before and after irradiation

  5. LIST OF THERMAL CONDUCTIVE ADHESIVES

  6. THERMAL CONDUCTIVITY TESTS (I) Let be: DISC 1 at T1 DISC 2 at T2 R dissipating a power W x the thickness of the glue A the area of the glue W = k A (T1 -T2) / x k = x W / (T1 - T2)A INSULATOR R ° D1 GLUE ° D2 PT100 FAN T from R(PT100) and tables (0.387 W / K)

  7. THERMAL CONDUCTIVITY TESTS (II) PRELIMINARY RESULTS ( in brakets the ATLAS measurements ) expectedDT/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm2 thermal contact window

  8. WHAT NEXT More electronics and mechanics for tests

  9. WHAT NEXT: PLANNING • a) thermal conductivity measurements • - first measurements: done • - new setup for more precise measurements: ready • b) complete gluing tests • - production of kapton-glass samples with windows: to be realized • - XY movement for dispenser: to be fixed • c) thermal contact reliability tests w.r.t. thermal cycles • - mechanical setup and heaters defined, to be realized • d) UV gluing tests • - production of kapton-glass samples to be glued on CFSS: to be realized - clips: ready to be glued • e) irradiation tests with best candidate(s) • - setup for both thermal adhesive and UV glue: to be defined

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